Fraunhofer Institute for Integrated Systems and Device Technology IISB| Jahr Year | Titel/Autor:in Title/Author | Publikationstyp Publication Type |
|---|---|---|
| 2024 | Temperature Sensing Readout Circuits with 4H-SiC Technology Khan, Md Asif; Bahubalindruni, Pydi Ganga; May, Alexander; Rossi, Chiara; Rommel, Mathias |
Konferenzbeitrag Conference Paper |
| 2024 | Analysis and Design of an SiC CMOS Three-Channel DC-DC Synchronous Buck Converter for High-Temperature Applications Martinez, Andres; Torres, Felipe; Marin, Jorge; Rojas, Christian A.; Gak, Joel; Rommel, Mathias; May, Alexander; Wilson-Veas, Alan H.; Miguez, Matias; Rossi, Chiara; Schraml, Michael; Calarco, Nicolas |
Zeitschriftenaufsatz Journal Article |
| 2024 | Performance and Understanding of 4H-SiC Electron Devices at Low Temperature Range Benedetto, Luigi Di; Rinaldi, Nicola; Licciardo, Gian Domenico; Liguori, Rosalba; Rubino, Alfredo; May, Alexander; Rommel, Mathias |
Konferenzbeitrag Conference Paper |
| 2024 | Investigation of Ohmic Contacts and Resistances of a 4H-SiC CMOS Technology up to 550 Degrees C Rommel, Mathias; May, Alexander; Baier, Leander; Kauth, Julian; Böttcher, Norman; Jank, Michael |
Zeitschriftenaufsatz Journal Article |
| 2024 | Novel Rapid and Deposition-Free Strategy for FIB Cross-Section Preparation Beuer, Susanne; Rommel, Mathias |
Konferenzbeitrag Conference Paper |
| 2024 | Recent insights and improvements in the "flying cube"-strategy for FIB cross-sectioning Beuer, Susanne; Yokosawa, Tadahiro; Apeleo Zubiri, Benjamin; Spiecker, Erdmann; Rommel, Mathias |
Poster |
| 2024 | Device Modeling of 4H-SiC PIN Photodiodes with Shallow Implanted Al Emitters for VUV Sensor Applications Schraml, Michael; Rommel, Mathias; Papathanasiou, Niklas; Erlbacher, Tobias |
Zeitschriftenaufsatz Journal Article |
| 2024 | Fast Estimation of the Lateral Fidelity of Ion Implantation in 4H-SiC through Calibration to JFET Transfer Characteristics in TCAD Sakai, Kota; Böttcher, Norman; Szabo, Maximilian; Beuer, Susanne; Rommel, Mathias |
Zeitschriftenaufsatz Journal Article |
| 2024 | Simulation-Guided Analysis towards Trench Depth Optimization for Enhanced Flexibility in Stretch-Free, Shape-Induced Interconnects for Flexible Electronics Joch, Daniel; Lang, Thomas; Sanctis, Shawn; Jank, Michael P.M. |
Zeitschriftenaufsatz Journal Article |
| 2024 | Novel rapid and deposition-free strategy for FIB cross-section preparation Beuer, Susanne; Rommel, Mathias |
Poster |
| 2024 | Anisotropic stress observation of 4H‐SiC trench metal‐oxide semiconductor field‐effect transistor test structures by scanning near‐field optical Raman microscope Yoshikawa, Masanobu; Murakami, Masataka; Ushida, Tomoyuki; Samejima, Junichiro; Mitsuzawa, Kana; Matoba, Nobuhiro; Lim, Minwho; Rusch, Oleg; Rommel, Mathias |
Zeitschriftenaufsatz Journal Article |
| 2024 | Investigation of CMOS Single Process Steps on 4H-SiC a-Plane Wafers for Quantum Applications Schwarberg, Jannik H.; Karhu, Robin; Kallinger, Birgit; Rommel, Mathias; Schmidt, Robin; Schulze, Jörg |
Konferenzbeitrag Conference Paper |
| 2024 | Adhesion strength of ductile thin film determined by cross-sectional nanoindentation Zhao, Dawei; Letz, Sebastian; Jank, Michael; März, Martin |
Zeitschriftenaufsatz Journal Article |
| 2024 | Precise Compensation of Device Variability in IGZO‐based Ferroelectric Thin‐Film Transistors for Enhanced Transparent Display Performance Joch, Daniel; Lehninger, David; Sunil, Athira; Sanctis, Shawn; Lang, Thomas; Zeltner, Johannes; Wartenberg, Philipp; Seidel, Konrad; Jank, Michael |
Zeitschriftenaufsatz Journal Article |
| 2024 | A 4H-SiC CMOS Technology enabling Smart Sensor Integration and Circuit Operation above 500 °C May, Alexander; Rommel, Mathias; Baier, Leander; Schraml, Michael; Dick, Jan F.; Jank, Michael; Schulze, Jörg |
Konferenzbeitrag Conference Paper |
| 2024 | An analog to digital converter in a SiC CMOS technology for high-temperature applications Mo, Jiarui; Niu, Yunfan; May, Alexander; Rommel, Mathias; Rossi, Chiara; Romijn, Joost; Zhang, Guoqi; Vollebregt, Sten |
Zeitschriftenaufsatz Journal Article |
| 2024 | Defects distribution and evolution in selected-area helium ion implanted 4H–SiC Song, Ying; Xu, Zongwei; Rommel, Mathias; Astakhov, Georgy V.; Hlawacek, Gregor; Fang, Fengzhou |
Zeitschriftenaufsatz Journal Article |
| 2024 | Concept for a GaN-Based Intelligent Motor Controller with Integrated Failure Prediction for the Inverter and the Drive Blechinger, Christoph; Schellenberger, Martin; Hofmann, Maximilian; Mensing, Michael; Gensch, Marc; Westerhoff, David; Stanitzki, Alexander; Barylla, Patrick; Kapels, Holger; Krupp, Lukas; Lüdecke, Andre |
Konferenzbeitrag Conference Paper |
| 2024 | An end-to-end machine learning approach with explanation for time series with varying lengths Schneider, Manuel; Greifzu, Norbert; Wang, Lei; Walther, Christian; Wenzel, Andreas; Li, Pu |
Zeitschriftenaufsatz Journal Article |
| 2024 | A 4H-SiC CMOS SPICE Level 3 Model for Circuit Simulations Rinaldi, Nicola; May, Alexander; Rommel, Mathias; Liguori, Rosalba; Rubino, Alfredo; Licciardo, Gian Domenico; Benedetto, Luigi Di |
Zeitschriftenaufsatz Journal Article |
| 2024 | Detection of Demagnetization Faults in Electric Motors by Analyzing Inverter Based Current Data Using Machine Learning Techniques Walch, Daniel; Blechinger, Christoph; Schellenberger, Martin; Eckardt, Bernd; Hofmann, Maximilian; Lorentz, Vincent |
Zeitschriftenaufsatz Journal Article |
| 2024 | A 4H-SiC NMOSFET-based temperature sensor operating between 14K and 481K Rinaldi, Nicola; May, Alexander; Rommel, Mathias; Liguori, Rosalba; Rubino, Alfredo; Licciardo, Gian Domenico; Benedetto, Luigi di |
Zeitschriftenaufsatz Journal Article |
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This list has been generated from the publication platform Fraunhofer-Publica