Colloquium / January 24, 2022, 17:15 h
Colloquium on Semiconductor Technology and Metrology
Advances in the Reliability of Metallized Ceramic Substrates for Power Modules
January 24, 2022, 17:15 h, online
Participation via MS Teams (no installation is required, running via browser is supported!)
Direct Bonded Copper (DBC) and Active Metal Brazing (AMB) substrates provide an outstanding thermal performance to spread and dissipate waste heat from power semiconductor devices. They also should not impair the lifetime of multichip power modules and therefore must survive thermo-mechanical stress under operation. The substrate design is critical to optimize its resistance to thermal cycling conditions. A selection guide and a novel design approach for enhanced performance of metallized ceramic substrates will be presented.
Thermal Cycling Tests for Metallized Ceramic Substrates – Accelerating the Acceleration by Simulation
Sebastian Letz, Fraunhofer IISB, Erlangen
The steadily increasing trend of the power density in power electronics drives the lifetime and reliability requirements for metallized ceramic substrates. In turn, substrate design and accelerated lifetime testing are getting more and more complex. Numerical field simulation can help understanding the complex structure-property-lifetime-/reliability relations. A finite-element-method based simulation approach for studying the acceleration of thermal cycling tests with metallized ceramic substrates will be presented.