AUTHORS | TITLE | TALK | PAPER |
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Bayer C. | Future Packaging Technologies in Power Electronic Modules, Presentation held at 31st Annual Electronics Packaging Symposium, Binghampton, New York, September 5-6, 2019 | X | |
Zimmermann V., Diepgen A., Bayer C. | Corrosion in PE Systems - Environmental Testing, Corrosion Detection and Protection, Vortrag ECPE Workshop, Bremen 06.06.2019 | X | |
Dirksen D. | Optimierung und Qualifizierung eines Bondprozesses. Tests und Analyseverfahren, Vortrag bei der Zestron Academy "Bondbarkeit elektronischer Baugruppen sicherstellen - Auswahl, Parametrierung & Qualitätssicherung", 21. – 22. Mai 2019 | X | |
Dirksen D. | Bewertung von Bondverbindungen - Möglichkeiten, Normen und Herausforderungen, Vortrag bei der Zestron Academy "Bondbarkeit elektronischer Baugruppen sicherstellen - Auswahl, Parametrierung & Qualitätssicherung", 21. – 22. Mai 2019 | X | |
Bach L., Dirksen D., Blechinger C., Endres T.M., Bayer C.F., Schletz A., März M. | Stackable SiC Embedded Ceramic Packages for High Voltage and High Temperature Power Electronics Applications , Presentation held at International Conference and Exhibition on High Temperature Electronics Network (HiTEN); 09.07.2019, Oxford | X | |
Schletz A. | Testing Wide Band-Gap Devices II (Focus on Packaging); Presentation held at ECPE Tutorial Wide-Bandgap User Training, 27.02.2019, Graz, Austria | X | |
Schletz A., Bayer C., Hutzler, A. | Temperature Challenges for Integrated Systems due to High Power Density, Presentation held at ECPE Tutorial Wide-Bandgap User Training, 27.02.2019, Graz, Austria | X | |
Schletz A., Endruschat A. Heckel T. | State of the Art Packaging, Presentation held at ECPE Tutorial Wide-Bandgap User Training, 27.02.2019, Graz, Austria | X | |
Bayer C.F. | Elektrochemische Korrosion, Fraunhofer IISB AKTUELL 4.2018 | X | |
Kraft S. | Entwicklung und Charakterisierung eines doppelseitig gekühlten leistungselektronischen Moduls, Verteidigung zur Promotion an der Friedrich-Alexander-Universität Erlangen. Mündliche Prüfung am 12.12.2018 | X | |
Yu Z., Zeltner S., Boettcher N., Rattmann G., Leib J., Bayer C.F., Schletz A., Erlbacher T., Frey L. | Heterogeneous integration of vertical GaN power transistor on Si capacitor for DC-DC converters, Presentation held at ESTC 2018, IEEE 7th Electronics System-Integration Technology Conference, September 18th-21st, 2018, Dresden, Germany | X | X |
Bayer C.F., Frey, L. | Untersuchung der elektrischen Feldstärke und des Teilentladungsverhaltens an keramischen Schaltungsträgern, Dissertation 2018 | X | |
Bayer, C.F. | Simulation in power electronics design. Simulation, possibilities, and issues; Presentation held at SEMICON West 2018, July 10-12, 2018, San Francisco, California | X | |
Bayer C.F., Kokot A., Filippi T., Hutzler A., Fuchs C., Wüstefeld S., Kellner S., Diepgen A., Zimmermann V. | Environmental testing, corrosion, failure analysis. Power electronics in harsh environments; Presentation held at SEMICON West 2018, July 10-12, 2018, San Francisco, California | X | |
Bayer C.F. | Electrochemical Corrosion in Power Modules due to Harsh Environments, Semicon West, San Francisco 09.-12.07.2018 | X | |
