Workshop "New developments in deposition and etching"

December 8, 2010

Fraunhofer IISB, Erlangen

New developments in deposition and etching

Phase change materials by atomic vapor deposition
Dr. Peter K. Baumann, AIXTRON AG, Aachen, Germany

Characterization of mechanical properties of dielectrics
Helmut Schönherr, Infineon Technologies Austria AG, Villach, Austria

Introduction to ultra-thin layer characterization by vacuum ultraviolet reflectometry
Thomas Gumprecht, Fraunhofer IISB, Erlangen, Germany

Simulation of dry-etching processes on substrate and mask level
Oliver Rudolph, Fraunhofer IISB, Erlangen, Germany

Spray coated 150mm/200 mm ceramic electro static chucks (ESC) for wafer-less clean
Joos Hanssen, CE-MAT GmbH, Freigericht, Germany

Plasma etching processes for future solar cell concepts
Matthias Uhlig, Roth & Rau AG, Hohenstein-Ernstthal, Germany

Selected PECVD-technologies for photovoltaic applications
Joachim Mai, Roth & Rau AG, Hohenstein-Ernstthal, Germany

Non-contact handling: The key technology for gripping parts with damageable surfaces

Dr. Michael Schilp, Zimmermann & Schilp Handhabungstechnik GmbH, Regensburg, Germany

Analytical methods for photovoltaic and semiconductor processes
Rudolf Huber, SemiSol Analytik GmbH, Munich, Germany