Fraunhofer Institute for Integrated Systems and Device Technology IISB| AUTHORS | TITLE | TALK | PAPER |
|---|---|---|---|
| Dreher, V.; Joch, D.; Kren, H.; Schwarberg, J.; Jank, M. | Ultrathin and flexible sensors for pressure and temperature monitoring inside battery cells, Presentation held at IEEE Sensors, 30.10.-02.11.2022, Dallas | X | |
| Chen, W.; Berwald, A.; Hauke, A.; Zimmermann, V.; Bayer, C.F.; Jank, M. | Integration of a humidity sensor with power electronic applications, Poster at IEEE Sensors, 30.10.-02.11.2022, Dallas |
X | |
| Bach, L.; Huang, A.; Teng, Y.; Rauh, H.; Schletz, A.; Jank, M.; März, M. |
Embedding Solutions for vertical SiC and GaN Power Devices, Presentation held at WiPDA 2022, 9th Workshop on Wide Bandgap Power Devices & Applications, 07.-09.11.2022, Redondo Beach |
X | |
| Schletz, A.; Endruschat, A.; Heckel, T. | State of the Art Packaging, Presentation held at Anwendertraining zur Wide-Bandgap Systemintegration, 26./27.09.2022, Rüsselsheim |
X | |
| Schletz, A.; Bayer, C.F. ; Hutzler, A. | Temperature Challenges for Integrated Systems due to High Power Density, Presentation held at Anwendertraining zur Wide-Bandgap Systemintegration, 26./27.09.2022, Rüsselsheim | X | |
| Schletz, A. | Testing Wide Band-Gap Devices II (Focus on Packaging), Presentation held at Anwendertraining zur Wide-Bandgap Systemintegration, 26./27.09.2022, Rüsselsheim | X | |
| Gerstner, H. | Vergleich zwischen Hardware- und Simulationsbasiertem Entwicklungsprozess am Beispiel eines Web-Leistungsmoduls, Vortrag gehalten auf dem CADFEM Technologietag "Leistungselektronik, 18. Juni 2021 | X | |
| Brand, S.; Kögel, M.; Altmann, F.; Bach, L. |
Quantitative Assessment of the Porosity in Ag-sintered Joints by non-destructive acoustic Inspection supplemented with a Deep Leaning assisted Signal Analysis, Presentation held at CIPS 2022, 12th International Conference on Integrated Power Electronics Systems 15.-17.03.2022 | X | |
| Yu, Z.; Tan, Y.Z.; Bayer, C.F.; Rauh, H.; Schletz, A.; März, M.; Birlem, O. | Cu-Cu Thermocompression Bonding with Cu-Nanowire Films for Power Semiconductor Die-Attach on DBC Substrates, Institute of Electrical and Electronics Engineers -IEEE-: IEEE 23rd Electronics Packaging Technology Conference, EPTC 2021 : 1st December - 30th December 2021, Virtual Conference, Singapore | X | |
| Yu, Z.; Letz, S.; Bayer, C.F.; Schletz, A.; März, M. | Automated quantitative analysis of void morphology evolution in Ag-Ag direct bondig interface after accelerated aging; Presentation held at 32nd European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, ESREF 2021, 4th - 8th October 2021, Bordeaux, Virtual | X | |
| Chen, W. | Schadgas-Erhebung Europa. ECPE-Projekt "Harmful Gas Requirements for Power Electronics"; Vortrag gehalten beim IISB-Korrosionstag, 11. August 2021, Online | X | |
| Chen, W.; Zimmermann, V.; Bayer, C.F. | Frontier review of the importance to revise existing European environmental classification standards, Corrosion engineering, science and technology : CEST 56 (2021), Nr.7, S.605-609 | X | |
| Bayer, C.F. | Packaging Technologies in Power Electronic Modules @Fraunhofer IISB; Presentation held at 24th CS MANTECH Workshop, May 24-27, 2021 | X | |
| Schletz, A.; Endruschat, A.; Heckel, T. | State of the Art Packaging; Presentation held at ECPE Online Tutorial "Wide-Bandgap User Training", 20.05.2021 | X | |
| Schletz, A.; Friedrich, C.F.; Hutzler, A. | Temperature Challenges for Integrated Systems due to High Power Density; Presentation held at ECPE Online Tutorial "Wide-Bandgap User Training", 20.05.2021 | X | |
| Schletz, A. | Testing Wide Band-Gap Devices II (Focus on Packaging); Presentation held at ECPE Online Tutorial "Wide-Bandgap User Training", 20.05.2021 | X | |