Bayer C.F. | FEM-Simulation in Designing new Power Modules; Semicon West, San Francisco 09.-12.07.2018 | X | |
Bayer C.F. | Power Electronics Packaging at Fraunhofer IISB – Double Sided Cooling, Ceramic Embedding, and more; Semicon West, San Francisco 09.-12.07.2018 | X | X |
Schletz A. | Power Interconnect Trends - Cost Savings for PCB Power Electronics by Enabling Wear Out; Presentation held at Schweizer Electronic Power and Radar PCB Summit 27./28.06.2018 | X | |
Schletz A. | State of the Art Packaging, Anwendertraining zur Wide-Bandgap Systemintegration, 25./26.06.2018 Bremen | X | |
Schletz A. | Herausforderungen durch hohe Leistungsdichte (hohe Temperaturen) bei integrierten Systemen, Anwendertraining zur Wide-Bandgap Systemintegration, 25./26.06.2018 Bremen | X | |
Schletz A. | Testen von WBG-Bauelementen II (Fokus: Aufbau- & Verbindungstechnik, Anwendertraining zur Wide-Bandgap Systemintegration, 25./26.06.2018 Bremen | X | |
Bach H.L., Endres T., Dirksen D., Zischler S., Bayer C.F., Schletz A., März M. | Ceramic Embedding as Packaging Solution for Future Power Electronic Applications, IPEC Niigata, Japan, 20.-24. Mai 2018 | X | |
Bayer C.F., Diepgen, A., Filippi, T., Fuchs, C., Wüstefeld, S., Kellbner, S., Waltrich, U., Schletz, A. | Electrochemical Corrosion on Ceramic Substrates for Power Electronics - Causes, Phenomenological Description, and Outlook, CIPS 2018 – 10th International Conference on Integrated Power Electronics Systems, Stuttgart, 19.-22.03.2018 | X | |
Bach, H.L., Zechun, Y., Letz, S., Bayer, C.F., Waltrich, U., Schletz, A., März, M. | Vias in DBC Substrates for Embedded Power Modules, CIPS 2018 – 10th International Conference on Integrated Power Electronics Systems, Stuttgart, 19.-22.03.2018 | X | |
Waltrich, U., Bayer, C.F., Zötl, S., Zischler, S., Tokarski, A., Schletz, A., März, M. | High Reliable Power Modules by Pressureless Sintering, CIPS 2018 – 10th International Conference on Integrated Power Electronics Systems, Stuttgart, 19.-22.03.2018 | X | |
Dresel, F., Tham, N., Erlbacher, T., Schletz, A. | Lifetime Testing Method for Ceramic Capacitors for Power Electronics Applications, CIPS 2018 – 10th International Conference on Integrated Power Electronics Systems, Stuttgart, 19.-22.03.2018 | X | |
Bayer, C. F.; Kokot, A.; Filippi, T.; Hutzler, A.; Fuchs, C.; Wüstefeld, S.; Kellner, S.; Diepgen, A.; Zimmermann, V. | Korrosion in leistungselektronischen Modulen, GMM-Fachgruppe 1.2.6 "Prozesskontrolle, Inspektion & Analytik" am 15. März 2018 | X | |
Schletz A., Endruschat A., Heckel T. | State of the Art Packaging, ECPE Tutorial Wide-Bandgap User Training, Barcelona, 21.11.2017 | X | |
Schletz A., Bayer, C.F., Hutzler, A. | Temperature Challenges for Integrated Systems due to High Power Density, ECPE Tutorial Wide-Bandgap User Training, Barcelona, 21.11.2017 | X | |
Schletz A. | Testing Wide Band-Gap Devices II (Focus on Packaging), ECPE Tutorial Wide-Bandgap User Training, Barcelona, 21.11.2017 | X | |
Schletz A. | Future challenges in WBG packaging and testing, Leistungselektronik - Fraunhofer Innovationscluster, 23.10.2017, Erlangen | X | |
Schletz A., Endruschat A., Heckel T. | Verfügbare Gehäuse- und Modulformen, Cluster Leistungselektronik Anwendertraining zur Wide-Bandgap Systemintegration, Nuremberg, 06.07.2017 | X | |
