Detailed specifications as well as test plans and procedures for the respective system components are initially developed.
The assembly options include the use of different material combinations as well as different assembly and connection methods.
In the Aerospace Test Lab soldering, sintering (also pressureless), different bonding techniques and the connection by vias are used. The development and design of cooling concepts, as well as insulation coordination, are part of the electronics design.
In addition to the encapsulation of modules (e.g. silicone encapsulation), high-temperature capable layers can be applied (e.g. parylene), which provide high insulation strength and
Using standardized or specially tailored tests, different environmental conditions in different application areas (indoor, outdoor, off-shore, aerospace, etc.) are simulated.
In the Aerospace Test Lab we test humidity, temperature, pressure, noxious gasatmosphere.
In addition, aggressive ions can be simulated and system components or entire systems can be aged more quickly.
Various test equipment such as climatic chambers, thermal shock chambers, harmful gas chambers and salt spray chambers are available for this purpose. It is also possible to investigate the influence of different voltage loads in combination with other parameters.
Analysis & Life Cycle Model
The analysis of different system components before and after targeted ageing as well as from field returns can be performed using optical microscopes, scanning electron microscopes (SEM) and energy dispersive X-ray spectroscopy (EDX) as well as X-ray photoelectron spectroscopy (XPS) and microcomputer tomography (µ-CT). In order system components, components or modules can be demolded. Various etching processes and laser removal of the moldmass are available for this purpose.