Workshop "Automatisierte Prozesskontrolle (APC) für neue Prozesse und Materialien"

November 27/28, 2002

Fraunhofer IISB, Erlangen

Automatisierte Prozesskontrolle (APC) für neue Prozesse und Materialien

Neue Materialien

Trends in process control - an overview of APC
Dr. Claus Schneider, Fraunhofer IISB, Erlangen, Germany

MOCVD of advanced materials - A survey of the latest achievements on production processes and equipment
Dr. Marcus Schumacher, Aixtron AG, Aachen, Germany

Atomic Layer Chemical Vapor Deposition technologies for the 90 nm technology node and beyond
Dr. Jan Willem Maes, ASM Europe bv, Bilthoven, The Netherlands

Pulsed deposition of ultra thin tungsten and its application for plug fill of high aspect ratio contacts
Michael Woitge, Novellus Systems GmbH, Dresden, Germany

Copper-, barrier-, seed-layers: New deposition techniques
Uwe Richter, Applied Materials GmbH, Dresden, Germany

Diffusion barrier deposition technologies for W-plug and Cu/low k systems
Dr. Stephen Burgess, Trikon Technologies Ltd., Newport, United Kingdom

Prozessverbesserungen durch APC

APC at Infineon
Dr. Hans-Peter Erb, Infineon Technologies AG, Munich, Germany

Implementation and experiences with APC in CPD (CVD+PVD)
Karl Hörmann, Infineon Technologies AG, Munich, Germany

APC applications etch, CVD at Infineon Vi
Dr. Michael Holzinger, Infineon Technologies AG, Villach, Austria

Plasma process simulation for APC
Prof. Dr. rer. nat. Ralf Peter Brinkmann, Ruhr-Universität Bochum, Bochum, Germany