Publications Archive

I. Abid, R. Kabouche, F. Medjdoub, S. Besendörfer, E. Meissner, J. Derluyn, S. Degroote, M. Germain, H. Miyake:

Remarkable Breakdown Voltage on AlN/AlGaN/AlN double heterostructure

Proceedings of the International Symposium on Power Semiconductor Devices and Ics, Vol 2020, Art. No. 9170170, Vienna, Austria, September 13, 2020 - September 18, 2020 (Institute of Electrical and Electronics Engineers Inc. (IEEE), Piscataway Township, 2020) pp. 310-312
ISBN: 978-172814836-6
ISSN: 10636854
DOI: 10.1109/ISPSD46842.2020.9170170

M. Albrecht, F. J. Klüpfel, T. Erlbacher:

An Iterative Surface Potential Algorithm including Interface Traps for Compact Modeling of SiC-MOSFETs

IEEE Transactions on Electron Devices, Vol 67 (3), Art. No. 8982172 (Institute of Electrical and Electronics Engineers Inc. (IEEE), Piscataway Township, 2020) pp. 855-862
ISSN: 189383
DOI: 10.1109/TED.2020.2967507

M. Albrecht, D. Pérez, R. C. Martens, A. J. Bauer, T. Erlbacher:

Impact of channel implantation on a 4H-SiC CMOS operational amplifier for high temperature applications

Materials Science Forum, Vol 1004 (Proceedings of 18th International Conference on Silicon Carbide and Related Materials, ICSCRM 2019), Kyoto, Japan, September 29, 2019 - October 04, 2019 (Trans Tech Publications Ltd., Bäch SZ, 2020) pp. 1123-1128
ISBN: 978-303571579-8
ISSN: 2555476
DOI: 10.4028/www.scientific.net/MSF.1004.1123

M. Angerer, R. Schwanninger, M. März:

Active common-mode filter for capacitive-coupled isolated signaling

Electronics Letters, Vol 56 (2) (Institution of Engineering and Technology (IET), London, 2020) pp. 73-76
DOI: 10.1049/el.2019.2994

C. F. Bayer, S. Wagner:

Robust converters for renewable energy plants

Mikroelektronik Nachrichten (80), 2020 (Fraunhofer-Verbund Mikroelektronik, Berlin, 2020) p. 10
DOI: urn:nbn:de:0011-n-6143946

C. F. Bayer:

Robuster Umrichter für Erneuerbare Energien

Mikroelektronik Nachrichten (80), 2020 (Fraunhofer-Verbund Mikroelektronik, Berlin, 2020) p. 12
DOI: urn:nbn:de:0011-n-6023746

B. Bayer, M. Groccia, H. L. Bach, C. F. Bayer, A. Schletz, C. Lenz, S. Ziesche:

LTCC Embedding of SiC Power Devices for High Temperature Applications over 400 °C

Proceedings - 2020 IEEE 8th Electronics System-Integration Technology Conference, ESTC 2020, Art. No. 9229859, Tønsberg, Norway, September 15, 2020 - September 18, 2020 (Institute of Electrical and Electronics Engineers Inc. (IEEE), Piscataway Township, 2020) p. 5
ISBN: 978-172816292-8
DOI: 10.1109/ESTC48849.2020.9229859

I. Bejenari, A. Burenkov, P. Pichler, I. Deretzis, A. La Magna:

Molecular dynamics modeling of the radial heat transfer from silicon nanowires

International Conference on Simulation of Semiconductor Processes and Devices, SISPAD, Art. No. 9241646, Kobe, Japan, September 03, 2020 - October 06, 2020 (Institute of Electrical and Electronics Engineers Inc. (IEEE), Piscataway Township, 2020) pp. 67-70
ISBN: 978-486348763-5
DOI: 10.23919/SISPAD49475.2020.9241646

S. Besendörfer, E. Meissner, T. Zweipfennig, H. Yacoub, D. Fahle, H. Behmenburg, H. Kalisch, A. Vescan, J. Friedrich, T. Erlbacher:

Interplay between C-doping, threading dislocations, breakdown, and leakage in GaN on Si HEMT structures

AIP Advances, Vol 10 (4), Art. No. 45028 (American Institute of Physics Inc. (AIP Publishing), Melville, 2020)
ISSN: 21583226
DOI: 10.1063/1.5141905

S. Besendörfer, E. Meissner, A. Tajalli, M. Meneghini, J. A. Jr. Freitas, J. Derluyn, F. Medjdoub, G. Meneghesso, J. Friedrich, T. Erlbacher:

Vertical breakdown of GaN on Si due to V-pits

Journal of Applied Physics, Vol 127 (1), Art. No. 15701 (American Institute of Physics Inc. (AIP Publishing), Melville, 2020)
ISSN: 218979
DOI: 10.1063/1.5129248

S. Besendörfer, E. Meissner, F. Medjdoub, J. Derluyn, J. Friedrich, T. Erlbacher:

The impact of dislocations on AlGaN/GaN Schottky diodes and on gate failure of high electron mobility transistors

Scientific Reports, Vol 10 (1), Art. No. 17252 (Springer Nature, Berlin, 2020)
ISSN: 20452322
DOI: 10.1038/s41598-020-73977-2

K. Dadzis, R. Menzel, U. Juda, K. Irmscher, C. Kranert, M. Müller, M. Ehrl, R. Weingärtner, C. Reimann, N. Abrosimov, H. Riemann:

Characterization of Silicon Crystals Grown from Melt in a Granulate Crucible

Journal of Electronic Materials, Vol 49 (9) (Springer Nature, Berlin, 2020) pp. 5120-5132
ISSN: 3615235
DOI: 10.1007/s11664-020-08309-1

L. Di Benedetto, G. D. Licciardo, T. Erlbacher, A. J. Bauer, A. Rubino:

A 4H-SiC UV Phototransistor with Excellent Optical Gain Based on Controlled Potential Barrier

IEEE Transactions on Electron Devices, Vol 67 (1), Art. No. 8913626 (Institute of Electrical and Electronics Engineers Inc. (IEEE), Piscataway Township, 2020) pp. 154-159
ISSN: 189383
DOI: 10.1109/TED.2019.2950986

H. Du, S. A. Letz, N. Baker, T. Götz, F. Iannuzzo, A. Schletz:

Effect of short-circuit degradation on the remaining useful lifetime of SiC MOSFETs and its failure analysis

Microelectronics Reliability, Vol 114, Art. No. 113784 (Elsevier, Amsterdam, 2020)
ISSN: 262714
DOI: 10.1016/j.microrel.2020.113784

A. Erdmann, H. S. Mesilhy, P. Evanschitzky, V. Philipsen, F. J. Timmermans, M. Bauer:

Perspectives and tradeoffs of absorber materials for high NA EUV lithography

Journal of Micro/ Nanolithography, MEMS, and MOEMS, Vol 19 (4), Art. No. 41001 (Society of Photo-Optical Instrumentation Engineers (SPIE), Bellingham, 2020)
ISSN: 19325150
DOI: 10.1117/1.JMM.19.4.041001

T. Erlbacher, M. Kocher, H. Schlichtig, J. Weiße, A. J. Bauer:

Influence of Aluminum Compensation Effects in 4H-SiC on the Performance of VDMOS Transistors

Materials Science Forum, Vol 1004 (Proceedings of 18th International Conference on Silicon Carbide and Related Materials, ICSCRM 2019), Kyoto, Japan, September 29, 2019 - October 04, 2029 (Trans Tech Publications Ltd., Bäch SZ, 2020) pp. 843-849
DOI: 10.4028/www.scientific.net/MSF.1004.843

T. Erlbacher, T. Śledziewski:

SiC MOSFET with a Self-Aligned Channel Defined by Shallow Source-JFET Implantation: A Simulation Study

Materials Science Forum, Vol 1004 (Proceedings of 18th International Conference on Silicon Carbide and Related Materials, ICSCRM 2019), Kyoto, Japan, September 29, 2019 - October 04, 2019 (Trans Tech Publications Ltd., Bäch SZ, 2020) pp. 850-855
DOI: 10.4028/www.scientific.net/MSF.1004.850

S. Faraji, E. Meissner, R. Weingärtner, S. Besendörfer, J. Friedrich:

In-situ preparation of gan sacrificial layers on sapphire substrate in movpe reactor for self-separation of the overgrown gan crystal

Crystals, Vol10 (12), Art. No. 1100 (Multidisciplinary Digital Publishing Institute (MDPI), Basel, 2020) pp. 1-11
ISSN: 20734352
DOI: 10.3390/cryst10121100

J. Friedrich, G. Müller:

Erlangen—An Important Center of Crystal Growth and Epitaxy: Major Scientific Results and Technological Solutions of the Last Four Decades

Crystal Research and Technology, Vol 55 (2), Art. No. 1900053 (Wiley-VCH Verlag, Hoboken, 2020)
ISSN: 2321300
DOI: 10.1002/crat.201900053

M. Gepp, V. R. H. Lorentz, M. März, F. Geffray, E. Guyon, F. Chopard:

Spatial and Temporal Temperature Homogenization in an Automotive Lithium-Ion Pouch Cell Battery Module

ELECTRIMACS 2019, Lecture Notes in electrical Engineering, Vol 604 LNEE (Proceedings of 1st European Advances in Digital Transformation Conference, EADTC 2018 and the 2nd European Advances in Digital Transformation Conference, EADTC 2019), Salerno, Italy, April 04, 2019 (Springer Nature, Berlin, 2020) pp. 625-639
ISBN: 978-303037160-9
ISSN: 18761100
DOI: 10.1007/978-3-030-37161-6_47

M. Gerwig, A. S. Ali, D. Neubert, S. Polster, U. Böhme, G. Franze, M. Rosenkranz, A. Popov, I. Ponomarev, M. P. M. Jank, C. Viehweger, E. Brendler, L. Frey, P. Kroll, E. Kroke:

From Cyclopentasilane to Thin-Film Transistors

Advanced Electronic Materials (Wiley-VCH Verlag, Hoboken, 2020)
ISSN: 2199160X
DOI: 10.1002/aelm.202000422

A. Hauke, S. Oertel, L. Knoke, V. Fein, C. Maier, F. Brinkmann, M. P. M. Jank:

Screen-Printed Sensor for Low-Cost Chloride Analysis in Sweat for Rapid Diagnosis and Monitoring of Cystic Fibrosis

Biosensors, Vol 10 (9), Art. No. 123 (Multidisciplinary Digital Publishing Institute (MDPI), Basel, 2020) p. 8
ISSN: 20796374
DOI: 10.3390/bios10090123

C. Hellinger, O. Rusch, M. Rommel, A. J. Bauer, T. Erlbacher:

Low-resistance ohmic contact formation by laser annealing of n-implanted 4H-SiC

Materials Science Forum, Vol 1004 (Proceedings of 18th International Conference on Silicon Carbide and Related Materials, ICSCRM 2019), Kyoto, Japan, September 29, 2019 - October 04, 2019 (Trans Tech Publications Ltd., Bäch SZ, 2020) pp. 850-855
ISBN: 978-303571579-9
ISSN: 2555476
DOI: 10.4028/www.scientific.net/MSF.1004.718

S. Hessler, S. Knopf, M. Rommel, M. Girschofsky, B. Schmauss, R. Hellmann:

Advancing the sensitivity of integrated epoxy-based Bragg grating refractometry by high-index nanolayers

Optical Letters, Vol 45 (19) (OSA - The Optical Society, Washington D.C., 2020) pp. 5510-5513
ISSN: 1469592
DOI: 10.1364/OL.402768

A. Hirsch, M. Trempa, I. Kupka, L. Schmidtner, C. Kranert, C. Reimann, J. Friedrich:

Investigation of gas bubble growth in fused silica crucibles for silicon Czochralski crystal growth

Journal of Crystal Growth, Vol 533, Art. No. 125470 (Elsevier, Amsterdam, 2020)
ISSN: 220248
DOI: 10.1016/j.jcrysgro.2019.125470

T. Hutsch, R. W. Doncker, A. Neumann, T. Zetterer, G. Mitic, K. Kriegel, A. Burghardt, A. Sewergin, M. Rittner, F. B. Simon:

Highly Integrated Switching Cell Design based on Copper Diamond Heat Spreader, 3D Printed Heat Sink and HTCC Logic Board

CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems. Proceedings, Berlin, Germany, March 24, 2020 - March 26, 2020 (VDE Verlag, Berlin, 2020) pp. 397-402
ISBN: 978-3-8007-5225-6; 978-3-8007-5226-3; 3-8007-5225-5

A. Hutzler, B. Fritsch, C. D. Matthus, M. P. M. Jank, M. Rommel:

Highly accurate determination of heterogeneously stacked Van-der-Waals materials by optical microspectroscopy

Scientific Reports, Vol 10 (1), Art. No. 13676 (Springer Nature, Berlin, 2020)
ISSN: 20452322
DOI: 10.1038/s41598-020-70580-3

M. Kocher, H. Schlichting, B. Kallinger, M. Rommel, A. J. Bauer, T. Erlbacher:

Influence of shallow pits and device design of 4H-SiC VDMOS transistors on in-line defect analysis by photoluminescence and differential interference contrast mapping

Materials Science Forum, Vol 1004 (Proceedings of 18th International Conference on Silicon Carbide and Related Materials, ICSCRM 2019), Kyoto, Japan, September 29, 2019 - October 04, 2019 (Trans Tech Publications Ltd., Bäch SZ, 2020) pp. 299-305
ISBN: 978-303571579-8
ISSN: 2555476
DOI: 10.4028/www.scientific.net/MSF.1004.299

C. Lange, A. Rueß, A. Nuß, R. Öchsner, M. März:

Dimensioning battery energy storage systems for peak shaving based on a real-time control algorithm

Applied Energy, Vol 280, Art. No. 115993, December 15, 2020 (Elsevier, Amsterdam, 2020)
ISSN: 3062619
DOI: 10.1016/j.apenergy.2020.115993

C. Lenz, S. Ziesche, A. Schletz, H. L. Bach, T. Erlbacher:

Real embedding process of SiC devices in a monolithic ceramic package using LTCC technology

Proceedings - 2020 IEEE 8th Electronics System-Integration Technology Conference, ESTC 2020, Art. No. 9229653, Tønsberg, Norway, September 15, 2020 - September 18, 2020 (Institute of Electrical and Electronics Engineers Inc. (IEEE), Piscataway Township, 2020) p. 5
ISBN: 978-172816292-8
DOI: 10.1109/ESTC48849.2020.9229653

M. Lim, T. Śledziewski, M. Rommel, T. Erlbacher, H. K. Kim, S. J. Kim, H. K. Shin, A. J. Bauer:

Pre-deposition interfacial oxidation and post-deposition interface nitridation of LPCVD TEOS used as gate dielectric on 4H-SiC

Materials Science Forum, Vol 1004 (Proceedings of 18th International Conference on Silicon Carbide and Related Materials, ICSCRM 2019), Kyoto, Japan, September 29, 2019 - October 04, 2019 (Trans Tech Publications Ltd., Bäch SZ, 2020) pp. 535-540
ISBN: 978-303571579-8
ISSN: 2555476
DOI: 10.4028/www.scientific.net/MSF.1004.156

M. Lim, A. J. Bauer, M. Rommel, T. Erlbacher, H. Shin, H. Kim, S. Kim, T. Śledziewski:

Pre-Deposition Interfacial Oxidation and Post-Deposition Interface Nitridation of LPCVD TEOS Used as Gate Dielectric on 4H-SiC

Materials Science Forum, Vol 1004 (Proceedings of 18th International Conference on Silicon Carbide and Related Materials, ICSCRM 2019), Kyoto, Japan, September 29, 2019 - October 04, 2019 (Trans Tech Publications Ltd., Bäch SZ, 2020) pp. 535-540
DOI:  10.4028/www.scientific.net/MSF.1004.535

S. Liu, X. Cheng, L. Zheng, T. Śledziewski, T. Erlbacher, L. Sheng, Y. Yu:

Impact of the transition region between active area and edge termination on electrical performance of SiC MOSFET

Solid-State Electronics, Vol 171, Art. No. 107873 (Elsevier, Amsterdam, 2020)
ISSN: 381101
DOI: 10.1016/j.sse.2020.107873

G. Lukin, E. Meissner, J. Friedrich, F. Habel, G. Leibiger:

Stress evolution in thick GaN layers grown by HVPE

Journal of Crystal Growth, Vol 550, Art. No. 125887 (Elsevier, Amsterdam, 2020)
ISSN: 220248
DOI: 10.1016/j.jcrysgro.2020.125887

P. J. Martínez, S. A. Letz, E. Maset, D. Zhao:

Failure analysis of normally-off GaN HEMTs under avalanche conditions

Semiconductor Science and Technology, Vol 35 (3), Art. No. 35007 (Institute of Physics Publishing (IOP), Bristol, 2020)
ISSN: 2681242
DOI: 10.1088/1361-6641/ab6bad

M. März, Z. Yu, S. A. Letz, D. Zhao, A. Schletz:

Combined experimental and numerical approach for investigating the mechanical degradation of the interface between thin film metallization and Si-substrate after temperature cycling test

ESREF 2020, the 31st European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Art. No. 113785, Virtual, Online, October 05, 2020 - October 08, 2020 (Elsevier, Amsterdam, 2020)
ISSN: 0026-2714
DOI:  10.1016/j.microrel.2020.113785

M. März, S. Letz, D. Zhao, A. Schletz:

A Method for the Characterization of Adhesion Strength Degradation of Thin Films on Si-Substrate under Thermal Cycling Test

CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems. Proceedings, Berlin, Germany, March 24, 2020 - March 26, 2020 (VDE Verlag, Berlin, 2020) pp. 490-495
ISBN: 978-3-8007-5225-6; 978-3-8007-5226-3; 3-8007-5225-5

M. März, C. F. Bayer, M. Jank, Z. Yu, A. Zoerner, V. Zimmermann, A. Schletz:

Integration of Printed Electronics in Potted Power Electronic Modules

CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems. Proceedings, Berlin, Germany, March 24, 2020 - March 26, 2020 (VDE Verlag, Berlin, 2020) pp. 137-141
ISBN: 978-3-8007-5225-6; 978-3-8007-5226-3; 3-8007-5225-5

M. März, A. Klische, A. Diepgen, T. Heckel, A. Apelsmeier, M. Schiedermeyer, C. Rettner, D. Dirksen:

SiC Power Module with integrated RC-Snubber Design for Voltage Overshoot and Power Loss Reduction

CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems. Proceedings, Berlin, Germany, March 24, 2020 - March 26, 2020 (VDE Verlag, Berlin, 2020) pp. 142-147
ISBN: 978-3-8007-5225-6; 978-3-8007-5226-3; 3-8007-5225-5

M. März, C. F. Bayer, Z. Yu, W. Zeng, A. Schletz:

Application of response surface methodology for optimization of Ag-Ag Direct Bonding for Wafer-Level Power Electronics Packaging

CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems. Proceedings, Berlin, Germany, March 24, 2020 - March 26, 2020 (VDE Verlag, Berlin, 2020)
ISBN: 978-3-8007-5225-6; 978-3-8007-5226-3; 3-8007-5225-5

T. Menrath, A. Rosskopf, F. B. Simon, M. Groccia, S. Schuster:

Shape Optimization of a Pin Fin Heat Sink

36th Annual Semiconductor Thermal Measurement, Modeling and Management Symposium, SEMI-THERM 2020 - Proceedings, Art. No. 9142830, San Jose, United States, March 16, 2020 - March 20, 2020 (Institute of Electrical and Electronics Engineers Inc. (IEEE), Piscataway Township, 2020) pp. 10-16
ISBN: 978-057843862-7
DOI: 10.23919/SEMI-THERM50369.2020.9142830

H. Mesilhy, P. Evanschitzky, G. Bottiglieri, E. van Setten, T. Fliervoet, A. Erdmann:

Pathfinding the perfect EUV mask: The role of the multilayer

Proceedings of SPIE - The International Society for Optical Engineering, Vol 11323 (Extreme Ultraviolet (EUV) Lithography XI 2020), Art. No. 1132316, San Jose, United States, February 24, 2020 - February 27, 2020 (Society of Photo-Optical Instrumentation Engineers (SPIE), Bellingham, 2020)
ISBN: 978-151063413-8
ISSN: 0277786X
DOI: 10.1117/12.2551870

M. L. Pourteau, A. Gharbi, P. Brianceau, J. A. Dallery, F. Laulagnet, G. Rademaker, R. Tiron, H. J. Engelmann, J. von Borany, K. H. Heinig, M. Rommel, L. Baier:

Sub-20 nm multilayer nanopillar patterning for hybrid SET/CMOS integration

Micro and Nano Engineering, Vol 9, Art. No. 100074 (Elsevier, Amsterdam, 2020)
ISSN: 25900072
DOI: 10.1016/j.mne.2020.100074

M. Rommel, Z. Xu, T. Liu, H. Wang, Y. Wang, F. Fang, Y. Song:

Depth Profiling of Ion-Implanted 4H-SiC Using Confocal Raman Spectroscopy

Crystals Vol 10 (2), Art. No. 131 (Multidisciplinary Digital Publishing Institute (MDPI), Basel, 2020)
ISSN: 2073-4352
DOI:  10.3390/cryst10020131

O. Rusch, C. Hellinger, J. Moult, Y. Corcoran, T. Erlbacher:

Reducing on-resistance for SiC diodes by thin wafer and laser anneal technology

Materials Science Forum, Vol 1004 (Proceedings of 18th International Conference on Silicon Carbide and Related Materials, ICSCRM 2019), Kyoto, Japan, September 29, 2019 - October 04, 2019 (Trans Tech Publications Ltd., Bäch SZ, 2020) pp. 155-160
ISBN: 978-303571579-8
ISSN: 2555476
DOI: 10.4028/www.scientific.net/MSF.1004.155

O. Rusch, C. Hellinger, J. Moult, Y. Corcoran, T. Erlbacher:

Reducing On-Resistance for SiC Diodes by Thin Wafer and Laser Anneal Technology

Materials Science Forum, Vol 1004 (Proceedings of 18th International Conference on Silicon Carbide and Related Materials, ICSCRM 2019), Kyoto, Japan, September 29, 2019 - October 04, 2019 (Trans Tech Publications Ltd., Bäch SZ, 2020) pp. 155-160
DOI:  10.4028/www.scientific.net/MSF.1004.155

S. Saponara, G. Ciarpi, T. Erlbacher, G. Rattmann:

Integrated Passive Devices and Switching Circuit Design for a 3D DC/DC Converter up to 60 V

Journal of Circuits, Systems and Computers, Art. No. 2050039 (World Scientific Publishing Co. Pte Ltd, Singapur, 2020)
ISSN: 2181266
DOI: 10.1142/S0218126620500395

M. Schellenberger, S. Anger, M. Pfeffer, V. Häublein, G. Roeder, A. J. Bauer:

Smart Platform for Rapid Prototyping: A First Solution Approach to Improve Time-to-Market and Process Control in Low-Volume Device Fabrication

ELECTRIMACS 2019, Lecture Notes in electrical Engineering, Vol 604 LNEE (Proceedings of 1st European Advances in Digital Transformation Conference, EADTC 2018 and the 2nd European Advances in Digital Transformation Conference, EADTC 2019), Salerno, Italy, April 04, 2019 (Springer Nature, Berlin, 2020) pp. 129-135
ISBN: 978-303048601-3
ISSN: 18761100
DOI: 10.1007/978-3-030-48602-0_12

M. Schellenberger, M. Pfeffer, V. Häublein, G. Roeder, A. Bauer, S. Anger:

Smart Platform for Rapid Prototyping: A First Solution Approach to Improve Time-to-Market and Process Control in Low-Volume Device Fabrication

Digital Transformation in Semiconductor Manufacturing : Proceedings of the 1st and 2nd European Advances in Digital Transformation Conference, EADTC 2018, Zittau, Germany and EADTC 2019, Milan, Italy (Springer Nature Switzerland AG, Cham, 2020) pp. 129-135
ISBN: 978-3-030-48601-3 (Print); 978-3-030-48602-0 (Online)
DOI: 10.1007/978-3-030-48602-0_12

A. Schletz, W. Grübl, M. Novak, J. Müller:

Selektives Ag-Sintern auf Organischer Leiterplatte

10. DVS/GMM-Fachtagung EBL (Elektronische Baugruppen und Leiterplatten) 2020, Fellbach, Germany, February 18, 2020 - February 19, 2020 (DVS Media GmbH, Düsseldorf, 2020) pp. 210-215
ISBN: 978-3-96144-075-7
ISBN: 3-96144-075-1
ISBN: 978-3-96144-089-4

T. Schneider, M. Förste, G. Lukin, P. Fischer, M. Barchuk, C. Schimpf, E. Niederschlag, O. Pätzold, D. Rafaja, M. Stelter:

Recent progress of high temperature vapor phase epitaxy for the growth of GaN layers – Controlled coalescence of nucleation layers

Journal of Crystal Growth, Vol 533, Art. No. 125465 (Elsevier, Amsterdam, 2020)
ISSN: 220248
DOI: 10.1016/j.jcrysgro.2019.125465

M. Schulz, N. Schleippmann, K. Gosses, B. Wunder, M. März:

Four Switch Buck/Boost Converter for DC Microgrid Applications

2020 22nd European Conference on Power Electronics and Applications, EPE 2020 ECCE Europe, Art. No. 9215754, Lyon, France, September 07, 2020 - September 11, 2020 (Institute of Electrical and Electronics Engineers Inc. (IEEE), Piscataway Township, 2020)
ISBN: 978-907581536-8
DOI: 10.23919/EPE20ECCEEurope43536.2020.9215754

M. Schulz, N. Schleippmann, K. Gosses, R. Chacon, B. Wunder:

Four switch buck/boost converter to handle bidirectional power flow in DC subgrids

PCIM Europe Conference Proceedings, Vol 1 (Proceedings of International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2020), Virtual, Online, June 07, 2020 - June 08, 2020 (Mesago PCIM, Frankfurt, 2020) pp. 1764-1771
ISBN: 978-380075245-4
ISSN: 21913358

A. Sciuto, I. Deretzis, G. Fisciardo, S. F. Lombardo, A. La Magna, M. G. Grimaldi, K. Huet, B. Lespinasse, A. Verstraete, B. Curvers, I. Bejenari, A. Burenkov, P. Pichler:

Advanced simulations on laser annealing: Explosive crystallization and phonon transport corrections

International Conference on Simulation of Semiconductor Processes and Devices, SISPAD, Art. No. 9241660, Kobe, Japan, September 03, 2020 - October 06, 2020 (Institute of Electrical and Electronics Engineers Inc. (IEEE), Piscataway Township, 2020) pp. 71-74
ISBN: 978-486348763-5
DOI: 10.23919/SISPAD49475.2020.9241660

T. Śledziewski, T. Erlbacher:

SiC mosfet with a self-aligned channel defined by shallow source-jfet implantation: A simulation study

Materials Science Forum, Vol 1004 (Proceedings of 18th International Conference on Silicon Carbide and Related Materials, ICSCRM 2019), Kyoto, Japan, September 29, 2019 - October 04, 2019 (Trans Tech Publications Ltd., Bäch SZ, 2020) pp. 850-855
ISBN: 978-303571579-8
ISSN: 2555476
DOI: 10.4028/www.scientific.net/MSF.1004.850

Y. Song, Z. Xu, R. Li, H. Wang, Y. Fan, M. Rommel, J. Liu, G. V. Astakhov, G. Hlawacek, B. Li, J. Xu, F. Fang:

Photoluminescence and Raman Spectroscopy Study on Color Centers of Helium Ion-Implanted 4H–SiC

Nanomanufacturing and Metrology, Vol 3 (3) (Springer Science and Business Media, Berlin, 2020) pp. 205-217
ISSN: 2520811X
DOI: 10.1007/s41871-020-00061-8

M. L. Stern, M. Schellenberger:

Fully convolutional networks for chip-wise defect detection employing photoluminescence images: Efficient quality control in LED manufacturing

Journal of Intelligent Manufacturing, Vol 32 (Springer Nature, Berlin, 2020) pp. 113-126
ISSN: 9565515
DOI: 10.1007/s10845-020-01563-4

T. Stolzke, S. Ehrlich, C. Joffe, M. März:

Comprehensive accuracy examination of electrical power loss measurements of inductive components for frequencies up to 1 MHz

Journal of Magnetism and Magnetic Materials, Vol 497, Art. No. 166022 (Elsevier, Amsterdam ?, 2020)
ISSN:  03048853
DOI: 10.1016/j.jmmm.2019.166022

F. Sturm, M. Trempa, S. Schwanke, K. Schuck, C. Kranert, C. Reimann, J. Friedrich:

Solid state diffusion of metallic impurities from crucible and coating materials into crystalline silicon ingots for PV application

Journal of Crystal Growth, Vol 540, Art. No. 125636 (Elsevier, Amsterdam, 2020)
ISSN: 220248
DOI: 10.1016/j.jcrysgro.2020.125636

A. Tajalli, M. Meneghini, S. Besendörfer, R. Kabouche, I. Abid, R. Püsche, J. Derluyn, S. Degroote, M. Germain, E. Meissner, E. Zanoni, F. Medjdoub, G. Meneghesso:

High breakdown voltage and low buffer trapping in superlattice gan-on-silicon heterostructures for high voltage applications

Materials, Vol 13 (19), Art. No. 2674 (Multidisciplinary Digital Publishing Institute (MDPI), Basel, 2020)
ISSN: 19961944
DOI: 10.3390/MA13194271

A. Tajalli, M. Borga, M. Meneghini, C. De Santi, D. Benazzi, S. Besendörfer, R. Püsche, J. Derluyn, S. Degroote, M. Germain, R. Kabouche, I. Abid, E. Meissner, E. Zanoni, F. Medjdoub, G. Meneghesso:

Vertical leakage in GaN-on-Si stacks investigated by a buffer decomposition experiment

Micromachines, Vol 11 (1), Art. No. 101 (Multidisciplinary Digital Publishing Institute (MDPI), Basel, 2020)
ISSN: 2072666X
DOI: 10.3390/mi11010101

M. Trempa, F. Sturm, C. Kranert, S. Schwanke, C. Reimann, J. Friedrich, C. Schenk:

Impact of different SiO₂ diffusion barrier layers on lifetime distribution in multi-crystalline silicon ingots

Journal of Crystal Growth, Vol 532, Art. No. 125378 (Elsevier, Amsterdam, 2020)
ISSN: 220248
DOI: 10.1016/j.jcrysgro.2019.125378

A. Verani, G. Fieramosca, A. Colicelli, R. Di Rienzo, R. Saletti, R. Roncella, R. Schwarz, V. R. H. Lorentz, F. Baronti:

FPGA Accelerator for Battery Management Systems in Safety-Critical Applications

Proceedings - 2020 2nd IEEE International Conference on Industrial Electronics for Sustainable Energy Systems, IESES 2020, Cagliari, Italy, September 01, 2020 - September 03, 2020 (Institute of Electrical and Electronics Engineers Inc. (IEEE), Piscataway Township, 2020)
ISBN: 978-172814017-9
DOI: 10.1109/IESES45645.2020.9210671

S. Waldhör, S. Bockrath, M. Wenger, R. Schwarz, V. R. H. Lorentz:

FoxBMS-free and open bms platform focused on functional safety and AI

PCIM Europe Conference Proceedings, Vol 1 (Proceedings of International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2020), Virtual, Online, June 07, 2020 - June 08, 2020 (Mesago PCIM, Frankfurt, 2020) pp. 605-610
ISBN: 978-380075245-4
ISSN: 21913358
DOI: urn:nbn:de:0011-n-5967898

J. Weiße, C. D. Matthus, H. Schlichting, H. Mitlehner, T. Erlbacher:

RESURF n-LDMOS Transistor for Advanced Integrated Circuits in 4H-SiC

IEEE Transactions on Electron Devices, Vol 67 (8), Art. No. 9132665 (Institute of Electrical and Electronics Engineers Inc. (IEEE), Piscataway Township, 2020) pp. 3278-3284
ISSN: 189383
DOI: 10.1109/TED.2020.3002730

T. Wicht, S. Müller, R. Weingärtner, B. Epelbaum, S. Besendörfer, U. Bläß, M. Weisser, T. Unruh, E. Meissner:

X-ray characterization of physical-vapor-transport-grown bulk AlN single crystals

Journal of Applied Crystallography, Vol 53 (International Union of Crystallography (IUCr), Chester, 2020) pp. 1080-1086
ISSN: 218898
DOI: 10.1107/S1600576720008961

M. Wu, D. Thakare, J. F. de Marneffe, P. Jaenen, L. Souriau, K. Opsomer, J. P. Soulié, A. Erdmann, H. Mesilhy, P. Naujok, M. Foltin, V. Soltwisch, Q. Saadeh, V. Philipsen:

Mask absorber for next generation EUV lithography

Proceedings of SPIE - The International Society for Optical Engineering, Vol 11517 (Extreme Ultraviolet (EUV) Lithography XI 2020), Art. No. 1151706 (Society of Photo-Optical Instrumentation Engineers (SPIE), Bellingham, 2020)
ISBN: 978-151063842-6
ISSN: 0277786X
DOI: 10.1117/12.2572114

Z. Xu, L. Lu, Z. He, D. Tian, A. Hartmeier, J. Zhang, X. Luo, M. Rommel, K. Nordlund, G. Zhang, F. Fang:

Nanocutting mechanism of 6H-SiC investigated by scanning electron microscope online observation and stress-assisted and ion implant-assisted approaches

International Journal of Advanced Manufacturing Technology, Vol 106 (9-10) (Springer Nature, Berlin, 2020) pp. 3896-3880
ISSN: 2683768
DOI: 10.1007/s00170-019-04886-6

Z. Yu, W. Zeng, D. Zhao, Z. Zhang, C. F. Bayer, A. Schletz, M. März:

Reliability of silver direct bonding in thermal cycling tests

Proceedings - 2020 IEEE 8th Electronics System-Integration Technology Conference, ESTC 2020, Art. No. 9229753, Tønsberg, Norway, September 15, 2020 - September 18, 2020 (Institute of Electrical and Electronics Engineers Inc. (IEEE), Piscataway Township, 2020) p. 6
ISBN: 978-172816292-8
DOI: 10.1109/ESTC48849.2020.9229753

S. Zeltner, B. Seliger, D. Haager, B. Eckardt, H. L. Bach, Z. Yu, S. Vater, C. F. Bayer, A. Schletz, H. Umeda, T. Morita:

Advantages and challenges of using SiC mosfets in a high power density insulated HV/LV DC/DC converter

PCIM Europe Conference Proceedings, Vol 1 (Proceedings of International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2020), Virtual, Online, June 07, 2020 - June 08, 2020 (Mesago PCIM, Frankfurt, 2020) pp. 1587-1592
ISBN: 978-380075245-4
ISSN: 21913358