| Zimmermann, V.; Reck, T.; Igel, C.; Bayer C.F. | Analysis of dendritic corrosion phenomena on differently treated power electronic circuit carriers; Presentation held at Climatic Reliability Seminar, 04./05. March 2021 | X | |
| Zhao, C.; Wang, L.; Yang, F.; Zhang, H.; Gan, Y.; Bayer, C.F. | A Compact SiC Power Module for Vienna Rectifiers with Bus-bar like Structure, IEEE 9th International Power Electronics and Motion Control Conference, IPEMC 2020-ECCE Asia. Proceedigs : Nanjing, China, Nov. 29 - Dec. 2, 2020 | X | |
| Bayer, C.F.; Yu, Z.; Bach, L.; Müller, J.; Schletz, A. |
Future Packaging Technologies in Power Electronic Modules, Presentation held at Power Packaging Virtual Forum, 24.11.2020, Virtual | X | |
| Bayer, C.F.; Wagner, S. | Robust converters for renewable energy plants, Fraunhofer VµE - Microelectronics News. Ausgabe 80 : November 2020 | X | |
| Yu, Z.; Zeng, W.; Zhao, D.; Zhang, Z.; Bayer, C.F.; Schletz, A.; März, M. |
Reliability of Silver Direct Bonding in Thermal Cycling Tests; IEEE 8th Electronics System-Integration Technology Conference, ESTC 2020. Proceedings : September 15th to 18th, 2020, Vestfold, Norway | X | |
| Bayer, B.; Groccia, M.; Bach, L.; Bayer, C.F.; Schletz, A.; Lenz, C.; Ziesche, S. | LTCC Embedding of SiC Power Devices for High Temperature Applications over 400 °C; IEEE 8th Electronics System-Integration Technology Conference, ESTC 2020. Proceedings : September 15th to 18th, 2020, Vestfold, Norway | X | |
| Schletz, A. | Testing Wide Band-Gap Devices II (Focus on Packaging) Presentation held at ECPE Tutorial Wide-Bandgap User Training, 22.09.2020, Berlin | X | |
| Schletz, A.; Bayer, C.F.; Hutzler, A. | Temperature Challenges for Integrated Systems due to High Power Density, Presentation held at ECPE Tutorial Wide-Bandgap User Training, 22.09.2020, Berlin | X | |
| Schletz, A.; Endruschat, A.; Heckel, T. | State of the Art Packaging, Presentation held at ECPE Tutorial Wide-Bandgap User Training, 22.09.2020, Berlin | X | |
| Bayer, C.F. | Robuster Umrichter für Erneuerbare Energien, Mikroelektronik Nachrichten (2020), No.80, pp.12 | X | |
| Zeltner, S.; Seliger, B.; Haager, D.; Eckardt, B.; Bach, L.; Yu, Z.; Vater, S.; Bayer, C.F.; Schletz, A.; Umeda, H.; Morita, T. | Advantages and challenges of using sic mosfets in a high power density insulated hv/lv dc/dc converter; PCIM Europe 2020, International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. | X | |
| Rettner, C.; Schiedermeyer, M.; Apelsmeier, A.; Heckel, T.; Diepgen, A.; Dirksen, D.; März, M. | SiC Power Module with integrated RC-Snubber Design for Voltage Overshoot and Power Loss Reduction, International Conference on Integrated Power Electronics Systems (CIPS) 2020, Berlin | X | |
| Yu, Z.; Zeng,W.; Bayer, C.F.; Schletz, A.; März, M. | Application of response surface methodology for optimization of Ag-Ag Direct Bonding for Wafer-Level Power Electronics Packaging, International Conference on Integrated Power Electronics Systems (CIPS) 2020, Berlin | X | |
| Zimmermann, V.; Zoerner, A.; Yu, Z.; Jank, M.; Bayer, C.F.; Schletz, A.; März, M. | Integration of Printed Electronics in Potted Power Electronic Modules, International Conference on Integrated Power Electronics Systems (CIPS) 2020, Berlin | X | |
| Novak, M.; Grübl, W.; Müller, J.; Schletz, A. | Selektives Ag-Sintern auf Organischer Leiterplatte, Elektronische Baugruppen und Leiterplatten, EBL 2020 : 10. DVS/GMM-Fachtagung, 18.-19.02.2020, Fellbach | X | |
Bach L., Yu Z. |
Ceramic Embedding Technologies for High Temperature Power Electronics, Presentation held at ECPE Workshop "Advanced Power Packaging - Power Modules 2.0", 09-10 October 2019, Hamburg, Germany | X | |
| Yu, Z.; Wang, S.; Letz, S.; Bayer, C.F.; Häußler, F.; Schletz, A.; Suganuma, K. | Optimization of Ag-Ag Direct Bonding for Wafer-Level Power Electronics Packaging via Design of Experiments, International Microelectronics and Packaging Society -IMAPS-: International Conference on Electronics Packaging, ICEP 2019. Proceedings : Niigata, Japan, 17-20 April 2019 | X | |
