Workshop "New developments in deposition and etching"

November 27, 2014

Fraunhofer IISB, Erlangen

New developments in deposition and etching

Model-based and robust process control of plasma processes in manufacturing - from dry clean to plasma modes in ICP etchers
Michael Klick, Plasmetrex GmbH, Berlin, Germany

Influence of wafer bevel geometry on wafer etch performance
Neil Hendry, Lam Research Corp., United Kingdom

Extending Capabilities of Etch and ‎Deposition Technologies for 3D Packaging of MEMS in Volume Production
Chris Jones, SPTS Ltd., Newport/Wales, United Kingdom

Twin Chamber Endpointing with Spectral Analyser on 300mm Isotropic Plasma Etcher
Joachim Hirschler, Infineon Technologies Austria AG, Villach, Austria

In-situ monitoring and process tuning methods for compound semiconductor etch processes
Ralph-Stephan Unger, SENTECH Instruments GmbH, Berlin, Germany

TRUPLASMA RF 1000 SERIES: Drop in replacement - RF 13.56 MHz Generators
Gerd Hintz, TRUMPF Hüttinger GmbH + Co. KG, Freiburg i. Br., Germany

Introduction of an innovative water based photoresist stripping process using intelligent fluids

Matthias Rudolph, Fraunhofer IPMS - business unit Center Nanoelectronic Technologies (CNT), Dresden, Germany

SiGe BiCMOS and InP Heterointegration for mm-Wave Circuits in a Back-End-of-Line Approach
Marco Lisker, IHP GmbH, Frankfurt (Oder), Germany

Overview and R&D results of the European Semiconductor Equipment Assessment Project - SEA4KET
Markus Pfeffer, Fraunhofer IISB, Erlangen, Germany