J. Ahopelto, G. Ardila, L. Baldi, D. Belot, G. Fagas, S. De Gent, D. Demarchi, M. Fernandez-Bolaños, D. Holden, A. M. Ionescu, G. Meneghesso, A. Mocuta, M. Pfeffer, R. M. Popp, E. Sangiorgi, C. M. Sotomayor Torres:

Nano Electronics roadmap for Europe: From nanodevices and innovative materials to system integration

Solid-State Electronics, 155 (Elsevier Ltd, 2019) pp. 7-19
ISSN: 0038-1101
DOI: 10.1016/j.sse.2019.03.014

M. Albrecht, T. Erlbacher, A. J. Bauer, L. Frey:

Improving 5V digital 4H-SIC CMOS ics for operating at 400°C using PMOS channel implantation

Materials Science Forum, Vol 963 (Trans Tech Publications, 2019) pp. 827-831
DOI: 10.4028/www.scientific.net/MSF.963.827

E. Amat, A. Del Moral, J. Bausells, F. Perez-Murano, F. Klüpfel:

Quantum dot location relevance into SET-FET circuits based on FinFET devices

Proceedings of 33rd Conference on Design of Circuits and Integrated Systems, DCIS 2018, Art. No. 8681478, Lyon, France, November 14, 2018 - November 16, 2018 (IEEE, 2019)
ISBN: 978-1-7281-0171-2 / 978-1-7281-0172-9
ISSN: 2640-5563 / 2471-6170
DOI: 10.1109/DCIS.2018.8681478

E. Amat, F. J. Klüpfel, J. Bausells:

Influence of Quantum Dot Characteristics on the Performance of Hybrid SET-FET Circuits

IEEE Trans. Electron Devices, Vol 66 (10) (IEEE, 2019) pp. 4461-4467
DOI: 10.1109/TED.2019.2937141

M. Angerer, A. Amler, B. Ruccius, M. März:

Multi-tap bus communication for modular power converters with distributed isolation

Proceedings of International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management PCIM Europe, Nuremberg, Germany, Mai 07, 2019 - Mai 09, 2019 VDE - Verlag,
ISBN: 978-3-8007-4938-6

H. L. Bach, D. Dirksen, C. Blechinger, T. M. Endres, C. F. Bayer, A. Schletz, M. März:

Stackable SiC Embedded Ceramic Packages for High-Voltage and High-Temperature Power Electronics Applications

IMAPS Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT), Vol 2019 (HiTen), Oxford, UK, Juli 08, 2019 - Juli 10, 2019 (IMAPS, 2019) pp. 28-33
ISSN: 2380-4491
DOI: 10.4071/2380-4491.2019.HiTen.000028

H. L. Bach, D. Dirksen, C. Blechinger, T. M. Endres, C. F. Bayer, A. Schletz:

Stackable SiC Embedded Ceramic Packages for High-Voltage and High-Temperature Power Electronics Applications

Journal of Microelectronics and Electronic Packaging: October 2019, Vol 16, No. 4 (IMAPS, 2019) pp. 176-181

C. F. Bayer:

Fraunhofer IISB erforscht Korrosion

Mikroelektronik Nachrichten, Vol 74: März 2019 (Fraunhofer-Verbund Mikroelektronik, Berlin, 2019)

C. F. Bayer, U. Waltrich, A. Soueidan, R. Schneider, E. Bär, A. Schletz:

Enhancement of the partial discharge inception voltage of DBCs by adjusting the permittivity of the encapsulation

Proceedings of CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems, Nuremberg, Germany, März 08, 2016 - März 10, 2016 (VDE - Verlag, 2019)
ISBN: 978-3-8007-4171-7

C. F. Bayer, U. Waltrich, R. Schneider, E. Bär, A. Schletz:

Enhancing partial discharge inception voltage of DBCs by geometrical variations based on simulations of the electric field strength

Proceedings of CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems, Nuremberg, Germany, März 08, 2016 - März 10, 2016 (VDE - Verlag, 2019)
ISBN: 978-3-8007-4171-7

M. Beier, C. Reimann, J. Friedrich, U. A. Peuker, T. Leißner, M. Gröschel, V. Ischenko:

Silicon waste from the photovoltaic industry – A material source for the next generation battery technology?

Materials Science Forum, Vol 959 (Trans Tech Publications, 2019) pp. 107-112
DOI: 10.4028/www.scientific.net/MSF.959.107

S. Beljakova, P. Pichler, B. Kalkofen, R. Hübner:

Diffusion of Phosphorus and Boron from Atomic Layer Deposition Oxides into Silicon

Physica Status Solidi (A) Applications and Materials Science, 216 (17), Art. No. 1900306 (PSS, 2019)
ISSN: 1862-6300
DOI: 10.1002/pssa.201900306

C. Bentheimer, A. Ilsami, S. Mainusch, F. Hilpert, B. Eckardt, M. März:

Highly efficient SiC inverter for aircraft application with innovative thermal management

Proceedings of International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management PCIM Europe, Nuremberg, Germany, Mai 07, 2019 - Mai 09, 2019 VDE - Verlag,
ISBN: 978-3-8007-4938-6

S. Besendörfer, E. Meissner, A. Lesnik, J. Friedrich, A. Dadgar, T. Erlbacher:

Methodology for the investigation of threading dislocations as a source of vertical leakage in AlGaN/GaN-HEMT heterostructures for power devices

Journal of Applied Physics, Vol 125 (9), Art. No. 95704 (AIP Publishing, Melville, 2019)
ISSN: 0021-8979 / 1089-7550
DOI: 10.1063/1.5065442

J. Beyer, N. Schüler, J. Erlekampf, B. Kallinger, P. Berwian, K. Dornich, J. Heitmann:

Minority carrier lifetime measurements on 4H-SiC epiwafers by timeresolved photoluminescence and microwave detected photoconductivity

Materials Science Forum, Vol 963 (Trans Tech Publications, 2019) pp. 313-317
ISSN: 1662-9752
DOI: 10.4028/www.scientific.net/MSF.963.313

S. Bockrath, A. Rosskopf, S. Koffel, S. Waldhör, K. Srivastava, V. R. H. Lorentz:

State of Charge Estimation using Recurrent Neural Networks with Long Short-Term Memory for Lithium-Ion Batteries

IECON 2019, IEEE 45th Annual Conference of the Industrial Electronics Society, Lisbon, Portugal, Oktober 14, 2019 - Oktober 17, 2019 (IEEE, 2019)
DOI: 10.1109/IECON.2019.8926815

N. Boettcher, T. Heckel, T. Erlbacher, K. Peliac:

Silicon RC-Snubber for 900 v Applications Utilising non-Stoichiometric Silicon Nitride

Proceedings of the 31st International Symposium on Power Semiconductor Devices and ICs, ISPSD, Art. No. 8757589, Shanghai,China, Mai 19, 2019 - Mai 23, 2019 (IEEE, 2019) pp. 351-354
ISBN: 978-1-7281-0581-9 / 978-1-7281-0580-2
ISSN: 1946-0201 / 1063-6854
DOI: 10.1109/ISPSD.2019.8757589

A. R. Brown, L. Wang, P. Asenov, F. J. Klüpfel, B. Cheng, S. Martinie, O. Rozeau, S. Barraud, J. C. Barbe, C. Millar, J. K. Lorenz:

From devices to circuits: Modelling the performance of 5nm nanosheets

International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2019, Art. No. 8870357, Udine, Italy, September 04, 2019 - September 06, 2019 (IEEE, 2019)
ISBN: 978-1-7281-0940-4 /  978-1-7281-0941-1
ISSN: 1946-1577 / 1946-1569
DOI: 10.1109/SISPAD.2019.8870357

J. Buettner, T. Erlbacher, A. J. Bauer:

Technological advances towards 4H-SiC JBS diodes for wind power applications

Applications in Electronics Pervading Industry, Environment and Society. ApplePies 2018. Lecture Notes in Electrical Engineering, Vol 573 edited by S Sapponara, A De Gloria (Springer International Publishing, Cham, 2019) pp. 83-89
ISBN: 978-3-030-11972-0 (Print) / 978-3-030-11973-7 (Online)
DOI: 10.1007/978-3-030-11973-7_11

Y. C. Chen, P. S. Salter, M. Niethammer, M. Widmann, F. Kaiser, R. Nagy, N. Morioka, C. Babin, J. Erlekampf, P. Berwian, M. J. Booth, J. Wrachtrup:

Laser Writing of Scalable Single Color Centers in Silicon Carbide

Nano Letters, 19 (4) (cited 4 times) (ACS Publications, 2019) pp. 2377-2383
DOI: 10.1021/acs.nanolett.8b05070

L. Devaraj, G. Bottiglieri, A. Erdmann, F. Wählisch, M. Kupers, E. Van Setten, T. Fliervoet:

Lithographic effects due to particles on high-NA EUV mask pellicle

Proceedings of SPIE - The International Society for Optical Engineering, Vol 11177, 35th European Mask and Lithography Conference, EMLC, Art. No. 111770V, Dresden, Germany, Juni 17, 2019 - Juni 19, 2019 (Society of Photo-Optical Instrumentation Engineers (SPIE), Bellingham, 2019)
DOI: 10.1117/12.2534177

L. Di Benedetto, G. D. Licciardo, A. Huerner, T. Erlbacher, A. J. Bauer, A. Rubino:

First Experimental Test on Bipolar Mode Field Effect Transistor Prototype in 4H-SiC. A Proof of Concept

Materials Science Forum, Vol 963 / Silicon Carbide and Related Materials 2018 : Selected papers from the 12th European Conference on Silicon Carbide and Related Materials ECSCRM 2018, Birmingham, UK, September 02, 2018 - September 06, 2018 (Scientific.Net, 2019) pp. 697-700
DOI: 10.4028/www.scientific.net/MSF.963.697

L. Di Benedetto, C. D. Matthus, T. Erlbacher, A. J. Bauer, G. D. Licciardo, A. D. Rubino, L. Frey:

Performance of 4H-SIC bipolar diodes as temperature sensor at low temperatures

Materials Science Forum, Vol 963 (Trans Tech Publications, 2019) pp. 572-575
DOI: 10.4028/www.scientific.net/MSF.963.572

A. Diepgen, V. Zimmermann, C. F. Bayer, Y. Zhou, C. Forster, P. Wilbers, J. Leib, A. Schletz, S. Virtanen, M. März:

Parylene Coatings in Power Electronic Modules

ISAPP 2019 International Symposium on Advanced Power Packaging, Osaka, Japan, Oktober 07, 2019 - Oktober 08, 2019

S. Ehrlich, C. Joffe, H. Tielke, M. Leinfelder, M. März:

Comprehensive SPICE model for power inductor losses

Proceedings of IEEE Applied Power Electronics Conference and Exposition - APEC, Art. No. 8722180 (cited 1 time) (IEEE, 2019) pp. 1237-1244
ISBN:  978-1-5386-8330-9 / 978-1-5386-8331-6
ISSN: 2470-6647 / 1048-2334
DOI: 10.1109/APEC.2019.8722180

A. Endruschat, C. Novak, H. Gerstner, T. Heckel, C. Joffe, M. März:

A Universal SPICE Field-Effect Transistor Model Applied on SiC and GaN Transistors

IEEE Transactions on Power Electronics, Vol 34 (9), Art. No. 8586977 (IEEE, 2019) pp. 9131-9145
ISSN: 0885-8993 / 1941-0107
DOI: 10.1109/TPEL.2018.2889513

A. Erdmann, P. Evanschitzky, H. Meshily, V. Philipsen, E. Hendrickx, M. Bauer:

Attenuated phase shift mask for extreme ultraviolet: Can they mitigate three-dimensional mask effects?

Journal of Micro/ Nanolithography, MEMS, and MOEMS, Vol 18 (1), Art. No. 11005 (cited 4 times) (Society of Photo-Optical Instrumentation Engineers (SPIE), Bellingham, 2019)
DOI: 10.1117/1.JMM.18.1.011005

A. Erdmann, P. Evanschitzky, G. Bottiglieri, E. Van Setten, T. Fliervoet:

3D mask effects in high NA EUV imaging

Proceedings of SPIE - The International Society for Optical Engineering, Vol 10957,  Extreme Ultraviolet (EUV) Lithography X, Art. No. 109570Z (cited 1 time), San Jose, United States, Februar 25, 2019 - Februar 28, 2019 (Society of Photo-Optical Instrumentation Engineers (SPIE), Bellingham, 2019)
DOI: 10.1117/12.2515678

T. Erlbacher, G. Rattmann:

TSV-based passive networks for monolithic integration in smartpower ICS for automotive applications

Proceedings of 10. GMM Fachtagung "Automotive meets Electronics" 2019, Dortmund, Germany, März 12, 2019 - März 13, 2019 (VDE - Verlag, 2019)
ISBN: 978-3-8007-4877-8

J. Erlekampf, B. Kallinger, J. Weiße, M. Rommel, P. Berwian, J. Friedrich, T. Erlbacher:

Deeper insight into lifetime-engineering in 4H-SiC by ion implantation

Journal of Applied Physics, Vol 126 (4), Art. No. 45701 (AIP Publishing, Melville, 2019)
DOI: 10.1063/1.5092429

J. Friedrich, G. Müller:

Erlangen—An Important Center of Crystal Growth and Epitaxy: Major Scientific Results and Technological Solutions of the Last Four Decades

Crystal Research and Technology, Art. No. 1900053 (WILEY‐VCH Verlag, Weinheim, 2019)
DOI: 10.1002/crat.201900053

J. Friedrich, T. Jung, M. Trempa, C. Reimann, A. Denisov, A. Muehe:

Considerations on the limitations of the growth rate during pulling of silicon crystals by the Czochralski technique for PV applications

Journal of Crystal Growth, Vol 524, Art. No. 125168 edited by Thomas F. Kuech (Elsevier Ltd, Amsterdam, 2019)
ISSN: 0022-0248
DOI: 10.1016/j.jcrysgro.2019.125168

M. Gepp, V. R. H. Lorentz, M. März, F. Geffray, E. Guyon, F. Chopard:

Spatial and Temporal Temperature Homogenization in an Automotive Lithium-Ion Pouch Cell Battery Module

ELECTRIMACS 2019, Salerno, Italy, Mai 21, 2019 - Mai 23, 2019 (Springer International Publishing, Cham, 2019)

S. Grünler, G. Rattmann, T. Erlbacher, A. J. Bauer, F. Krach, L. Frey:

Towards highly integrated, automotive power SoCs using capacitors operating at 100 V implemented in TSV

Proceedings of CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems (cited 1 time), Nuremberg, Germany, März 08, 2016 - März 10, 2016 (VDE - Verlag, 2019)
ISBN: 978-3-8007-4171-7

V. Häublein, A. J. Bauer, H. Ryssel, L. Frey:

Mass Separation Issues for the Implantation of Doubly Charged Aluminum Ions

Proceedings of 22nd International Conference on Ion Implantation Technology IIT 2018, Würzburg, Germany, September 19, 2018 - September 24, 2018 edited by Volker Häublein, Heiner Ryssel (IEEE, 2019) pp. 291-294
ISBN: 978-1-5386-6828-4
DOI: 10.1109/IIT.2018.8807903

R. He, W. Heyn, F. Thiel, N. Pérez, C. Damm, B. Rellinghaus, C. Reimann, M. Beier, J. Friedrich, H. Zhu, Z. Ren, K. Nielsch, G. Schierning:

Thermoelectric properties of silicon and recycled silicon sawing waste

Journal of Materiomics, Vol 5 (1) edited by The Chinese Ceramic Society (Elsevier Ltd, 2019) pp. 15-33
ISSN: 2352-8478
DOI: 10.1016/j.jmat.2018.11.004

Y. Huang, J. Buettner, B. Lechner, G. Wachutka:

The impact of non-ideal ohmic contacts on the performance of high-voltage SIC MPS diodes

Materials Science Forum, Vol 963 (Trans Tech Publications, 2019) pp. 553-557
DOI: 10.4028/www.scientific.net/MSF.963.553

A. Hutzler, B. Fritsch, M. P. M. Jank, R. Branscheid, R. C. Martens, E. Spieker, M. März:

Nanoparticles: In Situ Liquid Cell TEM Studies on Etching and Growth Mechanisms of Gold Nanoparticles at a Solid–Liquid–Gas Interface

Advanced Materials Interfaces, Vol 6 (20) (WILEY‐VCH Verlag, Weinheim, 2019)
DOI: 10.1002/admi.201970126

A. Hutzler, B. Fritsch, M. P. M. Jank, R. Branscheid, R. C. Martens, E. Spiecker, M. März:

In Situ Liquid Cell TEM Studies on Etching and Growth Mechanisms of Gold Nanoparticles at a Solid–Liquid–Gas Interface

Advanced Materials Interfaces, Vol 6 (20), Art. No. 1901027 (WILEY‐VCH Verlag, Weinheim, 2019)
ISSN: 2196-7350
DOI: 10.1002/admi.201901027

A. Hutzler, C. D. Matthus, C. Dolle, M. Rommel, M. P. M. Jank, E. Spieker, L. Frey:

Large-Area Layer Counting of Two-Dimensional Materials Evaluating the Wavelength Shift in Visible-Reflectance Spectroscopy

Journal of Physical Chemistry C, Vol 123 (14) (cited 2 times) (ACS Publications, 2019) pp. 9192-9201
DOI: 10.1021/acs.jpcc.9b00957

A. Hutzler, B. Fritsch, M. P. M. Jank, R. Branscheid, E. Spieker, M. März:

Preparation of graphene-supported microwell liquid cells for in situ transmission electron microscopy

Journal of Visualized Experiments, 2019 (149), Art. No. e59751 (JoVE, 2019)
DOI: 10.3791/59751

F. Jach, P. Höhn, Y. Prots, M. Ruck:

Sr4N[CN2][C2N]: The First Carbodiimide Acetonitriletriide.

