Workshop "Plasma dicing, New developments in deposition and etching"

December 9, 2015

Fraunhofer IISB, Erlangen

Plasma dicing, New developments in deposition and etching

The Benefits & Challenges of Plasma Dicing
Richard Barnett, SPTS Ltd., Newport/Wales, United Kingdom

Plasma Dicing 4 Thin Wafers
Reinhard Windemuth, Panasonic Automotive & Industrial Systems Europe GmbH, Ottobrunn, Germany

Plasma dicing: From Powerpoint to Production
Tobias Sprogies, NXP Semiconductors Germany GmbH, Hamburg, Germany

Plasma dicing trench depth and width, copper step height and roughness measurements with an optical profilometer

Franz Heider, Infineon Technologies Austria AG, Villach, Austria

Fabrication of ultra-thin layers by sputtering
Berthold Ocker, Singulus Technologies AG, Kahl am Main, Germany

Electronic Conduction in PECVD Silicon Nitride
Helmut Schönherr, Daniel Pieber, Infineon Technologies Austria AG, Villach, Austria; TU Graz, Graz, Austria

Nickelsilicide integration into SiGe-BiCMOS and comparison to Cobaltsilicide
Dirk Wolansky, IHP GmbH, Frankfurt (Oder), Germany

End-point control in CVD cleaning processes

Anett von Dalowski; Jerome Cannon, SPM AG, Schaan, Liechtenstein; Forth-Rite Technologies, LLC., Austin, Texas, USA

Classification and key feature extraction for equipment health monitoring in plasma etching
Christopher Krauel, Fraunhofer IISB, Erlangen, Germany