Fraunhofer Institute for Integrated Systems and Device Technology
To us, technology means research but also services for the development of electron devices on all sizing scales. From nanoelectronics to printed macroelectronics we are cooperation partner for the realization and characterization of individual processes, devices and facilities. With extensive clean room pilot batch production the silicon and silicon carbide thin film technology form the backbone. Examples for current activities are the high-resolution electrical characterization of advanced dielectric layers, the development of custom-made ion implantation techniques, advanced integrable power devices, printing processes for inorganic functional materials or the preparation of nanostructures by focussed ion beam techniques. Growing attention is paid towards the heterogeneous integration of various electronic technologies.