European Journal of Inorganic Chemistry: Humidity and Condensation in PE Systems - Degradation Mechanisms and Lifetime Modelling (WILEY‐VCH Verlag, Weinheim, 2019) pp. 1207-1211
ISSN: 1434-1948 / 1099-0682
DOI: 10.1002/ejic.201801242

S. Jung, S. Matlok, B. Eckardt, M. März:

Analysis of a mixed transfer function and state space implementation of cascade control

Proceedings of International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management PCIM Europe, Nuremberg, Germany, Mai 07, 2019 - Mai 09, 2019 (VDE - Verlag, 2019)
ISBN: 978-3-8007-4938-6

J. Kaiser, R. Weiß, J. Burk:

DC Microgrids for Commercial or Industrial Buildings

Bodo’s Power Systems April 2019 (Laboe, 2019) pp. 52-55
ISSN: 1863-5598

J. Kaiser, C. Strobl, H. Mann, H. Muhm, M. Klimpel, F. Schork, M. März:

Verbundprojekt „DC-Schutzorgane“ – Entwicklung eines neuen, integrierten Schutzkonzepts und neuer Schutzorgane für zukünftige Niederspannungs-Gleichstromnetze

VDE Albert-Keil-Kontaktseminar, Karlsruhe, Germany, Oktober 11, 2019 - Oktober 13, 2019

J. Kaiser, C. Strobl, H. Mann, H. Muhm, M. Klimpel, F. Schork, M. März:

A Comprehensive Approach for Safety in DC-Microgrids

The 3rd IEEE ICDCM (International Conference on DC Microgrids), Matsue, Japan, Mai 20, 2019 - Mai 23, 2019

J. Kaiser, F. Schork, K. Gosses, Y. Han, M. S. Schulz, L. Ott, B. Wunder, M. März:

Converter overvoltage protection for DC-Grids

Proceedings of INTELEC 2018, IEEE International Telecommunications Energy Conference, Art. No. 8612423, Torino, Italy, Oktober 07, 2018 - Oktober 11, 2018 (IEEE, 2019)
ISBN: 978-1-5386-5370-8 / 978-1-5386-5371-5
ISSN: 0275-0473 / 2158-5210
DOI: 10.1109/INTLEC.2018.8612423

B. Kallinger, J. Erlekampf, K. Rosshirt, P. Berwian, M. Stockmeier, M. Vogel, P. Hens, F. Wischmeyer:

Influence of substrate properties on the defectivity and minority carrier lifetime in 4H-SiC homoepitaxial layers

Materials Science Forum, Vol 963 (Trans Tech Publications, 2019) pp. 109-113
DOI: 10.4028/www.scientific.net/MSF.963.109

S. Kim, H. K. Kim, M. Lim, S. Jeong, M. J. Kang, M. S. Kang, N. S. Lee, T. V. Cuong, H. S. Kim, T. Erlbacher, A. J. Bauer, H. K. Shin:

Ohmic Contact Mechanism for Ni/C-faced 4H-n-SiC Substrate

Journal of Nanomaterials, Vol 2019, Art. No. 5231983 (Hindawi, London, 2019)
DOI: 10.1155/2019/5231983

H. K. Kim, S. Kim, J. Buettner, M. Lim, T. Erlbacher, A. J. Bauer, S. M. Koo, N. S. Lee, H. K. Shin:

Surface characterization of ion implanted 4H-SiC epitaxial layers with ion energy and concentration variations

Materials Science Forum, Vol 963 (Trans Tech Publications, 2019) pp. 429-432
ISBN: 978-3-0357-1332-9 / 978-3-0357-2332-8 / 978-3-0357-3332-7
DOI: 10.4028/www.scientific.net/MSF.963.429

F. J. Klüpfel:

A Compact Model Based on Bardeen's Transfer Hamiltonian Formalism for Silicon Single Electron Transistors

IEEE Access, Vol 7, Art. No. 8746224 (IEEE, 2019) pp. 84053-84065
ISSN: 2169-3536
DOI: 10.1109/ACCESS.2019.2924913

F. J. Klüpfel:

Influence of Sacrificial Layer Germanium Content on Stacked-Nanowire FET Performance

IEEE Access, Vol 7, Art. No. 8746119 (IEEE, 2019) pp. 85855-85859
ISSN: 2169-3536
DOI: 10.1109/ACCESS.2019.2925201

M. Knetzger, E. Meissner, C. Schröter, J. Friedrich:

Theoretical aspects and microstructural investigations on V-pit defects in HVPE grown GaN

Journal of Crystal Growth, Vol 518 edited by Thomas F. Kuech (Elsevier Ltd, Amsterdam, 2019) pp. 51-58
ISSN: 0022-0248
DOI: 10.1016/j.jcrysgro.2019.04.012

M. Kocher, M. Rommel, T. Śledziewski, V. Häublein, A. J. Bauer:

Dose Dependent Profile Deviation of Implanted Aluminum in 4H-SiC During High Temperature Annealing

Proceedings of 22nd International Conference on Ion Implantation Technology IIT 2018, Würzburg, Germany, September 17, 2018 - September 22, 2018 edited by Volker Häublein, Heiner Ryssel (IEEE, 2019) pp. 58-61
ISBN: 978-1-5386-6828-3
DOI: 10.1109/IIT.2018.8807904

M. Kocher, T. Erlbacher, M. Rommel, A. J. Bauer:

Decoration of al implantation profiles in 4H-SIC by bevel grinding and dry oxidation

Materials Science Forum, Vol 963 (Trans Tech Publications, 2019) pp. 441-444
DOI: 10.4028/www.scientific.net/MSF.963.441

M. Kocher, B. Yao, J. Weiße, M. Rommel, Z. W. Xu, T. Erlbacher, A. J. Bauer:

Determination of compensation ratios of al-implanted 4H-SIC by tcad modelling of TLM measurements

Materials Science Forum, Vol 963 (Trans Tech Publications, 2019) pp. 445-448
DOI: 10.4028/www.scientific.net/MSF.963.445

A. Köck, R. Wimmer-Teubenbacher, F. Rosada-Ludikovska, K. Rohracher, E. Wachmann, M. Herold, T. V. Welden, J. Min Kim, Z. Ali, A. Poenninger, M. Stahl-Offergeld, H. P. Hohe, J. Lorenz, T. Erlbacher, G. Dolmans, P. Offermans, M. Vandecasteele, O. Yurchenko, O. von Sicard, R. Pohle et al.:

3D-Integrated Multi-Sensor Demonstrator System for Environmental Monitoring

20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII, Art. No. 8808418, Berlin, Germany, Juni 23, 2019 - Juni 27, 2019 (IEEE, 2019) pp. 1136-1139
ISBN: 978-1-5386-8104-6 / 978-1-5386-8105-3
ISSN: 2167-0021 / 2167-0013
DOI: 10.1109/TRANSDUCERS.2019.8808418

F. Krach, T. Heckel, L. Frey, A. J. Bauer, T. Erlbacher, M. März:

Innovative monolithic RC-snubber for fast switching power modules

Proceedings of CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems (cited 5 times), Nuremberg, Germany, März 08, 2016 - März 10, 2016 (VDE - Verlag, 2019)
ISBN: 978-3-8007-4171-7

M. Kupers, G. Rispens, L. Devaraj, G. Bottiglieri, T. Van Den Hoogenhoff, P. Broman, A. Erdmann, F. Wahlisch:

Particle on EUV pellicles, impact on LWR

Proceedings of SPIE - The International Society for Optical Engineering, Vol 11147, International Conference on Extreme Ultraviolet Lithography 2019, EUVL, Art. No. 111470S, Monterey, United States, September 16, 2019 - September 19, 2019 (Society of Photo-Optical Instrumentation Engineers (SPIE), Bellingham, 2019)
DOI: 10.1117/12.2537103

T. Liu, Z. Xu, M. Rommel, F. Fang, H. Wang, Y. Song, Y. Wang:

Raman characterization of carrier concentrations of al-implanted 4H-SIC with low carrier concentration by photo-generated carrier effect

Crystals, Vol 9 (8), Art. No. 428 (MDPI, 2019)
DOI: 10.3390/cryst9080428

J. Lorenz, E. Bär, S. Barraud, A. R. Brown, P. Evanschitzky, F. Klüpfel, L. Wang:

Process variability - technological challenge and design issue for nanoscale devices

Micromachines 10, (1), Art. No. 6, Dezember 23, 2018 (MDPI, 2019)
DOI: 10.3390/mi10010006

H. Lösch, A. Hirsch, J. Holthausen, L. Peters, B. Xiao, S. Neumeier, M. Schmidt, N. Huittinen:

A spectroscopic investigation of Eu³⁺ incorporation in LnPO₄ (Ln = Tb, Gd_1-xLu_x, X = 0.3, 0.5, 0.7, 1) ceramics

Frontiers in Chemistry, 7 (FEB), Art. No. 94 edited by Nicholas J. Dacheux (Frontiers in Chemnistry, 2019)
DOI: 10.3389/fchem.2019.00094

G. Lukin, T. Schneider, M. Förste, M. Barchuk, M. Schimpf, C. Röder, F. Zimmermann, E. Niederschlag, O. Pätzold, F. C. Beyer, D. Rafaja, M. Stelter:

Heteroepitaxial growth of GaN on sapphire substrates by high temperature vapor phase epitaxy

Journal of Crystal Growth, Vol 524, Art. No. 125185 edited by Thomas F. Kuech (Elsevier Ltd, Amsterdam, 2019)
DOI: 10.1016/j.jcrysgro.2019.125185

S. Matlok, N. Böttcher, M. Jahn, P. Hörauf, T. Erlbacher, B. Eckardt, M. März:

Retrofitting Wide Band Gap Devices to classic Power Modules using Silicon RC Snubbers

Proceedings of International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management PCIM Europe, Nuremberg, Germany, Mai 07, 2019 - Mai 09, 2019 VDE - Verlag,
ISBN: 978-3-8007-4938-6

C. D. Matthus, L. Di Benedetto, M. Kocher, A. J. Bauer, G. D. Licciardo, A. Rubino, T. Erlbacher:

Feasibility of 4H-SiC p-i-n Diode for Sensitive Temperature Measurements between 20.5 K and 802 K

IEEE Sensors Journal, Vol 19 (8), Art. No. 8604048 (IEEE, 2019) pp. 2871-2878
ISSN: 1530-437X / 1558-1748
DOI: 10.1109/JSEN.2019.2891293

C. D. Matthus, A. J. Bauer, L. Frey, T. Erlbacher:

Wavelength-selective 4H-SiC UV-sensor array

Materials Science in Semiconductor Processing, Vol 90 (cited 2 times) (Elsevier Ltd, 2019) pp. 205-211
ISSN: 1369-8001
DOI: 10.1016/j.mssp.2018.10.019

C. D. Matthus, A. J. Bauer, H. Ryssel, L. Frey:

Comparative Study of 4H-SiC UV-Sensors with Ion Implanted and Epitaxially Grown p-Emitter

Proceedings of 22nd International Conference on Ion Implantation Technology IIT 2018, Würzburg, Germany, September 16, 2018 - September 21, 2018 edited by Volker Häublein, Heiner Ryssel (IEEE, 2019) pp. 110-113
ISBN: 978-1-5386-6828-3
DOI: 10.1109/IIT.2018.8807950

C. Medina-Bailon, T. Dutta, F. J. Klüpfel, S. Baurraud, V. Geoprgiev, J. Lorenz, A. Asenov:

Scaling-aware TCAD Parameter Extraction Methodology for Mobility Prediction in Tri-gate Nanowire Transistors

Proceedings of 2019 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2019), Art. No. 8870556, Udine, Italy, September 04, 2019 - September 06, 2019 (IEEE, 2019) p. 275
DOI: 10.1109/SISPAD.2019.8870556

R. Morello, R. Schwarz, E. R. G. Hoedemaekers, F. Habenschaden, R. DI Rienzo, R. Roncella, R. Saletti, B. Rosca, T. Steffenhagen, V. R. H. Lorentz, F. Baronti:

Implementation and Test of a 48 v Smart Battery System with Integrated DC/DC Converter

28th IEEE International Symposium on Industrial Electronics ISIE, Art. No. 8781159, Vancouver, Canada, Juni 12, 2019 - Juni 14, 2019 (IEEE, 2019) pp. 2440-2445
ISBN: 978-1-7281-3666-0 / 978-1-7281-3667-7
ISSN: 2163-5145 / 2163-5137
DOI: 10.1109/ISIE.2019.8781159

B. Mouawad, J. Licciardo, A. Castellazzi, C. M. Johnson, T. Erlbacher, P. Friedrichs:

Low inductance 2.5kV packaging technology for SiC switches

Proceedings of CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems (cited 3 times), Nuremberg, Germany, März 08, 2016 - März 10, 2016 (VDE - Verlag, 2019)
ISBN: 978-3-8007-4171-7

J. Müller, M. Novak, F. Dresel, C. F. Bayer, A. Schletz, M. März, T. Hofmann:

Selective Silver Sintering on Organic-Based Circuit Boards

Proceedings of International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management PCIM Europe, Nuremberg, Germany, Mai 07, 2019 - Mai 09, 2019 edited by Mesago Messe Frankfurt GmbH (VDE - Verlag, 2019)
ISBN: 978-3-8007-4938-6

A. Muthumbi, A. Chaware, K. Kim, K. C. Zhou, P. C. Konda, R. Chen, B. Judkewitz, A. Erdmann, B. Kappes, R. Horstmeyer:

Learned Sensing: Jointly Optimized Microscope Hardware for Accurate Image Classification

Biomedical Optics Express, Vol 10 (12) (OSA Publishing, 2019) pp. 6351-6369
DOI: 10.1364/BOE.10.006351

W. Ni, X. Wang, H. Xiao, M. Xu, M. Li, H. Schlichting, T. Erlbacher:

1700V 34mΩ 4H-SiC MOSFET with retrograde doping in junction field-effect transistor region

Proceeding of IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC 2019, Art. No. 8754174, Xi'an, China, Juni 12, 2019 - Juni 14, 2019 (IEEE, 2019)
ISBN: 978-1-7281-0286-3 / 978-1-7281-0287-0
DOI: 10.1109/EDSSC.2019.8754174

R. Öchsner, A. Nuß, C. Lange, A. Rueß:

Research Platform: Decentralized Energy System for Sector Coupling

Chemical Engineering and Technology, Vol 42, No. 9 (WILEY‐VCH Verlag, Weinheim, 2019) pp. 1886-1894
ISSN: 0930-7516 / 1521-4125
DOI: 10.1002/ceat.201800714

L. Ott, B. Schulz, B. Wunder, M. März:

Investigation of Stability Issues in Droop-Controlled DC Micro-grids with Intermediate Bus Architecture

Proceedings of International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management PCIM Europe, Nuremberg, Germany, Mai 07, 2019 - Mai 09, 2019 edited by Mesago Messe Frankfurt GmbH (VDE - Verlag, 2019)
ISBN: 978-3-8007-4938-6

N. Pavlicek, S. Vater, C. Liu, J. Y. Loisy, G. Salvatore, F. Mohn, J. Schuderer, A. Apelsmeier, F. Dresel, A. Schletz:

Power module platform for automotive reliability requirements

21st Conference (and Exhibition) on Power Electronics and Applications, EPE 2019 ECCE (Energy Conversion Congress and Expo) Europe, Art. No. 8915223, Genova, Italy, September 02, 2019 - September 05, 2019 (IEEE, 2019)
DOI: 10.23919/EPE.2019.8915223

M. Pfeffer, C. Zängle, A. J. Bauer, G. Schneider, P. Franze:

Advanced wafer container contamination control methods and strategies in power device manufacturing

Proceedings of IEEE International Symposium on Semiconductor Manufacturing ISSM 2018, Art. No. 8651151, Tokyo, Japan, Dezember 10, 2018 - Dezember 11, 2018 (IEEE, 2019)
ISBN: 978-1-5386-6268-7 / 978-1-5386-6269-4
ISSN: 1523-553X
DOI: 10.1109/ISSM.2018.8651151

V. Philipsen, K. V. Luong, K. Opsomer, L. Souriau, J. Rip, C. Detavernier, A. Erdmann, P. Evanschitzky, C. Laubis, P. Hönicke, V. Solwitsch, E. Hendrickx:

Mask absorber development to enable next-generation EUVL

Proceedings of SPIE - The International Society for Optical Engineering, Vol 11178, 26th Symposium on Photomask and Next-Generation Lithography Mask Technology, Photomask, Art. No. 111780F (cited 2 times), Yokohama, Japan, April 16, 2019 - April 18, 2019 (Society of Photo-Optical Instrumentation Engineers (SPIE), Bellingham, 2019)
DOI: 10.1117/12.2537967

P. Pichler, T. Śledziewski, V. Häublein, A. J. Bauer, T. Erlbacher:

Channeling in 4H-SiC from an application point of view

Materials Science Forum, Vol 963 edited by Peter M. Gammon, et al. (Trans Tech Publications, 2019) pp. 386-389
ISBN: 978-3-0357-1332-9 / 978-3-0357-2332-8 / 978-3-0357-3332-7
DOI: 10.4028/www.scientific.net/MSF.963.386