| Diepgen A., Zimmermann V., Bayer C., Zhou Y., Forster C., Leib J., Schletz A., Virtanen S.; März M. | Parylene Coatings in Power Electronic Modules Presentation held at ISAPP 2019, International Symposium on Advanced Power Packaging 2019, October 7&8, 2019, Osaka, Japan | X | |
Bayer C. |
Future Packaging Technologies in Power Electronic Modules, Presentation held at ISAPP 2019, International Symposium on Advanced Power Packaging 2019, October 7&8, 2019, Osaka, Japan | X | |
| Bayer C. | Future Packaging Technologies in Power Electronic Modules, Presentation held at 31st Annual Electronics Packaging Symposium, Binghampton, New York, September 5-6, 2019 | X | |
| Zimmermann V., Diepgen A., Bayer C. | Corrosion in PE Systems - Environmental Testing, Corrosion Detection and Protection, Vortrag ECPE Workshop, Bremen 06.06.2019 | X | |
| Dirksen D. | Optimierung und Qualifizierung eines Bondprozesses. Tests und Analyseverfahren, Vortrag bei der Zestron Academy "Bondbarkeit elektronischer Baugruppen sicherstellen - Auswahl, Parametrierung & Qualitätssicherung", 21. – 22. Mai 2019 | X | |
| Dirksen D. | Bewertung von Bondverbindungen - Möglichkeiten, Normen und Herausforderungen, Vortrag bei der Zestron Academy "Bondbarkeit elektronischer Baugruppen sicherstellen - Auswahl, Parametrierung & Qualitätssicherung", 21. – 22. Mai 2019 | X | |
| Bach L., Dirksen D., Blechinger C., Endres T.M., Bayer C.F., Schletz A., März M. | Stackable SiC Embedded Ceramic Packages for High Voltage and High Temperature Power Electronics Applications , Presentation held at International Conference and Exhibition on High Temperature Electronics Network (HiTEN); 09.07.2019, Oxford | X | |
| Schletz A. | Testing Wide Band-Gap Devices II (Focus on Packaging); Presentation held at ECPE Tutorial Wide-Bandgap User Training, 27.02.2019, Graz, Austria | X | |
| Schletz A., Bayer C., Hutzler, A. | Temperature Challenges for Integrated Systems due to High Power Density, Presentation held at ECPE Tutorial Wide-Bandgap User Training, 27.02.2019, Graz, Austria | X | |
| Schletz A., Endruschat A. Heckel T. | State of the Art Packaging, Presentation held at ECPE Tutorial Wide-Bandgap User Training, 27.02.2019, Graz, Austria | X | |
| Bayer C.F. | Elektrochemische Korrosion, Fraunhofer IISB AKTUELL 4.2018 | X | |
| Kraft S. | Entwicklung und Charakterisierung eines doppelseitig gekühlten leistungselektronischen Moduls, Verteidigung zur Promotion an der Friedrich-Alexander-Universität Erlangen. Mündliche Prüfung am 12.12.2018 | X | |
| Yu Z., Zeltner S., Boettcher N., Rattmann G., Leib J., Bayer C.F., Schletz A., Erlbacher T., Frey L. | Heterogeneous integration of vertical GaN power transistor on Si capacitor for DC-DC converters, Presentation held at ESTC 2018, IEEE 7th Electronics System-Integration Technology Conference, September 18th-21st, 2018, Dresden, Germany | X | X |
| Bayer C.F., Frey, L. | Untersuchung der elektrischen Feldstärke und des Teilentladungsverhaltens an keramischen Schaltungsträgern, Dissertation 2018 | X | |
| Bayer, C.F. | Simulation in power electronics design. Simulation, possibilities, and issues; Presentation held at SEMICON West 2018, July 10-12, 2018, San Francisco, California | X | |
| Bayer C.F., Kokot A., Filippi T., Hutzler A., Fuchs C., Wüstefeld S., Kellner S., Diepgen A., Zimmermann V. | Environmental testing, corrosion, failure analysis. Power electronics in harsh environments; Presentation held at SEMICON West 2018, July 10-12, 2018, San Francisco, California | X | |
| Bayer C.F. | Electrochemical Corrosion in Power Modules due to Harsh Environments, Semicon West, San Francisco 09.-12.07.2018 | X | |
