Workshop "New developments in deposition and etching"

November 26, 2009

Fraunhofer IISB, Erlangen

New developments in deposition and etching

Investigation of CVD-TiN layers for high aspect ratios
Dr. Günther Ruhl, Infineon Technologies AG, Regensburg, Germany

Microwave based high-density plasma oxidation of silicon
Dr. Alexander Gschwandtner, R3T GmbH, Taufkirchen (Munich), Germany

Assessment of thin film deposition equipment
Dr. Georg Roeder, Fraunhofer IISB, Erlangen, Germany

Influence of Cu-electrolyte composition on void formation at Cu-SnAg solder joints
Dr. Werner Robl, Infineon Technologies AG, Regensburg, Germany

Defect Density Issues Associated with Plasma Etching of MEMS
Dr. Georg Ehrentraut, Infineon Technologies AG, Villach, Austria

Characterization of thin dielectric films using advanced electrical AFM techniques
Dr. Vasil Yanev, Fraunhofer IISB, Erlangen, Germany

Virtual Equipment Engineering using the example of layer deposition reactors
Matthias Koitzsch, Fraunhofer IISB, Erlangen, Germany

Advanced process control - concept and examples
Dr. Johann Straßer, Landshut Silicon Foundry GmbH, Landshut, Germany

Introdution of the ENIAC project IMPROVE
Matthias Wolf, Fraunhofer IISB, Erlangen, Germany