Essential mission parameters are created in consultation with the customer. A rough concept of the component is developed and requirements for the system components are derived. The necessary specifications are examined at system level.
When designing the system components, the designed components are reproduced as realistically as possible. The 3D models created provide a comprehensive overview of the freedoms and limits of concept design. Design errors and estimates of the complexity of the electronic assembly can already be derived from this phase.
Various system properties (temperature distribution, moisture diffusion, mechanical stress, etc.) are simulated, which makes it possible to make improvements to the system components and to make corrections to the design.
Weak points can thus be discovered and eliminated at an early stage.
Detailed specifications as well as test plans and procedures for the respective system components are initially developed.
The assembly options include the use of different material combinations as well as different assembly and connection techniques.
In the Aerospace Test Lab soldering, sintering (also pressureless), different bonding techniques and the connection by vias are used. The development and design of cooling concepts, as well as insulation coordination, are part of the electronics design.
In addition to the encapsulation of modules (e.g. silicone encapsulation), high-temperature capable layers can be applied (e.g. parylene), which provide high insulation strength and corrosion resistance.
Using standardized or specially tailored tests, different environmental conditions in different application areas (indoor, outdoor, off-shore, aerospace, etc.) are simulated.
In the Aerospace Test Lab we test humidity, temperature, pressure, noxious gasatmosphere. In addition, aggressive ions can be simulated and system components or entire systems can be aged more quickly.
Various test equipment such as climatic chambers, thermal shock chambers, harmful gas chambers and salt spray chambers are available for this purpose. It is also possible to investigate the influence of different voltage loads in combination with other parameters.
The analysis of different system components before and after targeted ageing as well as from field returns can be performed using optical microscopes, scanning electron microscopes (SEM) and energy dispersive X-ray spectroscopy (EDX) as well as X-ray photoelectron spectroscopy (XPS) and microcomputer tomography (µ-CT). In order system components, components or modules can be demolded. Various etching processes and laser removal of the moldmass are available for this purpose.