With his poster titled "Experimental Validation of FE Combined Lifetime Modeling for Power Cycling Capability of a SiC Power Module", Dawei won the CIPS 2026 Best Poster Award, handed over by Prof. Dr. Regine Mallwitz, holder of the Chair of Power Electronics at the Technische Universität Braunschweig. 

By validating the lifetime prediction of the packaging techniques used in silicon carbide-based power modules, Dawei made a significant contribution to the transfer of test and reliability procedures from outdated to state-of-the-art power electronics. 

The research conducted by Dawei and his colleagues addresses a topic that is currently really hot in the power module community.