In the department technology the new semiconductor technological materials, devices, processes, and methods for producing CMOS (CLSI, ULSI), nanoelectronics, and power electronics are developed. Therefore, complete process lines for silicon and silicon carbide are available. In particular, the activities and competences include, inter alia, surface and thin-film technology for new materials, processes for thin dielectric and metallic layers, ion implantation, circuit modifications and IC repair, nanostructuring, particle electronics, metrology and analytics as well as the development of passive devices.