Technology Simulation

Doping

Topography

Lithography
   
Doping

We investigate diffusion processes, as encountered in semiconductor technology, both theoretically and experimentally. Our aim is to improve process characterization and optimization by simulation. We develop models and determine the parameters required for process simulation. Our research activities include the investigation of diffusion in multilayer structures, of the electrical activation of dopant atoms, measurements of vacancy concentrations in silicon wafers using platinum diffusion and DLTS, and theoretical work on diffusion mechanisms.

We work on the development and application of simulation programs that predict dopant concentrations resulting from implantation steps. Furthermore, we simulate electrical properties of devices: We can calculate how modifications in the technology procedure affect device behavior and how to optimize processes. As we can rely on our comprehensive experience with the application of such simulators, we are able to tackle your problems and questions effectively.

Product Sheet Doping Simulation
IST Project FRENDTECH "Front-End Models for Silicon Future Technology" (completed)
IST Project ATOMICS "Advanced Front-End Technology Modeling for Ultimate Integrated Circuits"
Alternative Source/Drain Contact Pad Architectures for Contact Resistance Improvement in Decanano-Scaled Devices
Pre-Silicon SPICE Modeling of Nano-Scaled SOI MOSFETs

Contact:
Dr. Peter Pichler
Tel.: 09131 / 761-227
Fax: 09131 / 761-212

 

Topography

We work on the development and application of simulation programs for topography steps (etching, deposition, chemical-mechanical polishing) as used in semiconductor technology. This includes physical and chemical modeling on device scale as well as on equipment scale (e.g. deposition furnaces, etch reactors). We integrate our software tools with other process simulation programs as well as with tools for electrical simulation.

Presentation Topography Simulation
Product Sheet Topography Simulation
Publications
Simulation of sputter etching
EU-Projekt MD3 (Material Development for Double exposure and Double patterning)

Contact:
Dr. Eberhard Bär
Tel.: 09131 / 761-217
Fax: 09131 / 761-212

 

Lithography

The lithography group develops physical/chemical models, numerical algorithms, and software for the simulation of lithographic processes. The developed software algorithms cover the process steps pre-bake, exposure, post-exposure bake, and chemical development of the photoresist. The lithography simulation algorithms developed are available in the software Dr.LiTHO of Fraunhofer IISB. Additional modules of Dr.LiTHO are used for the evaluation and optimization of lithographic processes and for the simulation of non-standard lithographic exposures such as interferometric exposures. Besides from model and software development, the lithography group offers also support for industrial and governmental partners in process development and feasibility studies.

Current research and development activities of the lithography group include:
  • Rigorous simulation of light diffraction from advanced masks, including defect-free and defective EUV-masks.
  • Modeling of modern chemical amplified resists, including model calibration by local and global optimizers.
  • Evaluation and optimization of lithographic imaging, mask and source optimization using genetic algorithms.
Product Sheet Lithography Simulation, Dr.LiTHO
Further information about our activities
EU-Projekt MD3 (Material Development for Double exposure and Double patterning)

Contact:
Dr. Andreas Erdmann
Tel.: 09131 / 761-258
Fax: 09131 / 761-212



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Fraunhofer-Gesellschaft