EnCN - M2C - Demonstrator

Novel Design Concept for Modular Multilevel Converter Sub-Modules

 

HV-M2C-submodules comprise:

  • DC-capacitor
  • Half bridge power module (6.5 kV)


Special boundary conditions in M2C topology:

  • M2C-submodules are insulated against each other
  • Free choosing of reference potential (i.e. local GND)


Novel design concept:

  • Not needed thermal/electrical insulation barriers removed
  • TOP-semiconductors directly mounted onto intermediate plate for best thermal resistance possible
  • Cu-bus bars as top-side contact (intrinsic explosion proof)
  • No bypass thyristor (installed for surge currents in fault cases), removed by robust diode design
  • No thermal interface material such as grease used


Benefits:

  • Excellent thermal resistance for the power devices
  • Lowest chip area for low cost, small overall size
  • Saving of modul and auxilliary components
  • Lower control effort (no thrysistor)
  • Higher operational reliability

 

 

© Fraunhofer IISB
Power modules for modular multilevel converters - BOT switch
© Fraunhofer IISB
Power modules for modular multilevel converters - BOT switch
Power modules for modular multilevel converters - TOP switch
© Fraunhofer IISB
Power modules for modular multilevel converters - TOP switch