Services

IISB's in-house brand for development and manufacturing of individual prototypes, characterized by flexibility regarding process steps, wafer sizes and entry/exit point.  

Experience-based, custom-tailored SiC-Services offering one-stop solutions, which cover the whole process chain, from material to device, module and system.  

As demonstrated by various R&D projects in collaboration equipment suppliers and semiconductor manufacturers all over Europe, Fraunhofer IISB offers its expertise in the field of data-driven production optimization under the trademark 'Dr. Production'. 

Fraunhofer IISB's very own in-house facility for testing of electronic vehicles, located at the institute's headquarter in Erlangen.  

With foxBMS, Fraunhofer IISB delivers the first generation of its open source battery management system (BMS) research and development platform.
It includes all necessary hardware and software for nearly any kind of mobile and stationary application that uses modern rechargeable electrochemical energy storage systems. Furthermore FoxBMS is designed to manage high- performance prototypes of advanced and innovative lithium-ion battery systems of any size.

Safety, performance, and reliability of your components under any condition.

We offer you a comprehensive service from system design to module design, electronics construction and service life analysis for your aerospace components.

Leistungszentrum Elektroniksysteme (LZE) is a cooperation of Fraunhofer Gesellschaft, its Institutes IIS and IISB, the Friedrich-Alexander-Universität of Erlangen-Nürnberg (FAU) as well as further research and industry partners.

LZE offers a unique environment for high-class research on electronic systems.

Failure-Analysis of Electronic Devices and Systems

Environmental Testing, Corrosion and Failure Analysis

from System to Chip Level

Lifetime Prediction for Power Electronic Assemblies

Lifetime Testing and Characterization in Capacitors

Equipment and processes for the production of crystalline bulk and layer materials for electronics, comprising silicon, wide-band-gap semiconductors (e.g., SiC, GaN), materials for optical applications, detectors, and energy technology.

Temperature dependent characterization of mechanical properties of power electronic materials, material property mapping and thermal analysis of materials. Testing methods and tools range from, nanoindentation, tensile and compression testing to focused ion beam sectioning and Simultaneous thermal analysis (STA).

Research into large-area and flexible electronics bases on our know how in materials and deposition techniques. The system integration includes connectivity and optimization of energy efficiency.

Our key applications are printed ion sensors for wearables and agricultural purpose as well as metal oxide TFT technologies for high frequency electronics and advanced display technologies.