Packaging & Reliability

Packaging

The research field is packaging of power electronics. The drivers are performance, volume or weight per cost depending on the application. The goal is reached by investigations on different concepts of the electrical, mechanical and thermal design such as single and double sided die attach, single and double sided cooling, materials with minimized or matched coefficient of thermal expansion (CTE). By use of intelligent setups and application relevant choice of the electrical and thermal interconnections the bill of material can be minimized.


Work is done on joining technologies as well. There is a long experience in silver sintering as an alternative to the state of the art. Meanwhile a process is established to manufacture multichip power modules with high yield. Especially a selective sintering process brings high advantages to electronic packaging. The chip sizes meet the power electronics requirements. While the sintering improvements are ongoing the soldering technology is still covered from state to the art up to new high performance or high temperature materials.  

 

Packaging For Electronics

 

Wire Bonding

 

Multiphysics Simulation For Power Electronics

 

Material Characterization

 

Brochure – Devices & Reliability

[ PDF  6.6 MB ]

Test and Reliability

Lifetime aspects of power electronics are under investigation in this research field. Different tests are performed, like power cycling, temperature cycling or humidity storage and many others. A huge variety of characterization and analyses tools are available such as for measurement of the thermal impedance of power devices, lock-in thermography, scanning acoustic microscopy, static and lock-in thermography, scanning electron microscopy, focused ion beam sectioning and others. The results are used to improve the technologies further. In addition they are utilized to parameterize existing or to create new lifetime models. The physics of failure method is addressed whenever possible. All activities are not limited to active devices only. Passive components are covered like inductors and capacitors as well as different potting materials.

 

Active Power Cycling Test

 

Lock-In Thermography

 

Thermal Characterization

Corrosion and corrosion protection in Power Modules


Due to aging, humidity, and other harsh environmental conditions corrosion and corrosion protection is still an important topic in electronic applications. Thermal stresses, temperature and humidity loads as well as testing arrangements with corrosive gas are carried out at the Fraunhofer IISB.

© Kurt Fuchs / Fraunhofer IISB (Camera / Editing)

Publications

 

Projects

 

Downloads