Packaging & Reliability


The research field is packaging of power electronics. The drivers are performance, volume and weight per cost depending on the application. The goal is reached by investigations of different concepts of the electrical, mechanical and thermal design such as single and double sided die attach, single and double sided cooling, materials with minimized or matched coefficient of thermal expansion (CTE). By use of intelligent setups and application relevant measures of the electrical and thermal interconnections the bill of material is minimized.

Work is done on joining technologies as well. There is a long experience in silver sintering as an alternative to the state of the art. Meanwhile a process is established to manufacture multichip power modules with high yield. Especially a selective sintering process brings big pace to electronic packaging, especially on printed circuit board. The chips sizes meet the power electronics requirements. While the sintering improvements are ongoing the soldering technology is still covered for new high performance or high temperature materials.


for Electronics

Conceptional investigations, silver sintering, soldering, prototyping and testing, as well as new materials for bonds, improvement of application’s lifetime, metalization and surface optimization, cleaning processes, lifetime testing ...


Corrosion in
Power Electronics

Electrochemical migration and oxidation of power electronics, environmental testing, Corrosion protection, failure analysis ...


Multiphysics Simulation for Power Electronics

Electrical and magnetic fields, electrical circuit, thermal, mechanical and lifetime simulations, parasitics extraction in electronic packages ...

Test and Reliability

Lifetime aspects of power electronics are under investigation in this research field. Different tests are performed, like power cycling, temperature cycling or humidity storage and many others. A huge variety of characterization and analyses tools are available such as for measurement of the thermal impedance of power devices, lock-in thermography, scanning acoustic microscopy, static and lock-in thermography, scanning electron microscopy, focused ion beam sectioning and others. The results are used to improve the technologies further. In addition they are utilized to parameterize existing or to create new lifetime models. The physics of failure method is addressed whenever possible. All activities are not limited to active devices only. Passive components are covered like inductors and capacitors as well as different potting materials.


Active Power Cycling Test

Comparative lifetime characterization by power cycling of power modules and technology samples, qualification tests and technology investigations, high flexibility in parameter settings and devices under test like huge and small power modules containing GaN HEMT, SiC FET, Si IGBT and others


Lock-In Thermography

Failure localization on the semiconductor chip like edge termination, chipping by the wire bonding process, electrical over stress (EOS), electro-static discharge (ESD), failure localization on passive components like ceramic capacitors



Thermal characterization from junction to coolant by indirect and thermographic measurements, high flexibility in parameter settings and devices under test like huge and small power modules containing GaN HEMT, SiC FET, Si IGBT and others



Temperature dependent characterization of mechanical properties of power electronic materials, nanoindentation, tensile testind, focused ion beam sectioning ...

Lifetime Prediction

From mission profile to power losses to thermal profile to load analysis to lifetime prediction by lifetime models

Brochure –
Devices & Reliability

[ PDF  6.6 MB ]

We develop power electron devices, innovative packaging solutions, test reliability, and predict lifetime of power modules.

Corrosion and corrosion protection in Power Modules

Due to aging, humidity, and other harsh environmental conditions corrosion and corrosion protection is still an important topic in electronic applications. Thermal stresses, temperature and humidity loads as well as testing arrangements with corrosive gas are carried out at the Fraunhofer IISB.

© Kurt Fuchs / Fraunhofer IISB (Camera / Editing)