| Bayer C.F. | FEM-Simulation in Designing new Power Modules; Semicon West, San Francisco 09.-12.07.2018 | X | |
| Bayer C.F. | Power Electronics Packaging at Fraunhofer IISB – Double Sided Cooling, Ceramic Embedding, and more; Semicon West, San Francisco 09.-12.07.2018 | X | X |
| Schletz A. | Power Interconnect Trends - Cost Savings for PCB Power Electronics by Enabling Wear Out; Presentation held at Schweizer Electronic Power and Radar PCB Summit 27./28.06.2018 | X | |
| Schletz A. | State of the Art Packaging, Anwendertraining zur Wide-Bandgap Systemintegration, 25./26.06.2018 Bremen | X | |
| Schletz A. | Herausforderungen durch hohe Leistungsdichte (hohe Temperaturen) bei integrierten Systemen, Anwendertraining zur Wide-Bandgap Systemintegration, 25./26.06.2018 Bremen | X | |
| Schletz A. | Testen von WBG-Bauelementen II (Fokus: Aufbau- & Verbindungstechnik, Anwendertraining zur Wide-Bandgap Systemintegration, 25./26.06.2018 Bremen | X | |
| Bach H.L., Endres T., Dirksen D., Zischler S., Bayer C.F., Schletz A., März M. | Ceramic Embedding as Packaging Solution for Future Power Electronic Applications, IPEC Niigata, Japan, 20.-24. Mai 2018 | X | |
| Bayer C.F., Diepgen, A., Filippi, T., Fuchs, C., Wüstefeld, S., Kellbner, S., Waltrich, U., Schletz, A. | Electrochemical Corrosion on Ceramic Substrates for Power Electronics - Causes, Phenomenological Description, and Outlook, CIPS 2018 – 10th International Conference on Integrated Power Electronics Systems, Stuttgart, 19.-22.03.2018 | X | |
| Bach, H.L., Zechun, Y., Letz, S., Bayer, C.F., Waltrich, U., Schletz, A., März, M. | Vias in DBC Substrates for Embedded Power Modules, CIPS 2018 – 10th International Conference on Integrated Power Electronics Systems, Stuttgart, 19.-22.03.2018 | X | |
| Waltrich, U., Bayer, C.F., Zötl, S., Zischler, S., Tokarski, A., Schletz, A., März, M. | High Reliable Power Modules by Pressureless Sintering, CIPS 2018 – 10th International Conference on Integrated Power Electronics Systems, Stuttgart, 19.-22.03.2018 | X | |
| Dresel, F., Tham, N., Erlbacher, T., Schletz, A. | Lifetime Testing Method for Ceramic Capacitors for Power Electronics Applications, CIPS 2018 – 10th International Conference on Integrated Power Electronics Systems, Stuttgart, 19.-22.03.2018 | X | |
| Bayer, C. F.; Kokot, A.; Filippi, T.; Hutzler, A.; Fuchs, C.; Wüstefeld, S.; Kellner, S.; Diepgen, A.; Zimmermann, V. | Korrosion in leistungselektronischen Modulen, GMM-Fachgruppe 1.2.6 "Prozesskontrolle, Inspektion & Analytik" am 15. März 2018 | X | |
| Schletz A., Endruschat A., Heckel T. | State of the Art Packaging, ECPE Tutorial Wide-Bandgap User Training, Barcelona, 21.11.2017 | X | |
| Schletz A., Bayer, C.F., Hutzler, A. | Temperature Challenges for Integrated Systems due to High Power Density, ECPE Tutorial Wide-Bandgap User Training, Barcelona, 21.11.2017 | X | |
| Schletz A. | Testing Wide Band-Gap Devices II (Focus on Packaging), ECPE Tutorial Wide-Bandgap User Training, Barcelona, 21.11.2017 | X | |
| Schletz A. | Future challenges in WBG packaging and testing, Leistungselektronik - Fraunhofer Innovationscluster, 23.10.2017, Erlangen | X | |
| Schletz A., Endruschat A., Heckel T. | Verfügbare Gehäuse- und Modulformen, Cluster Leistungselektronik Anwendertraining zur Wide-Bandgap Systemintegration, Nuremberg, 06.07.2017 | X | |
| Schletz A., Bayer, C.F., Hutzler, A. | Herausforderungen durch hohe Leistungsdichte (Temperaturen) bei integrierten Systemen, Cluster Leistungselektronik Anwendertraining zur Wide-Bandgap Systemintegration, Nuremberg, 06.07.2017 | X | |
| Schletz A. | Testen von WBG-Leistungselektronik Power Cycling Challenges for WBG, Cluster Leistungselektronik Anwendertraining zur Wide-Bandgap Systemintegration, Nuremberg, 06.07.2017 | X | |
| Schletz A., Bayer, C.F., Bach L. | Fehlermechanismen keramischer Isoliersubstrate, ECPE Cluster Workshop, Nuremberg, 27.06.2017 | X | |
