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IST Project 1999-11433 MAGIC_FEAT
Meshing and Global Integration for Semiconductor Front-End Simulation
Second Public Workshop, February 12, 2003, Fraunhofer IISB, Erlangen
Abstract of the Workshop (Result R1/3)
Workshop Flyer
Presentations
Overview of the MAGIC_FEAT Project
J. Lorenz, Fraunhofer IISB
Industrial Requirements and Benchmark Specifications for 3D TCAD
T. Schwartzmann, ST Microelectronics
Applications of 3D Structure Generation and Surface Meshing Tools
E. Baer, Fraunhofer IISB
Requirements and Results on 3D Volume Meshing
P.L. George, INRIA
Comparison and Integration of 3D Meshing Tools
J. Krause, ETH Zurich
MAGIC_FEAT Industrial Benchmarks
T. Schwartzmann, ST Microelectronics
Examples for 3D Problems and Results in Process and Device Simulation
A. Burenkov, Fraunhofer IISB
Overview of Related European Projects on
TCAD Specifications and Research:
UPPER+, FRENDTECH, and MULSIC
J. Lorenz, Fraunhofer IISB
MAGIC_FEAT Commercialization Plans
S. Zelenka, ISE
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Contact point:
Fraunhofer IISB
Jürgen Lorenz
Schottkystrasse 10
91058 Erlangen
Germany
Tel +49 (9131) 761-210
Fax +49 (9131) 761-212
Partners:
FhG-IISB (Coordinator) - Germany
ETH Zurich - Switzerland
INRIA - France
ISE-AG - Switzerland
ST Microelectronics - France
TU Vienna - Austria
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© 2003
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