Packaging & Reliability

Packaging

The research field is packaging of power electronics. The drivers are performance, volume and weight per cost depending on the application. The goal is reached by investigations of different concepts of the electrical, mechanical and thermal design such as single and double sided die attach, single and double sided cooling, materials with minimized or matched coefficient of thermal expansion (CTE). By use of intelligent setups and application relevant measures of the electrical and thermal interconnections the bill of material is minimized.


Work is done on joining technologies as well. There is a long experience in silver sintering as an alternative to the state of the art. Meanwhile a process is established to manufacture multichip power modules with high yield. Especially a selective sintering process brings big pace to electronic packaging, especially on printed circuit board. The chips sizes meet the power electronics requirements. While the sintering improvements are ongoing the soldering technology is still covered for new high performance or high temperature materials.

 

Packaging
for Electronics

Our activities range from conceptional investigations like thermal management and electric parasitics optimization to technology and process development such as metal sintering, soldering, wire bonding, subtractive and additive manufacturing and coating. We offer design studies up to prototyping and testing.

 

Corrosion in
Power Electronics

Corrosion analysis acts as a key element in meeting rising demands for power electronic modules that are suitable for more and more challenging application areas. On this matter, we put special attention on environmental testing, failure analysis and especially research on corrosion protection.

 

Multiphysics Simulation for Power Electronics

Modelling and simulation for power electronics allows for reliable predictions for electrical, thermal and mechanical behaviour, on device, module and system level. More specifically, we offer lifetime simulations from a physics of failure approach, parasitic extraction in electronic packages, circuit simulation, electric and electromagnetic simulation and a combination of all that.   

Test and Reliability

Lifetime aspects of power electronics are under investigation in this research field. Different tests are performed, like power cycling, temperature cycling or humidity storage and many others. A huge variety of characterization and analyses tools are available such as for measurement of the thermal impedance of power devices, lock-in thermography, scanning acoustic microscopy, static and lock-in thermography, scanning electron microscopy, focused ion beam sectioning and others. The results are used to improve the technologies further. In addition they are utilized to parameterize existing or to create new lifetime models. The physics of failure method is addressed whenever possible. All activities are not limited to active devices only. Passive components are covered like inductors and capacitors as well as different potting materials.

 

Lifetime Prediction

A robust und reliable product design needs efficient lifetime prediction. From the mission profile to power losses to the thermal profile to the load analysis to the lifetime prediction by empirical and material based lifetime models is what we do.

 

Lock-In
Thermography

Detection and analysis of failed power electronics devices, with special focus on failure localization on passive components like ceramic capacitors, but also semiconductor chips (e.g. chipping by the wire bonding process, electrical over stress (EOS), electro-static discharge (ESD)).  

 

Thermal
Characterization

Research and services on thermal characterization of new packaging concepts, materials, devices, and technologies for power electronic devices, from junction to coolant, by indirect and thermographic measurements. We offer high flexibility in parameter settings and devices under test like big and small power modules containing GaN HEMT, SiC FET, Si IGBT and others.

 

Material
Characterization

Temperature dependent characterization of mechanical properties of power electronic materials, material property mapping and thermal analysis of materials. Testing methods and tools range from, nanoindentation, tensile and compression testing to focused ion beam sectioning and Simultaneous thermal analysis (STA).

 

Active
Power Cycling

Comparative lifetime characterization by power cycling of power modules and technology samples, including qualification tests and technology investigations are in the focus. For this, we offer high flexibility in parameter settings and devices under test, such as big and small power modules containing GaN HEMT, SiC FET, Si IGBT and others.

Insight

© Kurt Fuchs / Fraunhofer IISB (Camera / Editing)

Corrosion and corrosion protection in Power Modules

Due to aging, humidity, and other harsh environmental conditions corrosion and corrosion protection is still an important topic in electronic applications. Thermal stresses, temperature and humidity loads as well as testing arrangements with corrosive gas are carried out at the Fraunhofer IISB

Projects & Publications

 

 

Brochures as PDF

 

Related Research Areas at IISB

Explore the Entire Power Electronic Systems Value Chain