| Waltrich U., Zötl S., Bayer C.F. | Langlebige Leistungsmodule mit druckloser Silbersintertechnik, Leistungselektronik , Fraunhofer Innovationscluster, 22.05.2017, Erlangen | X | |
| Bayer C.F. | Erstellen von Ersatzschaltbildern durch Parameterextraktion zur Optimierung der parasitären Eigenschaften von Schaltungen, ECPE Cluster-Schulung – Simulation in der Leistungselektronik, Nuremberg, 13-October-2016 | X | |
| Bayer C.F., Rosskopf A. | Grundlagen in der Simulation – Basics, Dos, and Don’t’s, ECPE Cluster-Schulung – Simulation in der Leistungselektronik, Nuremberg, 13-October-2016 | X | |
| Müller N., Schletz A., Bayer C.F., Tokarski A., März M. | Graphit zwischen Chip und keramischen Schaltungsträgern – Einbindung und Auswirkung von Graphit im leistungselektronischen Aufbau, PLUS – Fachzeitschrift für Leiterplatten und Elektronik, 12/2016 | X | |
| Bayer C.F. | HV-Leistungsmodule-Verbesserung der Teilentladungs-Einsatzspannung in keramischen Schaltungsträgern, 56. Treffen des Arbeitskreises „Systemzuverlässigkeit von Aufbau- und Verbindungstechnologien“, Berlin, 10-February-2016 | X | |
| Waltrich U., Ruccius B., Malipaard D., Schletz A., März M. | Dimensioning of a Novel Design Concept for MMC submodules, CIPS, Nürnberg 2016 | X | |
| Bayer C. F., Waltrich U., Schneider R., Soueidan A., Bär E., Schletz A. | Enhancing partial discharge inception voltage of DBCs by geometrical variations based on simulations of the electric field strength, CIPS, Nürnberg 2016 | X | |
| Bayer C. F., Waltrich U., Schneider R., Soueidan A., Bär E., Schletz A. | Enhancement of the partial discharge inception voltage of DBCs by adjusting the permittivity of the encapsulation, CIPS, Nürnberg 2016 | ||
| Waltrich U., Bayer C. F., Reger M., Meyer A., Tang X., Schletz A. | Enhancement of the Partial Discharge Inception Voltage of Ceramic Substrates for Power Modules by Trench Coating, ICEP, Sapporo 2016 | X | |
| Bayer C. F., Waltrich U., Schneider R., Soueidan A., Bär E., Schletz A. | Partial Discharges in Ceramic Substrates – Correlation of Electric Field Strength Simulations with phase resolved partial discharge measurements, ICEP, Sapporo 2016 | X | |
| Bayer C. F., Waltrich U., Soueidan A., Baer E., Schletz A. | Stacking of Insulating Substrates and a Field Plate to Increase the PDIV for High Voltage Power Modules, Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th (pp. 1172-1178). IEEE., Las Vegas, May-2016 | X | X |
| Bayer C. F., Waltrich U., Soueidan A., Baer E., Schletz A. | Partial Discharges in Ceramic Substrates – Correlation of Electric Field Strength Simulations with Phase Resolved Partial Discharge Measurements, Transactions of The Japan Institute of Electronics Packaging 9 (2016) E16-003-1, 2016 | X | |
| Waltrich U., Yu Z., Schletz A., Reichenberger M. | Bonding Copper Terminals onto DBC Substrates of Power Modules by Resistance Projection Welding; IEEE EPDC, Nuremberg, 2015 | X | |
| Bayer C. F. Bär E., Waltrich U., Malipaard D., Schletz A. | Simulation of the electric field strength in the vicinity of metallization edges on dielectric substrates. IEEE transactions on dielectrics and electrical insulation 22 (2015), Nr.1, S.257-265 ISSN: 1070-9878 |
X | |
| Hutzler A., Tokarski A., Kraft S., Zischler S., Schletz A. | Increasing the lifetime of electronic packaging by higher temperatures: solders vs. silver sintering. ECTC Conference, Orlando, USA, 2014 | X | X |
| Waltrich U., Malipaard D., Schletz A. | Novel Design Concept for Modular Multilevel Converter Power Modules. PCIM, Nuremberg, 2014 | ||
| Hutzler A., Wright A., Schletz, A. | Increasing the Lifetime of Power Modules by Smaller Bond Wire Diameters. IMAPS Wire Bonding Workshop, San Jose, USA, 2014 | X | |