P. Puls, C. Lange, R. Öchsner:

Hybrid Cooling Towers in a Free-Cooling Application: Modeling and Field Measurement Verification

Chemical Engineering and Technology, Vol 42, No. 9 (WILEY‐VCH Verlag, Weinheim, 2019) pp. 1871-1878
DOI: 10.1002/ceat.201800712

G. Rattmann, P. Pichler, T. Erlbacher:

On a Novel Source Technology for Deep Aluminum Diffusion for Silicon Power Electronics

Physica Status Solidi (A) Applications and Materials Science, 216 (17), Art. No. 1900167 (WILEY‐VCH Verlag, Weinheim, 2019)
DOI: 10.1002/pssa.201900167

C. Rettner, A. Apelsmeier, G. Jacob, M. März, M. Schiedermeier:

Voltage ripple analysis based on DC-link current harmonics for Voltage Source Inverters

Proceedings of 20th Workshop on Control and Modeling for Power Electronics (IEEE COMPEL 2019), Toronto, Canada, Juni 17, 2019 - Juni 20, 2019 (IEEE, 2019)
ISBN: 978-1-7281-1843-7
DOI: 10.1109/COMPEL.2019.8769623

L. Rochlitz, M. Steinberger, R. Oechsner, A. Weber, S. Schmitz, K. Schillinger, M. Wolff, A. Bayler:

Second use or recycling of hydrogen waste gas from the semiconductor industry - Economic analysis and technical demonstration of possible pathways

International Journal of Hydrogen Energy, Vol 44 (31) (Elsevier Ltd, 2019) pp. 17168-17184
ISSN: 0360-3199
DOI: 10.1016/j.ijhydene.2019.05.009

B. Ruccius, T. Kraus, R. Westermann, T. Heckel, M. März, B. Wagner:

A Cascaded Control Concept for Modular Multilevel Converters with Capacitor Voltage Estimation using a Kalman Filter

Proceedings of ICPE 2019 - ECCE Asia - 10th International Conference on Power Electronics - ECCE Asia, Art. No. 8796897, Busan, South Korea, Mai 27, 2019 - Mai 30, 2019 (IEEE, 2019) pp. 1198-1204
ISBN: 978-89-5708-313-0 / 978-1-7281-1612-9
ISSN: 2150-6086 / 2150-6078

O. Rusch, J. Moult, T. Erlbacher:

Influence of trench design on the electrical properties of 650v 4H-SIC JBS diodes

Materials Science Forum, Vol 963 (Trans Tech Publications, 2019) pp. 549-552
DOI: 10.4028/www.scientific.net/MSF.963.549

S. Saponara, G. Ciarpi, T. Erlbacher, G. Rattman:

Integrated Passive Devices and Switching Circuit Design for a 3D DC/DC Converter up to 60 V

Journal of Circuits, Systems and Computers (World Scientific Publishing, 2019)
ISSN: 0218-1266 / 1793-6454
DOI: 10.1142/S0218126620500395

M. Schellenberger, V. R. H. Lorentz, B. Eckardt:

Cognitive Power Electronics 4.0 – So treffen leistungselektronische Schaltungen intelligente Entscheidungen

elektronik journal, April 2019 (Hüthig , Heidelberg, 2019) pp. 48-51

M. Schiedermeier, C. Rettner, M. Heilmann, F. Schneider, M. März:

Interference of Automotive HV-DC Systems by Traction Voltage-Source-Inverters (VSI)

iTEC India 2019 International Transportation Electrification Conference, Bangalore, India, Dezember 17, 2019 - Dezember 19, 2019

H. Schlichting, T. Śledziewski, A. J. Bauer, T. Erlbacher:

Design considerations for robust manufacturing and high yield of 1.2 kv 4H-SIC VDMOS transistors

Materials Science Forum, Vol 963 / Silicon Carbide and Related Materials 2018 : Selected papers from the 12th European Conference on Silicon Carbide and Related Materials ECSCRM 2018, Birmingham, UK, September 02, 2018 - September 06, 2018 (Trans Tech Publications, Birmingham, 2019) pp. 763-767
DOI: 10.4028/www.scientific.net/MSF.963.763

T. Schriefer, M. Hofmann:

A hybrid frequency-time-domain approach to determine the vibration fatigue life of electronic devices

Microelectronics Reliability, Vol 98 (Elsevier Ltd, 2019) pp. 86-94
ISSN: 0026-2714
DOI: 10.1016/j.microrel.2019.04.001

T. Schriefer, N. Schreibmüller, C. Horwath, W. Moritz, N. Moosmann, A. Dreibert, T. Gerberich, K. Schaumberger, H. Rauh, M. Hofmann, T. Nusser, F. Kaufmann, M. Schmidt:

Serienfähige Hochstromkontakte für integrierte elektrische Fahrzeugantriebe

wt-online, Vol 5-2019 (VDI Fachmedien, 2019) pp. 335-441

T. Schriefer, M. Hofmann, H. Rauh, B. Eckardt, M. März:

Parameter Study on the Electrical Contact Resistance of Axially Canted Coil Springs for High-current Systems

Electrical Contacts, Proceedings of the 65th Holm Conference on Electrical Contacts, Milwaukee, USA, September 14, 2019 - September 18, 2019 (IEEE, 2019) pp. 235-241
ISBN: 978-1-5386-6315-8 / 978-1-5386-6316-5
ISSN: 2158-9992 / 1062-6808
DOI: 10.1109/HOLM.2018.8611640

T. Schriefer, M. Hofmann:

Mechanical reliability of power electronic systems

Proceedings of CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems, Nuremberg, Germany, März 08, 2016 - März 10, 2016 (VDE - Verlag, 2019)
ISBN: 978-3-8007-4171-7

M. S. Schulz, S. Ditze, M. Diller, Y. Han, M. März:

An isolated bidirectional half-bridge active-clamp current-fed push-pull DC/DC converter for DC microgrid applications

21st Conference (and Exhibition) on Power Electronics and Applications, EPE 2019 ECCE (Energy Conversion Congress and Expo) Europe, Art. No. 8914806, Genova, Italy, September 02, 2019 - September 05, 2019 (IEEE, 2019)
DOI: 10.23919/EPE.2019.8914806

M. S. Schulz, J. Kaiser, K. Gosses, R. Conz, M. März:

Bidirectional Bipolar Electronic Overcurrent Safety Element for Bipolar DC Grids

Proceedings of International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management PCIM Europe, Nuremberg, Germany, Mai 07, 2019 - Mai 09, 2019 edited by Mesago Messe Frankfurt GmbH (VDE - Verlag, 2019) pp. 1290-1299
ISBN: 978-3-8007-4938-6

M. S. Schulz, M. Wild, R. Chacon, B. Wunder, M. März:

A bidirectional and isolated DC/DC converter connecting mobile battery systems to a DC grid in commercial buildings

Proceedings of 4th IEEE International Future Energy Electronics Conference 2019, Singapore, China, November 25, 2019 - November 28, 2019 (IEEE, 2019)
ISBN: 978-1-7281-3153-5

S. Schwanke, M. Trempa, C. Reimann, M. Kuczynski, G. Schroll, J. Sans, J. Friedrich:

Production of high performance multi-crystalline silicon ingots for PV application by using contamination-free Si_xN_y seed particles

Journal of Crystal Growth, Vol 522 edited by Thomas F. Kuech (Elsevier Ltd, Amsterdam, 2019) pp. 151-159
ISSN: 0022-0248
DOI: 10.1016/j.jcrysgro.2019.05.030

T. Śledziewski, T. Erlbacher, A. J. Bauer, L. Frey, X. Chen, Y. Zhao, C. Li, X. Dai:

Comparison between NI-SALICIDE and self-aligned lift-off used in fabrication of ohmic contacts for sic power MOSFET

Materials Science Forum, Vol 963 (Trans Tech Publications, 2019) pp. 490-493
DOI: 10.4028/www.scientific.net/MSF.963.490

Y. Song, Z. Xu, A. Rosenkranz, M. Rommel, C. Shi, F. Fang:

Surface-enhanced Raman scattering on nanodiamond-derived carbon onions

Nami Jishu yu Jingmi Gongcheng / Nanotechnology and Precision Engineering 2 (1) (KeAi Publishing, 2019) pp. 35-39
DOI: 10.1016/j.npe.2019.03.005

L. Stockmeier, C. Kranert, P. Fischer, B. Epelbaum, C. Reimann, J. Friedrich, G. Raming, A. Miller:

Analysis of the geometry of the growth ridges and correlation to the thermal gradient during growth of silicon crystals by the Czochralski-method

Journal of Crystal Growth, Vol 515 (cited 1 time) edited by Thomas F. Kuech (Elsevier Ltd, Amsterdam, 2019) pp. 26-31
ISSN: 0022-0248
DOI: 10.1016/j.jcrysgro.2019.03.009

T. Stolzke, S. Ehrlich, C. Joffe, M. März:

Comprehensive accuracy examination of electrical power loss measurements of inductive components for frequencies up to 1 MHz

Journal of Magnetism and Magnetic Materials, Vol 497, Art. No. 166022 (Elsevier Ltd, 2019)
DOI: 10.1016/j.jmmm.2019.166022

C. Strobl, H. Kopf, R. Mehl, L. Ott, J. Kaiser, M. Schafer, R. Rabenstein:

Safety concepts and circuit protection for LVDC-Grids in datacenters and in telecommunications

Proceedings of INTELEC 2018, IEEE International Telecommunications Energy Conference, Art. No. 8612360, Torino, Italy, Oktober 07, 2018 - Oktober 11, 2018 (IEEE, 2019)
ISBN: 978-1-5386-5370-8 / 978-1-5386-5371-5
ISSN: 0275-0473 / 2158-5210
DOI: 10.1109/INTLEC.2018.8612360

Y. Tao, T. Sorgenfrei, T. Jauß, A. Cröll, C. Reimann, J. Friedrich, J. J. Derby:

Erratum: Particle engulfment dynamics under oscillating crystal growth conditions

Crystal Growth 468, Vol 24-27, 2017 Journal of Crystal Growth, Vol 522 edited by Thomas F. Kuech (Elsevier Ltd, Amsterdam, 2019) p. 235
ISSN: 0022-0248
DOI: 10.1016/j.jcrysgro.2019.05.033

M. Trempa, C. Kranert, I. Kupka, C. Reimann, J. Friedrich:

Evaluation of improvement strategies of grain structure properties in high performance multi-crystalline silicon ingots

Journal of Crystal Growth, Vol 514 edited by Thomas F. Kuech (Elsevier Ltd, Amsterdam, 2019) pp. 144-123
ISSN: 0022-0248
DOI: 10.1016/j.jcrysgro.2019.03.005

U. Waltrich, B. Ruccius, D. Malipaard, A. Schletz, M. März:

Dimensioning of a novel design concept for MMC submodules

Proceedings of CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems, Nuremberg, Germany, März 08, 2016 - März 10, 2016 (VDE - Verlag, 2019)
ISBN: 978-3-8007-4171-7

X. Wang, Z. Xu, M. Rommel, B. Dong, L. Song, C. A. TH Tee, F. Fang:

Electron paramagnetic resonance characterization of aluminum ion implantation induced defects in 4H-SiC

Nanotechnology and Precision Engineering 2 (KeAi Publishing, 2019) pp. 157-162

J. Weiße, M. Hauk, M. Krieger, A. J. Bauer, T. Erlbacher:

Aluminum acceptor activation and charge compensation in implanted p-type 4H-SiC

AIP Advances, Vol 9 (5), Art. No. 55308 (AIP Publishing, Melville, 2019)
ISSN: 2158-3226
DOI: 10.1063/1.5096440

J. Weiße, M. Hauk, M. Krieger, A. J. Bauer, T. Erlbacher:

Erratum: Aluminum acceptor activation and charge compensation in implanted p-type 4H-SiC

AIP Advances, Vol 9 (7), Art. No. 79901 (AIP Publishing, 2019)
DOI: 10.1063/1.5118666

J. Weiße, H. Mitlehner, L. Frey, T. Erlbacher:

Design of a 4H-SiC RESURF n-LDMOS Transistor for High Voltage Integrated Circuits

Materials Science Forum, Vol 963 / Silicon Carbide and Related Materials 2018 : Selected papers from the 12th European Conference on Silicon Carbide and Related Materials ECSCRM 2018, Birmingham, UK, September 02, 2018 - September 06, 2018 (Trans Tech Publications, Birmingham, 2019) pp. 629-632
DOI: 10.4028/www.scientific.net/MSF.963.629

J. Weiße, M. Hauk, M. Krieger, J. Erlekampf, H. Mitlehner, A. J. Bauer, M. Rommel, V. Häublein, T. Erlbacher, C. Csato, M. Rüb, S. Akhmadaliev, L. Frey:

Impact of Al-ion implantation on the formation of deep defects in n-type 4H-SiC

Proceedings of 22nd International Conference on Ion Implantation Technology IIT 2018, Würzburg, Germany, September 18, 2018 - September 23, 2018 edited by Volker Häublein, Heiner Ryssel (IEEE, 2019) pp. 66-69
ISBN: 978-1-5386-6828-3
DOI: 10.1109/IIT.2018.8807980

J. Weiße, M. Hauk, T. Śledziewski, M. Krieger, A. J. Bauer, H. Mitlehner, L. Frey, T. Erlbacher:

On the origin of charge compensation in aluminum-implanted n-type 4H-SiC by analysis of hall effect measurements

Materials Science Forum, Vol 963 (Trans Tech Publications, 2019) pp. 433-436
DOI: 10.4028/www.scientific.net/MSF.963.433

Z. W. Xu, Y. Song, M. Rommel, T. Liu, M. Kocher, Z. D. He, H. Wang, B. T. Yao, L. Liu, F. Z. Fang:

Raman spectroscopy characterization of ion implanted 4H-SiC and its annealing effects

Materials Science Forum, Vol 963 (cited 1 time) (Trans Tech Publications, 2019) pp. 424-428
ISBN: 978-3-0357-1332-9 / 978-3-0357-2332-8 / 978-3-0357-3332-7
DOI: 10.4028/www.scientific.net/MSF.963.424

Z. Yu, S. Wang, S. A. Letz, C. F. Bayer, F. Häusler, A. Schletz, K. Suganuma:

Optimization of Ag-Ag Direct Bonding for Wafer-Level Power Electronics Packaging via Design of Experiments

Proceedings of International Conference on Electronics Packaging, ICEP, Art. No. 8733496, Niigata, Japan, April 17, 2019 - April 20, 2019 (IEEE, 2019) pp. 229-234
ISBN: 978-4-9902-1887-4 / 978-1-7281-1710-2
DOI: 10.23919/ICEP.2019.8733496

T. Zorenko, K. Paprocki, I. Levchuk, M. Batentschuk, B. Epelbaum, A. Fedorov, Y. Zorenko:

Luminescent properties of Ce³⁺ doped LiLuP₄O₁₂ tetraphosphate under synchrotron radiation excitation

Journal of Luminescence, Vol 210 (Elsevier Ltd, 2019) pp. 47-51
ISSN: 0022-2313
DOI: 10.1016/j.jlumin.2019.02.016

Bach, H. L.; Endres, T.; Dirksen, D.; Zischler, S.; Bayer, C. F.; Schletz, A.; Maerz, M.:

Ceramic Embedding as Packaging Solution for Future Power Electronic Applications

Int. Power Electronics Conference (ECCE IPEC) 2018, Niigata
DOI: 10.23919/IPEC.2018.8507647

Bach, H. L.; Yu, Z.; Letz, S.; Bayer, C. F.; Waltrich, U.; Schletz, A.; Maerz, M.:

Vias in DBC Substrates for Embedded Power Modules

10th Int. Conference on Integrated Power Electronics Systems (CIPS) 2018, pp. 144-148
ISBN: 978-3-8007-4540-1

Baehr, T.; Ghosh, M.; Kranert, C.; Reimann, C.; Morche, C.:

Development of methods for reducing the red zone in the top region of mc-silicon ingots

Proceedings of 35th European Photovoltaic Solar Energy Conference and Exhibition (2018), pp. 488-492
DOI: 10.4229/35thEUPVSEC20182018-2AV.1.11

Baer, E.; Lorenz, J.:

The effect of etching and deposition processes on the width of spacers created during self-aligned double patterning

Proceedings of International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2018, pp. 236-239
DOI: 10.1109/SISPAD.2018.8551649Baer,

E.; Lorenz, J.:

The effect of etching and deposition processes on the width of spacers created during self-aligned double patterning

Proceedings of International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2018, pp. 236-239
DOI: 10.1109/SISPAD.2018.8551649

Banzhaf, S.; Kenntner, J.; Grieb, M.; Schwaiger, S.; Erlbacher, T.; Bauer, A. J.; Frey, L.:

Stress Reduction in High Voltage MIS Capacitor Fabrication

19th International Symposium Power Electronics Ee2017, October 19-21 (2017) Novi Sad, Serbia
DOI: 10.1109/PEE.2017.8171664

Bauer, A.; Baer, E.; Erlbacher, T.; Friedrich, J.; Lorenz, J.; Rommel, M.; Schellenberger, M.:

Elektronik

Angewandte Nanotechnologie, K.-H. Haas, G. Tovar (Ed.), Fraunhofer Verlag, Stuttgart, 2018, pp. 98-115
ISBN: 978-3839609187

Bayer, C. F.; Diepgen, A.; Filippi, T.; Fuchs, C.; Wuestefeld, S.; Kellner, S.; Waltrich, U.; Schletz, A.:

Electrochemical Corrosion on Ceramic Substrates for Power Electronics - Causes, Phenomenological Description, and Outlook

10th Int. Conference on Integrated Power Electronics Systems (CIPS) 2018, pp. 161-167
ISBN: 978-3-8007-4540-1

Bayer, C. F.; Frey, L.:

Untersuchung der elektrischen Feldstärke und des Teilentladungsverhaltens an keramischen Schaltungsträgern

Dissertation, Friedrich-Alexander-Universität Erlangen Nürnberg, 2018

Belete, Z.; Baer, E.; Erdmann, A.:

Modeling of block copolymer dry etching for directed self-assembly lithography

Proceedings of SPIE Advanced Lithography 2018, paper 105890U, 12 pages
DOI: 10.1117/12.2299977

Bilbao-Guillerna, A.; Eachambadi, R.T.; Cadot, G.B.J.; Axinte, D.A.; Billingham, J.; Stumpf, F.; Beuer, S.; Rommel, M.:

Novel Approach Based on Continuous Trench Modelling to Predict Focused Ion Beam Prepared Freeform Surfaces

Journal of Materials Processing Technology 252 (2018), pp. 636-642
http://doi.org/10.1016/j.jmatprotec.2017.10.024

Cerezuela Barreto, M.; Roeder, G.; Steinhoff, M.; Schellenberger, M.; and Bauer, A. J.:

Advances in thermal laser separation: process monitoring in a kerf-free laser-based cutting technology to ensure high yield

Procedia CIRP, vol. 74, pp. 645-648, 01.01.2018
https://doi.org/10.1016/j.procir.2018.08.056

Chen, S.; Jiang, L.; Buckwell, M.; Jing, X.; Ji, Y.; Grustan-Gutierrez, E.; Hui, F.; Shi, Y.; Rommel, M.; Paskaleva, A.; Benstetter, G.; Ng, W.H.; Mehonic, A.; Kenyon, A.J.; Lanza, M.:

On the Limits of Scalpel AFM for the 3D Electrical Characterization of Nanomaterials

Advanced Functional Materials 2018 (2018) 1802266
https://doi.org/10.1002/adfm.201802266

Dejkameh, A.; Erdmann, A.; Evanschitzky, P.:

Fourier ptychography for lithography high NA systems

Proceedings of SPIE Advanced Lithography 2018, paper 106940B
DOI: 10.1117/12.2311332

Derluyn, J.; Germain, M.; Meissner, E.:

Taking the next step in GaN: Bulk GaN substrates and GaN-on-Si epitaxy for electronics

Gallium Nitride-enabled High Frequency and High Efficiency Power Conversion (Eds. G. Meneghesso, M. Meneghini, Matteo, E. Zanoni) Springer (2018), pp. 1-28
ISBN: 978-3-319-77993-5

Dresel, F.; Tham, N.; Erlbacher, T.; Schletz, A.:

Lifetime Testing Method for Ceramic Capacitors for Power Electronics Applications

10th Int. Conference on Integrated Power Electronics Systems (CIPS) 2018
ISBN: 978-3-8007-4540-1

Dresel, F.; Letz, S.; Zischler, S.; Schletz, A.; Novak, M.:

Selective silver sintering of semiconductor dies on PCB

Int. Conference on Power Conversion and Intelligent Motion (PCIM) 2018, Nuremberg
ISBN: 978-3-8007-4646-0

Eckardt, B.; Wild, M.; Joffe, C.; Zeltner, S.; Endres, S.; Maerz, M.:

Advanced Vehicle Charging Solutions Using SiC and GaN Power Devices

Int. Conference on Power Conversion and Intelligent Motion (PCIM) 2018, Nuremberg
ISBN: 978-3-8007-4646-0

Endruschat, A.; Novak, C.; Gerstner, H.; Heckel, T.; Joffe, C.; Maerz, M.:

A Universal SPICE Field-Effect Transistor Model Applied on SiC and GaN Power Transistors

IEEE Transactions on Power Electronics, Dec. 2018
DOI: 10.1109/TPEL.2018.2889513

Erdmann, A.; Evanschitzky, P.; Mezilhy, H.; Philipsen, V.; Hendrickx, E.; Bauer, M.:

Attenuated PSM for EUV: Can they mitigate 3D mask effects?

Proceedings of SPIE Advanced Lithography 2018, paper 1058312
DOI: 10.1117/12.2299648

Erlbacher, T.; Huerner, A.; Zhu, Y.; Bach, L.; Schletz, A.; Zuerbig, V.; Pinti, L.; Kirste, L.; Giese, C.; Nebel, C. E.; Bauer, A. J.; Frey, L.:

Electrical properties of Schottky-Diodes based on B Doped Diamond

Material Science Forum 924 (2018), pp. 164-167
DOI: 10.4028/www.scientific.net/MSF.924.931

Erlekampf, J.; Kaminzky, D.; Rosshirt, K.; Kallinger, B.; Rommel, M.; Berwian, P.; Friedrich, J.; Frey, L.:

Influence and mutual interaction of process parameters on the Z1/2 defect concentration during epitaxy of 4H-SiC

Materials Science Forum Vol 924 (2018), pp. 112-115
DOI: 10.4028/www.scientific.net/MSF.924.112

Förthner, M.; Girschikofsky, M.; Rumler, M.; Stumpf, F.; Rommel, M.; Hellmann, R.; Frey, L.:

One-step nanoimprinted Bragg grating sensor based on hybrid polymers

Sensors and Actuators A-Physical, 283, pp. 298-304
DOI: 10.1016/j.sna.2018.09.053

Gerstner, H.; Endruschat, A.; Heckel, T.; Joffe, C.; Eckardt, B.; Maerz, M.:

Non-linear Input Capacitance Determination of WBG Power FETs using Gate Charge Measurements

IEEE 6th Workshop on Wide Bandgap Power Devices and Applications (WiPDA), 2018, pp. 247-253
DOI: 10.1109/WiPDA.2018.8569089

Girschikofsky, M. G.; Rosenberger, M.; Förthner, M.; Rommel, M.; Frey, L.; Hellmann, R.:

Flexible thin film bending sensor based on Bragg gratings in hybrid polymers

Proceedings of the Optical Sensing and Detection V 2018
DOI: 10.1117/12.2303820

Gosses, K.; Kaiser, J.; Ott, L.; Schulz, M.; Fersterra, F.; Wunder, B.; Han, Y.; Lavery, M.; Maerz, M.:

Fault Considerations of Non-Isolated Electric Vehicle Chargers with a Mutual DC Supply

IEEE Transportation Electrification Conference (ITEC) 2018, Long Beach, CA
DOI: 10.1109/ITEC.2018.8450243

He, R.; Heyn, W.; Thiel, F.; Pérez, N.; Damm, C.; Pohl, D.; Rellinghaus, B.; Reimann, C.; Beier, M.; Friedrich, J.; Zhu, H.; Ren, Z.; Nielsch, K.; Schierning, G.:

Thermoelectric properties of silicon and recycled silicon sawing waste

Journal of Materiomics (2018)
DOI: https://doi.org/10.1016/j.jmat.2018.11.004.

He, Z.; Xu, Z.; Rommel, M.; Yao, B.; Liu, T.; Song, Y.; Fang, F.:

Investigation of Ga ion implantation-induced damage in single-crystal 6H-SiC

Journal of Micromanufacturing I-9 (2018), pp. 1-9
https://doi.org/10.1177/2516598418785507

Heckel, T.:

Charakterisierung dynamischer Eigenschaften und Modellbildung neuartiger Leistungshalbleiterbauelemente auf Basis von SiC und GaN

Verlag Dr. Hut, München, 2018
ISBN: 978-3-8439-3764-1

Heckel, T.; Zeltner, S.; Eckardt, B.; Maerz, M.:

Fast Switching with GaN and Dynamic On-Resistance from Application View-Point

2018 GaN Power Electronics Roadmap, Journal of Physics D: Applied Physics 51(16), 2018
https://doi.org/10.1088/1361-6463/aaaf9d

Huerner, A.; Heckel, T.; Enduschat, A.; Erlbacher, T.; Frey, L.:

Analytical Model for the Influence of the Gate-Voltage on the Forward Conduction Properties of the Body-Diode in SiC-MOSFETs

Material Science Forum 924 (2018), pp. 901-904
DOI: 10.4028/www.scientific.net/MSF.924.901

Hutzler, A.; Matthus, C.; Rommel, M.; Jank, M.; Frey, L.:

Large-Area Layer Counting of 2D Materials via Visible Reflection Spectroscopy

Proceedings of the 19th International Microscopy Congress (IMC19), Sydney 2018

Hutzler, A.; Schmutzler, T.; Jank, M.P.M.; Branscheid, R.; Unruh, T.; Spiecker, E.; Frey, L.:

Unravelling the Mechanisms of Gold−Silver Core−Shell Nanostructure Formation by in Situ TEM Using an Advanced Liquid Cell Design

Nano Letters, Bd. 18, H. 11
DOI: 10.1021/acs.nanolett.8b03388

Ismail, M.; Evanschitzky, P.; Erdmann, A.; Bottiglieri, G.; van Setten, E.; Fliervoet, T.:

Simulation study of illumination effects in high-NA EUV lithography

Proceedings of SPIE Advanced Lithography 2018, paper 106940H
DOI: 10.1117/12.2315091

Kaiser, J.; Schork, F.; Gosses, K.; Han, Y.; Schulz, M.; Ott, L.; Wunder, B.; Maerz, M.:

Converter Overvoltage Protection for DC-Grids

IEEE 40th Int. Telecommunications Energy Conference (INTELEC), 2018
DOI: 10.1109/INTLEC.2018.8612423

Kallinger, B.; Kaminzky, D.; Berwian, P.; Friedrich, J.; Oppel, S.:

Optical stressing of 4H-SiC material and devices

Materials Science Forum Vol 924 (2018), pp. 196-199
DOI: https://doi.org/10.4028/www.scientific.net/MSF.924.196

Kocher, M.; Rommel, M.; Erlbacher, T.; Bauer, A. J.:

Influence of Al Doping Concentration and Annealing Properties on TiAl Based Ohmic Contacts on 4H-SiC

Material Science Forum 924 (2018), pp. 393-396
DOI: 10.4028/www.scientific.net/MSF.924.393

Kreutzer, O.; Billmann, M.; Gerner, M.; Maerz, M.:

A 3.6 kV full SiC fuel cell boost converter for high power electric aircraft

IEEE Transportation Electrification Conference (ITEC) 2018, Long Beach, CA
DOI: 10.1109/ITEC.2018.8450229

Kreutzer, O.; Billmann, M.; Maerz, M.:

Is an antiparallel SiC-Schottky diode necessary - Calorimetric Analysis of SiC-MOSFETs switching behavior

Int. Conference on Power Conversion and Intelligent Motion (PCIM) 2018, Nuremberg
ISBN 978-3-8007-4646-0

Letz, S.; Farooghian, A.; Simon, F. B.; Schletz, A.:

Modeling the rate-dependent inelastic deformation of porous polycrystalline silver films

Microelectronics reliability 88-90 (2018), pp.1113-1117
DOI: 10.1016/j.microrel.2018.07.084

Lorentz, V. R. H.; Waller, R.; Waldhoer, S.; Wenger, M.; Gepp, M.; Schwarz, R.; Koffel, S.; Wacker, S.; Akdere, M.; Giegerich, M.; Maerz, M.:

Power Antifuse Device to Bypass or Turn-off Battery Cells in Safety-Critical and Fail-Operational Systems

IEEE Int. Conference on Industrial Electronics for Sustainable Energy Systems (IESES 2018), Hamilton, New Zealand
DOI: 10.1109/IESES.2018.8349850

Lorenz, J.; Asenov, A.; Baer, E.; Barraud, S.; Kluepfel, F.; Millar, C.; Nedjalkov, M.:

Process variability for devices at and beyond the 7 nm node

ECS Journal of Solid State Science and Technology 11 (2018), pp. 595-601
DOI: 10.1149/2.0051811jss

Lorenz, J.; Asenov, A.; Baer, E.; Barraud, S.; Millar, C.; Nedjalkov, M.:

Process variability for devices at and beyond the 7 nm node

Proceedings of the 233rd Meeting of the Electrochemical Society (2018), pp. 113-124
DOI: 10.1149/08508.0113ecst

Lorenz, L.; Erlbacher, T.; Hilt, O.:

Future technology trends

Wide Bandgap Power Semiconductor Packaging, Woodhead Publishing Series in Electronic and Optical Materials edited by Katsuaki Suganuma, Woodhead Publishing, 2018, pp. 3-53
ISBN: 978-0-0810-2094-4

Maerz, M.; Eckardt, B.; Wild, M.; Joffe, C.; Zeltner, S.; Endres, S.:

Advanced Vehicle Charging Solutions using SiC and GaN Power Devices

Int. Conference on Power Conversion and Intelligent Motion (PCIM) 2018, Nuremberg
ISBN 978-3-8007-4646-0

Maerz, M.; Piepenbreier, S.; Kaess, A.:

An Investigation of the Parasitic Impedance on the DC-Link Capacitor of EV Drive Inverters

Proceedings of the 2018 10th International Conference on Integrated Power Electronics Systems (CIPS)
ISBN: 978-3-8007-4540-1

Maerz, M.; Waltrich, U.; Bayer, C.; Zoetl, S.; Tokarski, A.; Zischler, S.; Schletz, A.:

Highly Reliable Power Modules by Pressureless Sintering

Proceedings of the 2018 10th International Conference on Integrated Power Electronics Systems (CIPS)
ISBN: 978-3-8007-4540-1

Maerz, M.; Lorentz, V.; Waller, R.; Waldhoer, S.; Wenger, M.; Gepp, M.; Schwarz, R.; Koffel, S.; Wacker, S.; Akdere, M.; Giegerich, M.:

Power Antifuse Device to Bypass or Turn-off Battery Cells in Safety-Critical and Fail-Operational Systems

Proceedings of the 2018 IEEE International Conference on Industrial Electronics for Sustainable Energy Systems (IESES 2018)
DOI: 10.1109/IESES.2018.8349850

Maerz, M.; Bach, H. L.; Yu, Z.; Letz, S.; Bayer, C.; Waltrich, U.; Schletz, A.:

Vias in DBC Substrates for Embedded Power Modules

Proceedings of the 2018 10th International Conference on Integrated Power Electronics Systems (CIPS)
ISBN: 978-3-8007-4540-1

Matthus, C. D.; Huerner, A.; Erlbacher, T.; Bauer, A. J.; Frey, L.:

Evidence of low injection efficiency for implanted p-emitters in bipolar 4H-SiC high-voltage diodes

Solid-State Electronics Vol. 144, Elsevier, June 2018, pp. 101-105
DOI: 10.1016/j.sse.2018.03.010

Matthus, C. D.; Bauer, A. J.; Frey, L.; Erlbacher, T.:

Wavelength-selective 4H-SiC UV-sensor array

Material Science in Semiconductor Processing, Feb. 2019
DOI: 10.1016/j.mssp.2018.10.019

Meneghesso, G.; Derluyn, J.; Meissner, E.; Medjdoub, F.; Banerjee, A.; Naundorf, J.; Rittner, M.:

Pushing the limits of GaN-based power devices and power electronics

Bodo´s Power Systems® 8 (2018), pp. 52-55
ISSN: 1863-5598

Morche, C.; Baehr, T.; Ghosh, M.; Kranert, C.; Zimmermann, A.; Franz, H.:

Evaluation of a new hybrid crucible concept for crystallization of mc-silicon ingots

Proceedings of 35th European Photovoltaic Solar Energy Conference and Exhibition (2018), pp. 493-497
DOI: 10.4229/35thEUPVSEC20182018-2AV.1.12

Nouibat, T. H.; Messai, Z.; Chikouch, D.; Ouennoughi, Z.; Rouag, N.; Rommel, M.; Frey, L.:

Normalized differential conductance to study current conduction mechanisms in MOS structures

Microelectronics Reliability, 91, pp. 183-187
DOI: 10.1016/j.microrel.2018.10.001

Onanuga, T.; Kaspar, C.; Sailer, H.; Erdmann, A.:

Accurate determination of 3D PSF and resist effects in grayscale laser lithography

Proceedings of SPIE Advanced Lithography 2018, paper 107750I
DOI: 10.1117/12.2326007

Ortiz, R.; Aurrekoetxea-Rodríguez, I.; Rommel, M.; Quintana, I.; Vivanco, M.; Toca-Herrera, J. L.:

Laser Surface Microstructuring of a Bio-Resorbable Polymer to Anchor Stem Cells, Control Adipocyte Morphology, and Promote Osteogenesis

polymers 10 (2018) 1337
https://doi.org/10.3390/polym10121337

Ott, L.; Han, Y.; Wunder, B.; Bodensteiner, F.; Maerz, M.:

Evaluation of DC-DC-Converter Impedance Passivity using Pseudo-Random Test Signals

Int. Conference on Power Conversion and Intelligent Motion (PCIM) 2018, Nuremberg
ISBN: 978-3-8007-4646-0

Pai, A.; Reiter, T.; Maerz, M.:

Efficiency Investigation of Full-SiC versus Si-based Automotive Inverter Power Modules at Equal Commutation Speed

Int. Conference on Power Conversion and Intelligent Motion (PCIM) 2018, Nuremberg
ISBN: 978-3-8007-4646-0

Philipsen, V.; Luong, V.; Opsomer, K.; Hendrickx, E. ; Erdmann, A.; Evanschitzky, P.; van de Kruijs, R.; Heidarnia-Fathabad, Z.; Scholze, F.; Laubis, C.:

Novel EUV mask absorber evaluation in support of next-generation EUV imaging

Proceedings of SPIE Advanced Lithography 2018, paper 108100C
DOI: 10.1117/12.2501799

Piepenbreier, S.; Kaess, A.; Maerz, M.:

An Investigation of the Parasitic Impedance on the DC-Link Capacitor of EV Drive Inverters

IEEE 10th Int. Conference on Integrated Power Electronics Systems (CIPS), Stuttgart, 2018
ISBN: 978-3-8007-4540-1

Purgat, P.; Mackay, L.; Schulz, M.; Han, Y.; Qin, Z.; Maerz, M.; Bauer, P.:

Design of a Power Flow Control Converter for Bipolar Meshed LVDC Distribution Grids

IEEE 18th Int. Power Electronics and Motion Control Conference (PEMC), Budapest
DOI: 10.1109/EPEPEMC.2018.8521853

Rosenberger, M.; Girschikofsky, M.; Förthner, M.; Belle, S.; Rommel, M.; Frey, L.; Schmauss, B.; Hellmann, R.:

TiO2 surface functionalization of COC based planar waveguide Bragg gratings for refractive index sensing

Journal of Optics, Bd. 20, H.1
DOI: 10.1088/2040-8986/aa9bcf

Rosskopf, A. ; Volmering, S. ; Ditze, S. ; Joffe, C. ; Baer, E.:

Autonomous circuit design of a resonant converter (LLC) for on-board chargers using genetic algorithms

Proceedings of IEEE Transportation and Electrification Conference and Expo, ITEC 2018, pp. 96-101
DOI: 10.1109/ITEC.2018.8450100

Rosskopf, A.; Knoerzer, K.; Baer, E.; Ehrlich, S.:

Optimized 2D positioning of windings in inductive components by genetic algorithm

Proceedings of 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018, pp. 144-149
DOI: 10.1109/EuroSimE.2018.8369881

Scharin-Mehlmann, M.; Haering, A.; Rommel, M.; Dirnecker, T.; Friedrich, O.; Frey, L.; Gilbert, D.:

Nano- and micro-patterned S-, H-, and X-PDMS for cell-based applications: Comparison of wettability, roughness, and cell-derived parameters

Frontiers in Bioengineering and Biotechnology, Bd. 6

DOI: 10.3389/fbioe.2018.00051

Schellenberger, M.; Roeder, G.; Anger, S.; and Klingert, F.:

“Dr. Production®” and Predictive Maintenance: Lessons Learned from Semiconductor Manufacturing

Proceedings of the 9th International Conference on ”Power Electronics for Plasma Engineering”, Freiburg, 2018
ISBN 978-83-930983-8-5

Schoeck, J.; Schlichting, H.; Kallinger, B.; Erlbacher, T.; Rommel, M.; Bauer, A. J.:

Influence of Triangular Defects on the Elecrtical Characteristics of 4H-SiC Devices

Material Science Forum 924 (2018), pp. 164-167
DOI: 10.4028/www.scientific.net/MSF.924.164

Schriefer, T.; Hofmann, M.:

Assessing the vibrational response and robustness of electronic systems by dissolving time and length scale

IEEE 19th Int. Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EurosimE), Toulouse, 2018
DOI: 10.1109/EuroSimE.2018.8369868

Schriefer, T.; Hofmann, M.; Rauh, H.; Eckardt, B.; Maerz, M.:

Parameter study on the electrical contact resistance of axially canted coil springs for high-current systems

64th IEEE Holm Conference on Electrical Contacts, Albuquerque, 2018
DOI: 10.1109/HOLM.2018.8611640

Schriefer, T.; Hofmann, M.; Maerz, M.:

Vibrational resistance investigation of an IGBT gate driver utilizing Frequency Response Analysis (FRA) and Highly Accelerated Life Test (HALT)

IEEE 10th Int. Conference on Integrated Power Electronics Systems (CIPS), Stuttgart, 2018
ISBN: 978-3-8007-4540-1

Schrüfer, D.; Ellinger, M.; Jank, M.; Frey, L.; Weigel, R.; Hagelauer, A.:

Circuits with Scaled Metal Oxide Technology for Future TOLAE RF Systems

Proceedings of the 48th European Microwave Conference, pp. 737-740
ISBN: 978-2-87487-051-4

Schultheiss, F.; Thinh, N. - X.; Endruschat, A.; Maerz, M.:

Minimum Volume Design of a Forced-Air Cooled Three-Phase Power Factor Correction Stage for Electric Vehicle Chargers

IEEE Transportation Electrification Conference (ITEC) 2018, Long Beach, CA
DOI: 10.1109/ITEC.2018.8450111

Shapouri Ghazvini, M.; Pulletikurthi, G.; Cuia, T.; Kuhl, C.; Endres, F.:

Electrodeposition of zinc from 1-ethyl-3-methylimidazolium acetate-water mixtures: Investigations on the applicability of the electrolyte for Zn-air batteries

Journal of The Electrochemical Society 165 (9) (2018) D354-D363
DOI: 10.1149/2.0181809jes

Shen, L.; Mueller, S.; Cheng, X.; Zhang, D.; Zheng, L.; Xu, D.; Yu, Y.; Meissner, E.; Erlbacher, T.:

The GaN trench gate MOSFET with floating islands: High breakdown voltage and improved BFOM

Superlattices and Microstructures, Volume 114, February 2018, pp. 200-206
DOI: 10.1016/j.spmi.2017.12.033

Steinberger, M.: Geiling, J.; Oechsner, R.; Frey, L.:

Anode recirculation and purge strategies for PEM fuel cell operation with diluted hydrogen feed gas

Applied Energy, 232, pp. 572-582
DOI: 10.1016/j.apenergy.2018.10.004

Stockmeier, L.; Kranert, C.; Raming, G.; Miller, A.; Reimann, C.; Rudolph, P.; Friedrich, J.:

Edge facet dynamics during the growth of heavily doped n-type silicon by the Czochralski-method

Journal of Crystal Growth 491 (2018), pp. 57-65
DOI: 10.1016/j.jcrysgro.2018.03.028

Stolzke, T.; Dirnecker, T.; Schwarz, J.; Frey, L.:

Investigation of magnetic properties from a manganese–zinc–ferrite polymer bonded material

International Journal of Applied Electromagnetics and Mechanics, pp. 1-8
DOI: 10.3233/JAE-171244

Stumpf, F.; Abu Quba, A.A.; Singer, P.; Rumler, M.; Cherkashin, N.; Schamm-Chardon, S.; Cours, R.; Rommel, M.:

Detailed characterisation of focused ion beam induced lateral damage on silicon carbide samples by electrical scanning probe microscopy and transmission electron microscopy

Journal of Applied Physics 123 (2018) 125104
https://doi.org/10.1063/1.5022558

Trempa, M.; Müller, G.; Friedrich, J.; Reimann, C.:

Grain boundaries in multicrystalline silicon

in Handbook of Photovoltaic Silicon (Ed. D. Yang), Springer, Berlin (2018), pp. 1-48
DOI: https://doi.org/10.1007/978-3-662-52735-1

Waltrich, U.; Bayer, C. F.; Zoetl, S.; Tokarski, A.; Zischler, S.; Schletz, A.; Maerz, M.:

Highly Reliable Power Modules by Pressureless Sintering

10th Int. Conference on Integrated Power Electronics Systems (CIPS) 2018, pp. 547-551
ISBN: 978-3-8007-4540-1

Weisse, J.; Hauck, M.; Sledziewski, T.; Tschiesche, M.; Krieger, M.; Bauer, A. J.; Mitlehner, H.; Frey, L.; Erlbacher, T.:

Analysis of Compensation Effects in Aluminum-Implanted 4H-SiC Devices

Material Science Forum 924 (2018), pp. 184-187
DOI: 10.4028/www.scientific.net/MSF.924.184

Woldeamanual, D.S.; Erdmann, A.; Maier, A.:

Application of deep learning algorithms for lithographic mask characterization

Proceedings of SPIE Advanced Lithography 2018, paper 1069408
DOI: 10.1117/12.2312478

Xu, Z.; He, Z.; Song, Y.; Fu, X.; Rommel, M.; Luo, X.; Hartmaier, A.; Zhang, J.; Fang, F.:

Topic Review: Application of Raman Spectroscopy Characterization in Micro/Nano-machining

Micromachines 9 (2018) 361
https://doi.org/10.3390/mi9070361

Yu, Z.; Zeltner, S.; Boettcher, N.; Rattmann, G.; Leib, J.; Bayer, C. F.; Schletz, A.; Erlbacher, T.; Frey, L.:

Heterogeneous Integration of Vertical GaN Power Transistor on Si Capacitor for DC-DC Converters

Conference Paper, ESTC Dresden, September 18, 2018
DOI: 10.1109/ESTC.2018.8546362

Zoerner, A.; Oertel, S.; Jank, M.; Frey, L.; Langenstein, B.; Bertsch, T.:

Human Sweat Analysis Using a Portable Device Based on a Screen-printed Electrolyte Sensor

Electroanalysis, Bd. 30, H. 4
DOI: 10.1002/elan.201700672

Albrecht, M.; Huerner, A.; Erlbacher, T.; Bauer, A. J.; Frey, L.:

Experimental Verification of a Self-Triggered Solid-State Circuit Breaker Based on a SiC BIFET

Materials Science Forum Vol, 897, 2017, pp. 665
DOI: 10.4028/www.scientific.net/MSF.897.665

Albrecht, M.; Huerner, A.; Erlbacher, T.; Bauer, A. J.; Frey, L.:

Monolithically Integrated Solid-State-Circuit-Breaker for High Power Applications

Materials Science Forum, Vol. 897, 2017, pp. 661 - 664
DOI: 10.4028/www.scientific.net/MSF.897.661

Bayer, C., Römelsberger, C.:

Entwicklung neuartiger Leistungsmodule, Extraktion elektrischer Parasiten bei Leistungsmodulen mit ANSYS Q3D

Proceedings of CADFEM ANSYS Simulation Conference, Koblenz, November 2017

Belitz, R.; Meisner, P.; Coeler, M.; Wunderwald, U.; Friedrich, J.; Zosel, J.; Schelter, M.; Jachalke, S.; Mehner, E.:

Waste Heat Energy Harvesting by use of BaTiO3 for Pyroelectric Hydrogen Generation

Energy Harvesting and Systems: Materials, Mechanisms, Circuits and Storage, Band 4, Heft 3, 2017, pp. 107 - 113
DOI: 10.1515/ehs-2016-0009

Benedetto Di, L.; Licciardo, G. D.; Erlbacher, T.; Bauer, A. J.; Rubino, A.:

Novel Advanced Analytical Design Tool for 4H-SiC VDMOSFET Devices

Materials Science Forum Vol. 897, 2017, pp. 529 - 532
DOI: 10.4028/www.scientific.net/MSF.897.529

Biasio De, M.; Kraft, M.; Geier, E.; Goller, B.; Bergmann, Ch.; Esteve, R.; Cerezuela-Barreto, M.; Lewke, D.; Schellenberger, M.; Roesner, M.:

Raman Micro-Spectroscopy as a non-destructive key Analysis Tool in Current Power Semiconductor Manufacturing

Proceedings of SPIE Vol. 10210
DOI: 10.1117/12.2259927

Coumont, M.; Hermanns, K.; Lukaschik, A.; Griepentrog, G.; Hanson, J.:

Influence of Modulation and Voltage Balancing on Spectral Emission of the Modular Multilevel Converter

Proceedings of UPEC 2017, 52nd International Universities Power Engineering Conference, Heraklion, GRC, August  28 - 31, 2017
DOI: 10.1109/UPEC.2017.8231862

Derby, J. J.; Tao, Y.; Reimann, C.; Friedrich, J.; Jauß, T.; Sorgenfrei, T.; Cröll, A.:

A quantitative model with new scaling for silicon carbide particle engulfment during silicon crystal growth

Journal of Crystal Growth Vol. 463, 2017, pp. 100 - 109
DOI: 10.1016/j.jcrysgro.2017.02.012

Endres, S.; Seßler, C.; Zeltner, S.; Eckardt, B.; Morita, T.:

6 kW bidirectional, Insulated On-board Charger With Normally-Off GaN Gate Injection Transistors

Proceedings of PCIM Europe 2017, International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable
Energy and Energy Management, Nuremberg, May 16 - 18, 2017, VDE Verlag, pp. 573 - 578
ISBN: 978-3-8007-4424-4

Endruschat, A.; Heckel, T.; Gerstner, H.; Joffe, C.; Eckardt, B.; März, M.:

Application-Related Characterization and Theoretical Potential of Wide-Bandgap Devices

Proceedings of IEEE 5th Workshop on Wide Bandgap Power Devices and Applications (WiPDA), 2017, Albuquerque,
October 30 - November 1, 2017
DOI: 10.1109/WiPDA.2017.8170529

Engst, C. R.; Rommel, M.; Bscheid, C.; Eisele, I.; Kutter, C.:

Bulk lifetime characterization of Corona charged silicon wafers with high resistivity by means of Microwave Detected Photoconductivity

Journal of Applied Physics Vol. 122, 2017, Art. 215704-1-11
DOI: 10.1063/1.4993127

Erdmann, A. ; Xu, D. ; Evanschitzky, P. ; Philipsen, V. ; Luong, V. ; Hendrick, E.:

Characterization and mitigation of 3D mask effects in extreme ultraviolet lithography

Advanced Optical Technologies Vol.6, Issue 3 - 4, 2017,  pp.187 - 201
DOI: 10.1515/aot-2017-0019

Fersterra, F.; Gosses, K.; Schulz, M.; Wunder, B.; März, M.:

A Bidirectional Approach for Segregated DC Microgrids

Proceedings of ICDCM 2017, IEEE International Conference on DC Microgrids, Nuremberg, June 27 - 29, 2017
DOI: 10Förthner, M.; Rommel, M.; Rumler, M.; Thesen, M. W.; Messerschmidt, M.; Storace, E.:
mr-NIL210FC_XP – a very Promising Resist for Employment of SCIL Technology in high Volume Industrial Applications
SUSS Reports 1 / 2017 .1109/ICDCM.2017.8001099

Förthner, M.; Papenheim, M.; Rumler, M.; Stumpf, F.; Baier, L.; Rommel, M.; Scheer, H.-C., Frey, L.:

Polymerization related deformations in multilayer soft stamps for nanoimprint

Journal of Applied Physics Vol. 122, 2017, Art. 165305-1-8
DOI: 10.1063/1.5001463

Friedrich, J.; Reimann, C.; Jauss, T.; Cröll, A.; Sorgenfrei, T.; Tao, Y.; Derby, J. J.:

Engulfment and pushing of Si3N4 and SiC particles during directional solidification of silicon under microgravity conditions

Journal of Crystal Growth Vol. 475, 2017, pp. 33 - 38
DOI: 10.1016/j.jcrysgro.2017.05.036

Geiling, J.; Steinberger, M.; Preuster, P.; Wagner, L.; Öchsner, R.:

Einsatz der Niedertemperatur-PEM-Technologie in einem kompakten Energiespeichersystem auf Basis flüssiger organischer Wasserstoffträger

Tagungsband Nutzung Regenerativer Energiequellen und Wasserstofftechnik 2017, pp. 38 - 48
ISBN: 978-3-9817740-3-0

Gerstner, H.; Heckel, T.; Endruschat, A.; Eckardt, B.; März, M.:

SiC Power Module Loss Reduction by PWM Gate Drive Patterns and Impedance-Optimized Gate Drive Voltages

Proceedings of WiPDA 2017, IEEE 5th Workshop on Wide Bandgap Power Devices and Applications, Albuquerque, October 30 - November 1,  2017
DOI: 10.1109/WiPDA.2017.8170564

Girschikofsky, M.; Förthner, M.; Rommel, M.; Frey, L.; Hellmann, R.:

Fabrication of Bragg grating sensors in UV-NIL structured Ormocer waveguides

Proceedings of SPIE 10106, Integrated Optics: Devices, Materials, and Technologies XXI, 2017, Art. 101060M-1-9
DOI: 10.1117/12.2249665

Girschikofsky, M.; Rosenberger, M.; Förthner, M.; Rommel, M.; Frey, L.; Hellmann, R.:

Waveguide Bragg Gratings in Ormocer®s for Temperature Sensing

Sensors Vol. 17, 2017, Art. 2459 1-9
DOI: 10.3390/s17112459

Grünig, F.; Smazinka, T.:

Störungsarme Leistungselektronik für die Mobilität von Morgen

Elektronik automotive, Sonderausgabe Elektromobilität, Juli 2017

Han, Y.; Kaiser, J.; Ott, L.; Schulz, M.; Fersterra, F.; Gosses, K.; Wunder, B.; März, M.:

High Efficiency Control Method for Non-Isolated Three-Port DC/DC converter

Proceedings of  PCIM Asia 2017; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, Shanghai, June 27 - 29, 2017
ISBN: 978-3-8007-4429-9

Huerner, A.; Heckel, T.; Endruschat, A.; Erlbacher, T.; Bauer, A. J.; Frey, L.:

Analytical Model for the Influence of the Gate-Voltage on the Forward Conduction Properties of the Body-Diode in SiC-MOSFETs

Proceedings of ICSCRM 2017, International Conference on Silicon Carbide and Related Materials

Huerner, A.; Erlbacher, T.; Bauer, A. J.; Frey, L.:

Monolithically Integrated Solid-State-Circuit-Breaker for High Power Applications

