Fraunhofer Institute for Integrated Systems and Device Technology IISB
Fraunhofer Institute for Integrated Systems and Device Technology IISB

Technology & Manufacturing

Bridging the Gap from Material to Application

Technology stands above all for research and development in the field of electronic devices for CMOS as well as for power applications.

From micro-technology to printable macro-electronics, the Technology Department is your contact for the realization and characterization of single process steps and devices up to prototypes. Based on comprehensive cleanroom facilities, silicon, as well as silicon-carbide processing, forms the backbone of the technology.

Examples for current activities aresensor devices on Si, fabrication of advanced integrated power devices on SiC, or low-temperature depositions of inorganic materials by printing techniques. The heterogeneous integration of various technologies is currently acquiring more and more importance.

Focus Areas

 

π-Fab

The purpose of π-Fab is the fabrication of custom-tailored prototype electron devices – a prototyping service comprising a continuous silicon CMOS and silicon carbide process line in an industry-compatible environment.

π-Fab
 

Thin-Film Systems

Research into large-area and flexible electronics bases on our know how in materials and deposition techniques. The system integration includes connectivity and optimization of energy efficiency.

Our key applications are printed ion sensors for wearables and agricultural purpose as well as metal oxide TFT technologies for high frequency electronics and advanced display technologies.

Thin-film Systems
 

Contamination &
Manufacturing Control

Advanced contamination control methods and development of smart manufacturing concepts. Analytical techniques and sample preparation methods are being developed or adapted to provide emerging solutions for contamination control to our partners. In the field of manufacturing control our focus is on flexible manufacturing planning methodologies and control concepts to optimize the full process chain regarding productivity, costs and resource efficiency.

Contamination & Manufacturing Control
 

Nanopatterning &
Characterization

Development and fabrication of customized micro- and nanostructures by UV-nanoimprint lithography or focused ion beam (FIB) based nanopatterning process chains for your applications. We offer service and development in the fields of FIB and scanning probe microscopy (SPM) based analysis as well as electrical contamination analysis such as carrier lifetime measurements or DLTS for process control or material characterization.

Nanopatterning & Characterization

GMM User Groups

 

The IISB is cooperating Partner within the 'GMM-VDI/VDE-Gesellschaft' and engages specifically within the following working groups:  

 

Special Services & Solutions

 

Prototype Fabrication

π-Fab

To focus more on facility services for customers, the service sector was reorganized in a separate organization unit called π-Fab. The purpose of π-Fab is the fabrication of custom-tailored prototype electron devices – a prototyping service comprising a continuous silicon CMOS and silicon carbide process line in an industry-compatible environment.  

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Our Infrastructure for Your Projects

The IISB is equipped with high-class laboratories, including cleanrooms for semiconductor technologies, facilities for packaging, reliability tests and crystal growth as well as electronic labs. All of which aim to match our customers’ individual needs by providing custom-tailored solutions.

 

Custom-tailored SiC

SiC-Services

We offer R&D Services ranging from material development and prototype devices to module assembly and mechatronic systems, by making use of 4H-SiC’s unique semiconductor properties. Design studies, feasibility tests, proofs of concept, or prototype fabrication make up only part of what IISB’s interdisciplinary toolbox has to offer.

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Publications

 

Brochures

 

Explore the Entire Power Electronic Systems Value Chain

Intelligent Energy Systems
Energy Technologies
Vehicle Electronics
Packaging & Reliability
Materials
Devices
Modeling and Artificial Intelligence