Workshop "MEMS, neue Entwicklungen beim Abscheiden und Ätzen"

December 13, 2012

Fraunhofer IISB, Erlangen

New developments in deposition and etching

Bosch etching for high volume silicon removal in MEMS applications
Markus Menath, Infineon Technologies Austria AG, Villach, Austria

Silicon etch solutions for emerging MEMS device fabrication and advanced packaging technologies
Dave Thomas, SPTS Technologies GmbH, Dresden, Germany

Isotropic dielectric etches for power semiconductors
Joachim Hirschler, Infineon Technologies Austria AG, Villach, Austria

Atomistic Simulation of Cu Metallization
Manfred Schneegans, Infineon Technologies AG, Munich, Germany

Atomistic Modeling for the Electronics Industry - An Overview
Volker Eyert, Materials Design, Montrouge, France

Influence of PE-SiH4 interlayer oxide deposition on Bi-polar transistor performance
Michael Woittennek, X-FAB Dresden GmbH & Co. KG, Dresden, Germany

Second source process kit hardware for semiconductor manufacturing equipment
Walter Nadrag, Sico Technology GmbH, Bleiberg-Kreuth, Austria

Framework for Integration of Virtual Metrology and Predictive Maintenance
Georg Roeder, Fraunhofer IISB, Erlangen, Germany

Application of Predictive Maintenance for semiconductor manufacturing equipment
Ulrich Schöpka, Fraunhofer IISB, Erlangen, Germany