Workshop "Trends in PECVD, PVD, and etch unit processes"

November 25, 2004

Fraunhofer IISB, Erlangen

Trends in PECVD, PVD, and etch unit processes

Trends in unit processes

Thermo-mechanical properties of Cu
Manfred Schneegans, Infineon Technologies AG, Munich, Germany

New SiC passivation layers
Robert Mücke, Infineon Technologies AG, Regensburg, Germany

High rate anisotropic & isotropic silicon etches for MEMS & related applications
Nick Appleyard, Trikon Technologies Ltd., Newport, UK

Process metrology and optimization

M2/Al defect reduction at the Endura TM system
Oliver Witnik, Applied Materials, Dresden, Germany

Wafer Current Measurement (WCM) - a novel etch process monitoring technology
Stefano Ventola, Applied Materials GmbH, Dresden, Germany

Enhancing STI process integration and control using embedded large spot size spectral reflectometry
Ayelet Dag, TEVET - Process control tech. Ltd., Yokneam, Israel

Unit process aspects for APC software
Georg Roeder (1), Martin Schellenberger (1), Gerhard Spitzlsberger (2)
(1) Fraunhofer IISB, Erlangen, Germany, (2) Renesas Semiconductor Europe GmbH, Landshut, Germany

SEMI Standardization
Gerhard Kleineidam, InReCon AG, Sinzing, Germany