Packaging & Reliability

Packaging

The research field is packaging of power electronics. The drivers are performance, volume and weight per cost depending on the application. The goal is reached by investigations of different concepts of the electrical, mechanical and thermal design such as single and double sided die attach, single and double sided cooling, materials with minimized or matched coefficient of thermal expansion (CTE). By use of intelligent setups and application relevant measures of the electrical and thermal interconnections the bill of material is minimized.


Work is done on joining technologies as well. There is a long experience in silver sintering as an alternative to the state of the art. Meanwhile a process is established to manufacture multichip power modules with high yield. Especially a selective sintering process brings big pace to electronic packaging, especially on printed circuit board. The chips sizes meet the power electronics requirements. While the sintering improvements are ongoing the soldering technology is still covered for new high performance or high temperature materials.

 

Packaging
for Electronics

Conceptional investigations, silver sintering, soldering, wire and ribbon bonding, prototyping, testing ...

 

Wire Bonding

New materials for bonds, improvement of application’s lifetime, metalization and surface optimization, cleaning processes, power cycling tests ...

 

Multiphysics Simulation for Power Electronics

Electrical simulation, thermal simulation, mechanical simulation, parasitic extraction in electronic packages, circuit simulation, electric and electromagnetic simulation ...

 

Material
Characterization

Temperature dependent characterization of mechanical properties, nanoindentation, thermal analysis of materials ...

Brochure –
Devices & Reliability

[ PDF  6.6 MB ]

We develop power electron devices, innovative packaging solutions, test reliability, and predict lifetime of power modules.

Test and Reliability

Lifetime aspects of power electronics are under investigation in this research field. Different tests are performed, like power cycling, temperature cycling or humidity storage and many others. A huge variety of characterization and analyses tools are available such as for measurement of the thermal impedance of power devices, lock-in thermography, scanning acoustic microscopy, static and lock-in thermography, scanning electron microscopy, focused ion beam sectioning and others. The results are used to improve the technologies further. In addition they are utilized to parameterize existing or to create new lifetime models. The physics of failure method is addressed whenever possible. All activities are not limited to active devices only. Passive components are covered like inductors and capacitors as well as different potting materials.

 

Active Power Cycling Test

 

Lock-In Thermography

 

Thermal
Characterization

Corrosion and corrosion protection in Power Modules


Due to aging, humidity, and other harsh environmental conditions corrosion and corrosion protection is still an important topic in electronic applications. Thermal stresses, temperature and humidity loads as well as testing arrangements with corrosive gas are carried out at the Fraunhofer IISB.

© Kurt Fuchs / Fraunhofer IISB (Camera / Editing)

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