Analytics and Metrology

Fraunhofer Institute for Integrated Systems and Device Technology

Analytics and Metrology

A variety of physical analysis techniques such as SEM, TEM, EDX, XPS, SNMS, SPM (AFM topography, SSRM, SCM, c-AFM, TUNA) and all relevant electrical measurement techniques are available for characterizing single layers, layer systems and electron devices. Furthermore, circuit modification by means of focused ion beams (FIB)can be performed, e. g. allowing a malfunctioning circuit to be redesigned. Charge carrier lifetime and diffusion length methods (Elymat, µ-PCD, SPV) as well as DLTS systems enable the control and identification of electrically active contamination. Nanopatterning can be performed by FIB and UV-NIL (UV-Nanoimprint Lithography) systems.