Materials Science Forum Vol. 897, 2017, pp. 661 - 664
DOI: 10.4028/www.scientific.net/MSF.897.661

Hutzler, A.; Branscheid, R.; Schmutzler, T.; Jank, M.; Frey, L.; Spiecker, E.:

Controlled silver-shell growth on gold nanorods studied by in situ liquid cell TEM techniques

Proceedings of MC 2017, Microscopy Conference, Lausanne, SUI, August 21 - 25, pp. 600 - 601

Hutzler, A.; Matthus, C. D.; Rommel, M.; Frey, L.:

Generalized approach to design multi-layer stacks for enhanced optical detectability of ultrathin layers

Applied Physics Letters Vol. 110 Issue 2, 2017, Art. 021909, pp. 1 - 4
DOI: 10.1063/1.4973968

Johnsson, A.; Pichler, P.; Schmidt, G.:

Silicon self-interstitial properties deduced from platinum profiles after annealing with controlled cooling

Physica status solidi. A, Vol. 214, Issue 7, 2017, Art. 1700207, 5 p.
DOI: 10.1002/pssa.201700207

Kaiser, J.; Gosses, K.; Ott, L.; Han, Y.; Wunder, B.; März, M.; Weiss, R.:

Grid Behavior under Fault Situations in ±380 VDC Distribution Systems

Proceedings of IEEE ICDCM 2017, 2nd IEEE International Conference on DC Microgrids, Nuremberg, June 27 - 29, 2017
DOI: 10.1109/ICDCM.2017.8001035

Kaiser, J.; Gosses, K.; Ott, L.; Han, Y.; Wunder, B.; März, M.; Schork, F.; Bühler, K.; Böhm, T.:

Safety Considerations for the Operation of Bipolar DC-Grids

Proceedings of IEEE INTELEC, Gold Coast, Australia, October 22 - 26, 2017
DOI: 10.1109/INTLEC.2017.8214157

Kegeleers, M.; Körner, J.; Matlok, S.; Hofmann, M.; März, M.:

Parasitic Inductance Analysis off a Fast Switching 100 kW Full SiC Inverter

Proceedings of PCIM Europe 2017, International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable
Energy and Energy Management, Nuremberg, May 16 - 18, 2017, VDE Verlag, pp. 457 - 463
ISBN: 978-3-8007-4424-4

Klingert, F.; Roeder, G.; Schellenberger, M.; Bauer, A.; Frey, L.; Pressel, K.; Brueggemann, M.:

Condition-based maintenance of mechanical setup in aluminum wire bonding equipment by data mining

Proceedings of ASMC 2017, IEEE 28th Annual SEMI Advanced Semiconductor Manufacturing Conference, pp. 72 - 77
ISBN: 978-1-5090-5448-0

Kluepfel, F. J.; Pichler, P.:

3D simulation of silicon-based single-electron transistors

Proceedings of SISPAD 2017, International Conference on Simulation of Semiconductor Processes and Devices, Kamakura, JPN, September 7 - 9, 2017, pp. 77 - 80
DOI: 10.23919/SISPAD.2017.8085268

Kocher, M.; Niebauer, M.; Rommel, M.; Haeublein, V.; Bauer, A. J.:

Point Contact Current Voltage Measurements of 4H-SiC Samples with Different Doping Profiles

Materials Science Forum Vol. 897, 2017, pp. 287 - 290
DOI: 10.4028/www.scientific.net/MSF.897.287

Kreutzer, O.; Billmann, M.; März, M.:

A passively cooled 15 kW, 800 V DCDC-converter with a peak efficiency of 99.7 %

Proceedings of IEEE AFRICON 2017, Cape Town, South Africa, September 18 - 20, 2017
ISBN: 978-1-5386-2775-4, DOI: 10.1109/AFRCON.2017.8095685

Kundin, J.; Emmerich, H.; Aufgebauer, H.; Friedrich, J.; Reimann, C.; Cröll, A.; Jauß, T.; Sorgenfrei, T.:

Dynamic modeling of critical velocities for the pushing/engulfment transition in the Si-SiC system under gravity conditions

Metallurgical and Materials Transactions A, Vol. 48, Issue 1, 2017, pp. 342 - 353
DOI: 10.1007/s11661-016-3817-8

Kupka, I.; Lehmann, T.; Trempa, M.; Kranert, C.; Reimann, C.; Friedrich, J.:

Influence of different nucleation layers on the initial grain structure of multicrystalline silicon ingots

Journal of Crystal Growth Vol. 465, 2017, p. 18 - 26
DOI: 10.1016/j.jcrysgro.2017.02.039

Laurent, J.; Rancoule, G.; Drode, E.; Reimann, C.; Trempa, M.; Kranert, C.; Friedrich, J.; Teale, L.; Dyer, R.; Dorrity, I.:

Properties of multi-crystalline silicon ingot grown by self-nucleating crucible

Proceedings of 33th European Photovoltaic Solar Energy Conference and Exhibition, 2017, pp. 305 - 308
DOI: 10.4229/EUPVSEC20172017-2BO.1.1

Lewke, D.; Cerezuela Barreto, M.; Dohnke, K.; Zühlke, H.-U.; Belgardt, C.; Schellenberger, M.:

TLS-Dicing for SiC – Latest Assessment Results

Proceedings of ICSCRM 2017, International Conference on Silicon Carbide and Related Materials, Washington DC, USA, September 17 - 22, 2017

Luka, T.; Turek, M.; Kranert, C.; Großer, S.; Hagendorf, C.:

Microstructural investigation of LID sensitive mc-PERC solar cells

Energy Procedia 124, 2017, pp. 759 - 766
DOI: 10.1016/j.egypro.2017.09.080

Maerz, M.; Wunder, B.; Ott, L.:

LVDC-Netze – Herausforderungen und Perspektiven

ETG-Fachbericht 152 der 7. ETG-Fachtagung Bauelemente der Leistungselektronik und ihre Anwendungen, Bad Nauheim,
April 6 - 7, 2017
ISBN: 978-3-8007-4370-4

Matlok, S.; Eckardt, B.; Seliger, B.; Maerz, M.:

Digital Control of Hard Switched Converters by Phase Modulated Pulse Width Modulation PMPWM

Proceedings of PCIM Europe 2017, International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable
Energy and Energy Management, Nuremberg, May 16 - 18, 2017, VDE Verlag, pp. 592 - 599
ISBN: 978-3-8007-4424-4

Matlok, S.; Erlbacher, T.; Krach, F.; Eckardt, B.:

Switching SiC Devices Faster and More Efficient Using a DBC Mounted Terminal Decoupling Si-RC Element

Materials Science Forum, Vol. 897, 2017, pp. 689 - 692
DOI: 10.4028/www.scientific.net/MSF.897.689

Matthus, C. D.; Erlbacher, T.; Hess, A.; Bauer, A. J.; Frey, L.:

Advanced 4H-SiC p-i-n Diode as Highly Sensitive High-Temperature Sensor Up To 460 °C

IEEE Transaction on Electron Devices Vol. 64, Issue 8, 2017, pp. 3399 - 3404
DOI: 10.1109/TED.2017.2711271

Matthus, C. D.; Erlbacher, T.; Schöfer, B.; Bauer, A. J.; Frey, L.:

Implementation of 4H-SiC Pin-Diodes as Nearly Linear Temperature Sensors up to 800 K towards SiC Multi-Sensor Integration

Materials Science Forum 897 (2017), pp. 618 - 621
DOI: 10.4028/www.scientific.net/MSF.897.618

Matthus, C. D.; Burenkov, A.; Erlbacher, T.:

Optimization of 4H-SiC Photodiodes as Selective UV Sensors

Materials Science Forum, Vol. 897, 2017, pp. 622 - 625
DOI: 10.4028/www.scientific.net/MSF.897.622

Meissner, M.; Haeckel, M.; Friedrich, J.:

A Practical Example of GaN-LED Failure Cause Analysis by Application of Combined Electron Microscopy Techniques

Materials Vol. 10, 2017, pp. 1202
DOI: 10.3390/ma10101202

Menrath, T.; Endres, S.; Zeltner, S.; Matlok, S.; Eckardt, B.:

Mechatronic Design of 2 kW Sic DC/AC Converter with 200 W/inch³

Proceedings of PCIM Europe 2017, International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable
Energy and Energy Management, Nuremberg, May 16 - 18, 2017, VDE Verlag, pp. 550 - 555
ISBN: 978-3-8007-4424-4

Müller, V.; Kaiser, R.; Poller, S.; Sauerteig, D.; Schwarz, R.; Wenger, M.; Lorentz, V.; März, M.:

Introduction and application of formation methods based on serial-connected lithium-ion battery cells

Elsevier Journal of Energy Storage Vol. 14, 2017, Part 1, pp. 56 - 61
DOI: 10.1016/j.est.2017.09.013

Nickel, D.; Stelter, E.; Sültrop, C.; Mittmann, W.; Heiduczek, T.; Hohenner, H.:

Innovative Testing Process for Electric Powertrains

AVERE, The European Association for Electromobility, Proceedings of EVS30 The 30th International Electric Vehicle Symposium & Exhibition, Stuttgart, October 9 - 11, 2017

Onanuga, T.; Rumler, M.; Erdmann, A.:

A physical model for innovative laser direct write lithography

Proceedings of SPIE Advanced Lithography, Vol.10147, Optical Microlithography XXX
DOI: 10.1117/12.2261093

Oriwol, D.; Trempa, M.; Sylla, L.; Leipner, H. S.:

Investigation of dislocation cluster evolution during directional solidification of multicrystalline silicon

Journal of Crystal Growth Vol. 463, 2017, pp. 1 - 9
DOI: 10.1016/j.jcrysgro.2017.01.027

Pai, A.; Reiter, T.; Vodyakho, O.; Yoo, I.; Maerz, M.:

A Calorimetric Method for Measuring Power Losses in Power Semiconductor Modules.

Proceedings of EPE‘17 ECCE EUROPE, The 19th Conference on Power Electronics and Applications (and Exhibition), Warsaw, September 11 - 14, 2017
DOI: 10.23919/EPE17ECCEEurope.2017.8099017

Philipsen, V.; Luong, K. V.; Souriau, L.; Hendrickx, E.; Erdmann, A.; Xu, D.; Evanschitzky, P.; Kruijs, R. W. E. van de; Edrisi, A.; Scholze, F.; Laubis, C.; Irmscher, M.; Naasz, S.; Reuter, C.:

Reducing EUV mask 3D effects by alternative metal absorbers

Proceedings of SPIE Extreme Ultraviolet Lithography VIII, Vol 10143
DOI: 10.1117/12.2257929

Philipsen, V.; Luong, K. V.; Souriau, L.; Erdmann, A.; Xu, D.; Evanschitzky, P.; Kruijs, R. W. E. van de; Edrisi, A.; Scholze, F.; Laubis, C.; Irmscher, M.; Naasz, S.; Reuter, C.; Hendrickx, E.:

Reducing extreme ultraviolet mask three-dimensional effects by alternative metal absorbers

Journal of micro/nanolithography, MEMS and MOEMS Vol. 16, No. 4, 2017, Art. 041002
DOI: 10.1117/1.JMM.16.4.041002

Rommel, M.; Paskaleva, A:

Investigation of High-k Dielectric Stacks by C-AFM: Advantages, Limitations, and Possible Applications

Chapter 4 in: M. Lanza: Conductive atomic force microscopy: applications in nanomaterials, pp. 79-118, Wiley, 2017
ISBN: 9783527340910

Ruccius, B.; Preller, B.; Wagner, B.; Maerz, M.:

An Advanced Control Concept for Modular Multilevel Converter using Capacitor Voltage Estimation

Conference Paper of SPEC 2017, 3rd Annual Southern Hemisphere Power Electronics Conference, Puerto Varas, Chile,
December 4 - 7, 2017

Rumler, M.; Förthner, M.; Baier, L.; Evanschitzky, P.; Becker, M.; Rommel, M.; Frey. L.:

Large area manufacturing of plasmonic colour filters using substrate conformal imprint lithography

Nano Futures 1, 2017, Art. 015002-1-12
DOI: 10.1088/2399-1984/aa6560

Schöck, J.; Büttner, J.; Rommel, M.; Erlbacher, T.; Bauer, A.J.:

4.5 kV SiC Junction Barrier Schottky Diodes with Low Leakage Current and High Forward Current Density

Materials Science Forum Vol. 897, 2017, pp. 427 - 430
DOI: 10.4028/www.scientific.net/MSF.897.427

Schriefer, T.; Hofmann, M.:

Dynamic Mechanical Analysis of a Power Electronic Gate Driver Board

Proceedings of CMAME-IEEE 2017, 5th International Conference on Mechanical, Automotive and Materials Engineering,
Guangzhou, China, August 1 - 3, 2017

Schyr, C.; Stelter, E.; Sültrop, C.; Wild, C.; Heiduczek, T.:

Connected Testing of Electric Powertrains

Proceedings of 7th International Symposium on Development Methodology, Wiesbaden, November 14 - 15, 2017

Sorgenfrei, T.; Jauß, T.; Friedrich, J.; Reimann, C.; Cröll, A.:

The Critical Growth Rate for Particle Incorporation during the Directional Solidification of Solar Silicon under Microgravity

International Journal of Microgravity Science and Application, Vol. 34, Issue 1, 2017, pp. 340115-1 - 340115-8
DOI: 10.15011//jasma.34.340115

Steinberg, C.; Rumler, M.; Runkel, M.; Papenheim, M.; Wang, S.; Mayer, A.; Becker, M.; Rommel, M.; Scheer, H.-C.:

Complex 3D structures via double imprint of hybrid structures and sacrificial mould techniques

Microelectronic Engineering Vol. 176, 2017, pp. 22 - 27
DOI: 10.1016/j.mee.2017.01.009

Steinberger, M.:

Strom aus Abgas

DWV-Mitteilungen Nr. 5/17 Jahrgang 21, Deutscher Wasserstoff- und Brennstoffzellen-Verband e. V, 2017, pp. 21
ISSN 1619-3350

Steinberger, M; Barrett, S.:

Fraunhofer uses semiconductor process exhaust in fuel cell

Fuel Cells Bulln 2017 (8), Elsevier Ltd, S. 13., Oxford, 2017
DOI: 10.1016/S1464-2859(17)30304-8

Stockmeier, L.; Lehmann, L.; Miller, A.; Reimann, C.; Friedrich, J.:

Dislocation formation in heavily As-doped Czochralski grown silicon

Crystal Research&Technology. 1600373, Vol 52, Issue 8, 2017, pp. 1 - 6
DOI: 10.1002/crat.201600373

Tao, Y.; Sorgenfrei, T.; Jauß, T.; Cröll, A.; Reimann, C.; Friedrich, J.; Derby, J. J.:

Particle engulfment dynamics under oscillating crystal growth conditions

Journal of Crystal Growth Vol. 468, 2017, pp. 24 - 27
DOI: 10.1016/j.jcrysgro.2016.10.049

Trempa, M.; Kupka, I.; Kranert, C.; Lehmann, T.; Reimann, C.; Friedrich, J.:

Evolution of grain structure and recombination active dislocations in extraordinary tall conventional and high performance multi-crystalline silicon ingots

Journal of Crystal Growth Vol. 459, 2017, pp. 67 - 75
DOI: 10.1016/j.jcrysgro.2016.11.030

Trempa, M.; Hinderer, M.; Kupka, I.; Reimann, C.; Friedrich, J.; Czurratis, P.:

In-situ measurement of the solid-liquid interface during the growth of silicon ingots by the ultrasonic sound method

Proceedings of 33th European Photovoltaic Solar Energy Conference and Exhibition 2017, pp. 491 - 494
DOI: 10.4229/EUPVSEC20172017-2AV.1.10

Trempa, M.; Kupka, I.; Kranert, C.; Reimann, C.; Friedrich, J.:

HPM silicon: The next generation of multicrystalline silicon for PV

Photovoltaics International Vol. 35, Issue 04, 2017, pp. 36 - 41

Wunder, B.; Ott, L.; Kaiser, J.; Gosses, K.; Schulz, M.; Fersterra, F.; Han, Y.; Lavery, M.; März, M.:

Droop Controlled Cognitive Power Electronics for DC Microgrids

Proceedings of INTELEC 2017, IEEE International Telecommunications Energy Conference, Gold Coast, Australia,
October 22 - 26, 2017, ISBN: 978-1-5386-1018-3
DOI: 10.1109/INTLEC.2017.8214158

Yu, L.; Kochetov, S.; Smazinka, T.; Lindemann, A.:

Characterizing the conducted EMI performance of a power module through passive measurement

Proceedings of PCIM Europe 2017, International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable
Energy and Energy Management, Nuremberg, May 16 - 18, 2017, VDE Verlag, pp. 1517-1523
ISBN: 978-3-8007-4424-4

Zoerner, A.; Oertel, S.; Schmitz, B.; Lang, N.; Jank , M.; Frey, L.:

Determination of the Selectivity of Printed Wearable Sweat Sensors

Proceedings of BIOSTEC 2017, 10th International Joint Conference on Biomedical Engineering Systems and Technologies, Porto, POR, February 21 - 23, 2017, pp. 81 - 87
DOI: 10.5220/0006296400810087

Zoerner, A.; Oertel, S.; Jank, M.; Frey, L.; Langenstein, B.; Bertsch, T.:

Human Sweat Analysis Using a Portable Device Based on a Screen-Printed Electrolyte Sensor

Electroanalysis Vol. 30, Issue 4, 2017, pp. 665 - 671
DOI: 10.1002/elan.201700672