Schletz A., Bayer, C.F., Hutzler, A. | Herausforderungen durch hohe Leistungsdichte (Temperaturen) bei integrierten Systemen, Cluster Leistungselektronik Anwendertraining zur Wide-Bandgap Systemintegration, Nuremberg, 06.07.2017 | X | |
Schletz A. | Testen von WBG-Leistungselektronik Power Cycling Challenges for WBG, Cluster Leistungselektronik Anwendertraining zur Wide-Bandgap Systemintegration, Nuremberg, 06.07.2017 | X | |
Schletz A., Bayer, C.F., Bach L. | Fehlermechanismen keramischer Isoliersubstrate, ECPE Cluster Workshop, Nuremberg, 27.06.2017 | X | |
Waltrich U., Zötl S., Bayer C.F. | Langlebige Leistungsmodule mit druckloser Silbersintertechnik, Leistungselektronik , Fraunhofer Innovationscluster, 22.05.2017, Erlangen | X | |
Bayer C.F. | Erstellen von Ersatzschaltbildern durch Parameterextraktion zur Optimierung der parasitären Eigenschaften von Schaltungen, ECPE Cluster-Schulung – Simulation in der Leistungselektronik, Nuremberg, 13-October-2016 | X | |
Bayer C.F., Rosskopf A. | Grundlagen in der Simulation – Basics, Dos, and Don’t’s, ECPE Cluster-Schulung – Simulation in der Leistungselektronik, Nuremberg, 13-October-2016 | X | |
Müller N., Schletz A., Bayer C.F., Tokarski A., März M. | Graphit zwischen Chip und keramischen Schaltungsträgern – Einbindung und Auswirkung von Graphit im leistungselektronischen Aufbau, PLUS – Fachzeitschrift für Leiterplatten und Elektronik, 12/2016 | X | |
Bayer C.F. | HV-Leistungsmodule-Verbesserung der Teilentladungs-Einsatzspannung in keramischen Schaltungsträgern, 56. Treffen des Arbeitskreises „Systemzuverlässigkeit von Aufbau- und Verbindungstechnologien“, Berlin, 10-February-2016 | X | |
Waltrich U., Ruccius B., Malipaard D., Schletz A., März M. | Dimensioning of a Novel Design Concept for MMC submodules, CIPS, Nürnberg 2016 | X | |
Bayer C. F., Waltrich U., Schneider R., Soueidan A., Bär E., Schletz A. | Enhancing partial discharge inception voltage of DBCs by geometrical variations based on simulations of the electric field strength, CIPS, Nürnberg 2016 | X | |
Bayer C. F., Waltrich U., Schneider R., Soueidan A., Bär E., Schletz A. | Enhancement of the partial discharge inception voltage of DBCs by adjusting the permittivity of the encapsulation, CIPS, Nürnberg 2016 | ||
Waltrich U., Bayer C. F., Reger M., Meyer A., Tang X., Schletz A. | Enhancement of the Partial Discharge Inception Voltage of Ceramic Substrates for Power Modules by Trench Coating, ICEP, Sapporo 2016 | X | |
Bayer C. F., Waltrich U., Schneider R., Soueidan A., Bär E., Schletz A. | Partial Discharges in Ceramic Substrates – Correlation of Electric Field Strength Simulations with phase resolved partial discharge measurements, ICEP, Sapporo 2016 | X | |
Bayer C. F., Waltrich U., Soueidan A., Baer E., Schletz A. | Stacking of Insulating Substrates and a Field Plate to Increase the PDIV for High Voltage Power Modules, Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th (pp. 1172-1178). IEEE., Las Vegas, May-2016 | X | X |
Bayer C. F., Waltrich U., Soueidan A., Baer E., Schletz A. | Partial Discharges in Ceramic Substrates – Correlation of Electric Field Strength Simulations with Phase Resolved Partial Discharge Measurements, Transactions of The Japan Institute of Electronics Packaging 9 (2016) E16-003-1, 2016 | X | |