| März M., Malipaard D., Bucher A., Schletz A. | Thermisches Management in der Leistungselektronik. Cluster-Praxiskurs 11-Dec-2013, Nuremberg | X | |
| Schletz A., Hutzler A., Müller N., Tokarski A. | Design and Material Considerations for Extended Lifetime. ECPE Workshop Power Electronics Packaging. 12- 13-Nov-2013, Baden-Dättwil, Switzerland | X | |
| Hutzler A., Tokarski A., Schletz A. | Extending the Lifetime of Power Electronic Assemblies by Increased Cooling Temperatures. ESREF, Arcachon, 2013 | X | X |
| Schletz A. | Keramik für die mobile Leistungselektronik. DGM Roadmapping-Workshop: Hochleistungs-Keramik-Werkstoffe für zukünftige Anwendungen in der Mobilität. 10-Sep-2013 | X | |
| Hutzler A., Tokarski A., Schletz A. | Extending the power cycling lifetime of SiC diodes (by increased cooling temperatures). ISiCPEAW, Stockholm, 2013 | X | |
| Kraft S., Zischler S., Schletz A. | Properties of a novel silver sintering die attach material for high temperature - high lifetime applications. SENSOR 2013, Nuremberg, DOI 10.5162/sensor2013/B3.3 | X | X |
| Kraft S., Schletz A. | Sintern statt Löten - Motivation, Verarbeitung und Herausforderungen. Viscom Technologieforum, 13- 14-Mar-2013, Hannover | X | |
| Kraft S., Tinter R., Schletz A. | Thermal Resistance Simulation and Measurement of a Double Sided Cooled Power Module. In Proceedings of the 8th European Advanced Technology Workshop on Micropackaging and Thermal management, IMAPS, La Rochelle, 2013. | X | |
| Hofmann M., Schletz A., Domes K., März M., Frey L. | Modular Inverter Power Electronic for Intelligent e-Drives. IEEE-Proceedings of 2nd International Electric Drives Production Conference (EDPC), Nuremberg, 2012 | X | |
| März M., Schletz A., Malipaard D. | Trend zur Hochtemperatur-Leistungselektronik? Zusammenhang zwischen neuen Materialien, Bauteiloptimierung und Systemintegration. Industrieworkshop, Mainz, 31-Jan-2012 | X | |
| Schletz A. | Die attach for SiC devices operated at elevated temperatures. ECPE SiC & GaN User Forum, Potential of Wide Bandgap Semiconductors in Power Electronic Applications, Birmingham, 02-Sep-2011 | X | |
| Schletz A. | Die attach for SiC devices operated at elevated temperatures. ISiCPEAW 2011, Stockholm, Schweden, 03-May-2011 | X | |
| Knörr M., Schletz A. | Power Semiconductor Joining through Sintering of Silver Nanoparticles: Evaluation of Influence of Parameters Time, Temperature and Pressure on Density, Strength and Reliability. 6th International Conference on Integrated Power Electronics Systems (CIPS). Nuremberg, 16- 18-Mar-2010 | X | |
| Knörr M., Schletz A., Oertel S., Jank M. | Semiconductor Joining through Sintering of Ag-Nanoparticles: Analysis of Suitability of Different Powders Using DSC and TGA Measurements. Proceedings of The World Congress on Particle Technology (WCPT6), Nuremberg, 26- 29-Apr-2010 | X | |
| Egelkraut S., Rauch M., Schletz A., März M., Ryssel H., Frey L. | Polymer bonded soft magnetics for EMI filter applications. Automotive meets Electronics (AmE) Tagung, Dortmund, 15- 16-Apr-2010 | X | |
| Egelkraut S., Rauch M., Schletz A., März M. | A Highly Integrated EMI Filter Using Polymer Bonded Soft Magnetics as Core Material. APEC Conference 2010, Palm Springs, USA, 21- 24-Feb-2010 | X | X |
| Schletz A. | Double-Sided Cooling in Automotive Power Electronics. ECPE "Workshop – Mechatronic System Integration", Paris, 01. Oktober 2009 | X | |
| Schletz A. | Thermal Management on PCBs I - Heat Spreading and Shielding. ECPE Workshop on Power PCBs & Busbars, Delft, 21-Nov-2008 | X | |
| März M., Eckardt B., Schletz A. | Anforderungsgerechte Auslegung von Leistungselektronik im Antriebsstrang. Tagung "Elektrik/Elektronik in Hybrid- und Elektrofahrzeugen", Haus der Technik, Munich, 17- 18-Nov-2008, expert verlag, ISBN 978-3-8109-2817-1, S. 213-225 | X | |
