Workshop "New developments in deposition and etching"

December 7, 2011

Fraunhofer IISB, Erlangen

New developments in deposition and etching

300mm: Isotropic Dielectric Etch
Helmut Brunner, Infineon Technologies Austria AG, Villach, Austria

Process optimization/characterisation by use of statistical methods
Georg Ehrentraut, Infineon Technologies Austria AG, Villach, Austria

Developments in the etching of strongly-bonded materials for MEMS applications
Anthony Barker, SPTS Technologies GmbH, Dresden, Germany

Thermal Laser Separation and its Applications
Matthias Koitzsch, Fraunhofer IISB, Erlangen, Germany

Advanced Collar etch and AR dependency 
Lothar Brencher, Infineon Technologies Dresden GmbH, Dresden, Germany

PECVD of amorphous carbon: deposition and integration aspects
Mirko Vogt, Infineon Technologies AG, Regensburg, Germany

Integration aspects of Cu metallization for More than Moore applications
Werner Robl, Infineon Technologies AG, Regensburg, Germany

VUV Reflectometry – an update on the methodology and its applications
Thomas Gumprecht, Fraunhofer IISB, Erlangen, Germany

IMPROVE – A joint European effort to enhance efficiency in semiconductor manufacturing
Martin Schellenberger, Fraunhofer IISB, Erlangen, Germany

Virtual metrology and predictive maintenance: Novel methods for equipment control
Ulrich Schöpka, Georg Roeder, Fraunhofer IISB, Erlangen, Germany