Packaging for Electronics

Ceramic Embedding

Using the various advantages for Wide Band Gap semiconductor devices, we investigate concepts that exhibit planar contacts, low parasitic inductance, high voltage, high design flexibility, environmental compatibility and high temperature suitability.

Download Product Sheets and Articles as PDF:

High Temperature Packages for WBG Semiconductors
Article - IISB Aktuell 1.2018 "Keramik-Einbettung für die Leistungselektronik der Zukunft" (german) (iisb.fraunhofer.de)

Motivation for Ceramic Embedding:

Miniaturization & no housing, 3D-integration, reduction of connection points
High switching & short current paths, vias instead of bond wires, low parasitic inductance
More efficient cooling & double-sided cooling, thermal vias

High temperature capability (> 200 °C)
High thermal conductivity (Al2O3, AlN, Si3N4)
High current carrying capability (Cu layer > 300 µm), no wires
High corrosion resistance (ceramic)
Low CTE-Mismatch

Ultra Short Pulse Laser Structuring

Easy DBC designing on demand
Cost effective and fast prototyping
Super fine lining
Electrical field control
Limitless trench layout for insulation
3D structuring of organic, inorganic and metallic materials
Reverse engineering

Add-on: Vias in DBC Substrates for embedded power modules

Novel Via manufacturing approaches

Laser drilling, stencil printing, dispensing, mechanical contacting
Copper paste, copper rivets, silver paste

Prototypes

Full SiC Double Sided Busbar Module

Idea of concept

Low inductance and high temperature power module for e-drives
Fast switching with SiC
DC+ & DC- on outer metalliztion for lowest parasitic C to ground
High reliability and temperature capability by silver sintering
Low cost due to copper busbars with hybrid polymer isulation layers instead of DBC substrates
Double sided cooling, high thermal capability

Download Product Sheet "Full SiC Double Sided Busbar Power Module"

Further examples of our prototypes

© Fraunhofer IISB
Head spreading and CTE matching by graphite

© Fraunhofer IISB
Double sided cooled sintered power module

© Fraunhofer IISB
Double sided silver sintering of power semiconductors

Equipment & Laboratories

We operate our own clean room according to ISO classification 7 and futher laboratories for analysis and lifetime testing.

Due to our membership in the Research Fab Microelectronics Germany (FMD), we operate an advanced packaging line for power electronics, as well as an environmental laboratory for power electronics - components and systems.

Stencil printer and Ink-jet printer for sinter and solder pastes as well as printing polymers and thermal interface materials in the packaging clean room

Forschungsfabrik Mikroelektronik Deutschland (FMD) (iisb.fraunhofer.de)

Equipment

Multi-physics simulation tools (electro-thermo-mechanical), CAD
Plasma cleaning
Printer for paste material
Vapor-phase vacuum soldering
Formic-acid-activated IR vacuum reflow
Hydrogen activated IR vacuum reflow
Full automatic die placer with high temperature and extended tool force capability
Automatic wire and ribbon bonders (Al, Cu, Au)
Servo press for sintering
Ultrasonic and resistance welding machines for electric terminals