| Schletz A. | New Technologies for Liquid-Cooled Power Modules. ECPE-HOPE Symposium Automotive Power Electronics, Sindelfingen, 7- 8-Oct-2008 | X |
© Fraunhofer IISB
Publications
Tabbed contents
Packaging
Test and Reliability
| authors | title | Talk |
Paper |
|---|---|---|---|
| Zhao, D.; Letz, S.; Leib, J.; Schletz, A. | Influence of SiC chip thickness on the power cycling capability of power electronics assemblies – A comprehensive numerical study, Microelectronics Reliability 150 (2023), Art. 115091 | X | |
| Dresel, F.; Müller, J.; Leib, J.; Schletz, A. | Silver Sintering on PCBs – Methods and Reliability; PCIM Europe 2022; Nuremberg, 10 May 2022 through 12 May 2022 | X | |
| Dresel, F.; Leib, J.; Schletz, A.; Boettge, B.; Klengel, S. | Accelerated Lifetime Testing and Failure Analysis for Advanced Automotive Grade Ceramic Capacitors (MLCC), 12th International Conference on Integrated Power Electronics Systems, Proceedings March, 15 – 17, 2022, Berlin, Germany | X | |
| Müller, J.; Letz, S.; Simon; F.; Bayer, C.F.; Schletz, A.; Görlich, J.; Nishimura, T. | Silver Sintering of Packaged GaN-Devices on Printed Circuit Board, Journal of Microelectronics and Electronic Packaging 2022 |
X | |
| Du, H.; Letz, S.; Baker, N.; Götz, T.; Ianuzzo, F.; Schletz, A. |
Effect of short-circuit degradation on the remaining useful lifetime of SiC MOSFETs and its failure analysis; Microelectronics Reliability 114 (2020), Art. 113784 | X | |
| Zhao, D.; Letz, S.; Yu, Z.; Schletz, A.; März, M. | Combined experimental and numerical approach for investigating the mechanical degradation of the interface between thin film metallization and Si-substrate after temperature cycling test; Microelectronics Reliability (2020), Online First, Art. 113785 | X | |
| Martinez, P.J.; Letz, S.; Zhao, D. | Failure analysis of normally-off GaN HEMTs under avalanche conditions, Semiconductor Science and Technology 35 (2020), Nr.3, Art. 035007, 10 S., ISSN: 0268-1242 | X | |
| Zhao, D.; Letz, S.; Schletz, A.; März, M. | A Method for the Characterization of Adhesion Strength Degradation of Thin Films on Si-Substrate under Thermal Cycling Test; International Conference on Integrated Power Electronics Systems (CIPS) 2020, Berlin | X | |
| Sewergin, A.; Rittner, M.; Burghardt, A.; Kriegel, K.; Mitic, G.; Zetterer, T.; Hutsch, T.; Neumann, A.; Simon, F.-B., De Doncker, R.W. | Highly Integrated Switching Cell Design based on Copper Diamond Heat Spreader, 3D Printed Heat Sink and HTCC Logic Board, International Conference on Integrated Power Electronics Systems (CIPS) 2020, Berlin | X | |
| Novak, M.; Grübl, W.; Müller, J.; Schletz, A. | Selektives Ag-Sintern auf Organischer Leiterplatte, EBL 2020 Fellbach, 18.-19.02.2020, Tagungsband Seite 210-215 | X | |
| Pavlicek, N.; Liu, C.; Loisy, J.-Y.; Salvatore, G.; Mohn, F.; Schuderer, J.; Apelsmeier, A.; Dresel, F.; Schletz, A. | Power module platform for automotive reliability requirements, 21st European Conference on Power Electronics and Applications, EPE 2019 ECCE Europe : 3-5 September 2019, Genova, Italy | X | |
| Schletz A. | Robuste und zuverlässige Leistungselektronik: Umwelt- und Lebensdauertests, 8. Kooperationsforum Leistungselektronik, Würzburg 01.10.2019 | X | |
| Letz S., Farooghian A., Simon F.-B., Schletz A. | Modeling the rate-dependent inelastic deformation of porous polycrystalline silver films, ESREF 2018, 29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Aalborg, Denmark, October 1-5, 2018 | X | X |
| Simon F.-B., Letz S., Schletz A. | Influence of the pulse length and temperature swing on the relative lifetime estimation for sintered/soldered chip-on-substrate samples, Poster presented at ESREF 2018, 29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Aalborg, Denmark, October 1-5, 2018 | X | |
