Conference and Exhibition  /  15. Juli 2024  -  18. Juli 2024

International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) 2024

The IPFA conference is devoted to the fundamental understanding of the electrical and physical characterization techniques and associated technologies that assist in probing the nature of wear-out and failure in conventional and new CMOS devices. The related improved knowhow of the physics of device / circuit / module failure is an important input for future design for reliability.

IPFA 2024 features technical presentations as well as an exhibition.
 

The following contribution of the technical program reports on research results of Fraunhofer IISB:

Novel Rapid and Deposition-free Strategy for FIB Cross-section Preparation
by S. Beuer and M. Rommel

Poster Session POS1, Tuesday, July 16, 13:10 - 15:10 h, Exhibition Hall - ORCHID Main Ballroom
Poster reference: POS1.02 / ID 139
 

IPFA 2024 Homepage