| Dresel, F.; Letz, S.; Zischler, S.; Schletz, A.; Novak, M. (Continental, Division Powertrain) | Selective silver sintering of semiconductor dies on PCB, PCIM Europe 2018, International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. Proceedings : Nuremberg, 05 - 07 June 2018 | X | X |
| Letz S. A. | Lifetime calculation of automotive power modules based on PoF, ECPE Workshop – Thermal and Reliability Modeling and Simulation of Power Electronics Components and Systems, Fuerth, 01-December-2016 | X | |
| Letz S. A., Hutzler A., Waltrich U., Zischler S., Schletz A. | Mechanical properties of silver sintered bond lines: Aspects for a reliable material data base for numerical simulations, CIPS, Nürnberg, 2016 | X | |
| Hutzler A., Tokarski A., Schletz A. | High Temperature Die-attach Materials for Aerospace Power Electronics: Lifetime Tests and Modeling, Nuremberg 2015 | X | |
| Hutzler A., Noreik B., Schletz A., Schimanek,E., Erlbacher T. | Statistische Lebensdauer- und Zuverlässigkeitsanalyse. Cluster Leistungselektronik, Nürnberg, 21 - 22-Oct-2014 | X | |
| Wright A., Hutzler A., Schletz A., Pichler P. |
Thermo-mechanical simulation of plastic deformation during temperature cycling of bond wires for power electronic modules. EuroSimE Conference, Ghent, Belgium, 2014 | X | X |
| Hutzler A., Noreik B., Schletz A., Schimanek E. | Statistische Lebensdauer- und Zuverlässigkeitsanalyse. Cluster Leistungselektronik, Nürnberg, 25 - 26-Jun-2014 | X | |
| Hutzler A., Zeyss F., Vater S., Tokarski A., Schletz A., März M. | Power Cycling Community 1995-2014. BodosPower Magazine, May 2014 | ||
| Hutzler A., Schletz A. | Hohe Lebensdauer durch hohe Temperatur. Cluster Leistungselektronik, Kolloquium, Erlangen, March 2014 | X | |
| Hutzler A., Tokarski A., Schletz A. |
Modellierung von Ermüdungsausfällen durch aktive Lastwechseltests. EBL Konferenz, Fellbach, 2014 in Hennicke, D.:Jahrbuch Mikroverbindungstechnik 2014/2015. DVS-Media, Düsseldorf, 2014, ISBN: 978-3-945023-06-8, S. 156-169 |
X | pdf book |
| Hutzler A., Noreik B. |
Statistische Lebensdauer-und Zuverlässigkeitsanalyse in der Leistungselektronik. Cluster-Praxiskurs 12-Dec-2013, Nuremberg | X | |
| Kraft S. |
Test Data for Die Attach Lifetime Modeling. ECPE Workshop Lifetime Modeling and Simulation. 3- 4-Jul-2013, Düsseldorf | X | |
| Hutzler A., Schletz A. |
Statistical analysis of power cycling data. PCIM, Nuremberg, 2013 | X | X |
| Hutzler A. | Dreikäsehoch an Bord, Die Welt, Sonderausgabe: Die Welt der Zukunft. 28-Nov-2012 | ||
| Schletz A. | Messplatz für aktive Temperaturwechsel (Power Cycling Test) - Test und Interpretation. Deutsche IMAPS-Konferenz 2012, 12-Oct-2012, Munich | X | |
| Hutzler A., Engelmann S. | Gezielt maximieren, minimieren und optimieren. Qualität und Zuverlässigkeit 57 (2012), Nr.10, S.38-41 | X | |
| Schletz A. | Aktive Temperaturwechsel - Test und Interpretation. Leistungselektronik-Kolloquium des Fraunhofer Innovationsclusters "Elektronik für nachhaltige Energienutzung", Erlangen, 21-May-2012 | X | |
| Kraft S. | Reliability of Silver Sintering on DBC and DBA Substrates for Power Electronic Application. CIPS 2012, Nuremberg | X | |
| Kraft S., Schletz A., März M. | Reliability of silver sintering on DBC and DBA substrates for power electronic applications. International Conference on Integrated Power Electronics Systems, Nuremberg, 06– 08-Mar-2012.VDE-Verlag, ETG-Fachbericht 133, pp. 439-444 | X | |
| Schletz A. | Zuverlässigkeit von Folienkondensatoren. Leistungselektronik- 2. Quartal, Erlangen, 18-Apr-2011 | X | |
| Schletz A. | Zuverlässigkeitsaspekte in der Leistungselektronik. Jahrestagung 2010 (Fraunhofer IISB), Erlangen, 21-Oct-2010 | X | |
| Schletz A. | Zuverlässigkeitsuntersuchungen mit einem aktiven Lastwechseltestsystem. Gemeinsames Kolloquium zur Halbleitertechnologie und Messtechnik, Lehrstuhl für Elektronische Bauelemente, Universität Erlangen-Nürnberg, Fraunhofer IISB WS 07/08, 28-Jan-2008 | X |