Waltrich U., Yu Z., Schletz A., Reichenberger M. | Bonding Copper Terminals onto DBC Substrates of Power Modules by Resistance Projection Welding; IEEE EPDC, Nuremberg, 2015 | X | |
Bayer C. F. Bär E., Waltrich U., Malipaard D., Schletz A. | Simulation of the electric field strength in the vicinity of metallization edges on dielectric substrates. IEEE transactions on dielectrics and electrical insulation 22 (2015), Nr.1, S.257-265 ISSN: 1070-9878 |
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Hutzler A., Tokarski A., Kraft S., Zischler S., Schletz A. | Increasing the lifetime of electronic packaging by higher temperatures: solders vs. silver sintering. ECTC Conference, Orlando, USA, 2014 | X | X |
Waltrich U., Malipaard D., Schletz A. | Novel Design Concept for Modular Multilevel Converter Power Modules. PCIM, Nuremberg, 2014 | ||
Hutzler A., Wright A., Schletz, A. | Increasing the Lifetime of Power Modules by Smaller Bond Wire Diameters. IMAPS Wire Bonding Workshop, San Jose, USA, 2014 | X | |
März M., Malipaard D., Bucher A., Schletz A. | Thermisches Management in der Leistungselektronik. Cluster-Praxiskurs 11-Dec-2013, Nuremberg | X | |
Schletz A., Hutzler A., Müller N., Tokarski A. | Design and Material Considerations for Extended Lifetime. ECPE Workshop Power Electronics Packaging. 12- 13-Nov-2013, Baden-Dättwil, Switzerland | X | |
Hutzler A., Tokarski A., Schletz A. | Extending the Lifetime of Power Electronic Assemblies by Increased Cooling Temperatures. ESREF, Arcachon, 2013 | X | X |
Schletz A. | Keramik für die mobile Leistungselektronik. DGM Roadmapping-Workshop: Hochleistungs-Keramik-Werkstoffe für zukünftige Anwendungen in der Mobilität. 10-Sep-2013 | X | |
Hutzler A., Tokarski A., Schletz A. | Extending the power cycling lifetime of SiC diodes (by increased cooling temperatures). ISiCPEAW, Stockholm, 2013 | X | |
Kraft S., Zischler S., Schletz A. | Properties of a novel silver sintering die attach material for high temperature - high lifetime applications. SENSOR 2013, Nuremberg, DOI 10.5162/sensor2013/B3.3 | X | X |
Kraft S., Schletz A. | Sintern statt Löten - Motivation, Verarbeitung und Herausforderungen. Viscom Technologieforum, 13- 14-Mar-2013, Hannover | X | |
Kraft S., Tinter R., Schletz A. | Thermal Resistance Simulation and Measurement of a Double Sided Cooled Power Module. In Proceedings of the 8th European Advanced Technology Workshop on Micropackaging and Thermal management, IMAPS, La Rochelle, 2013. | X | |
Hofmann M., Schletz A., Domes K., März M., Frey L. | Modular Inverter Power Electronic for Intelligent e-Drives. IEEE-Proceedings of 2nd International Electric Drives Production Conference (EDPC), Nuremberg, 2012 | X | |
März M., Schletz A., Malipaard D. | Trend zur Hochtemperatur-Leistungselektronik? Zusammenhang zwischen neuen Materialien, Bauteiloptimierung und Systemintegration. Industrieworkshop, Mainz, 31-Jan-2012 | X | |
Schletz A. | Die attach for SiC devices operated at elevated temperatures. ECPE SiC & GaN User Forum, Potential of Wide Bandgap Semiconductors in Power Electronic Applications, Birmingham, 02-Sep-2011 | X | |
Schletz A. | Die attach for SiC devices operated at elevated temperatures. ISiCPEAW 2011, Stockholm, Schweden, 03-May-2011 | X | |
Knörr M., Schletz A. | Power Semiconductor Joining through Sintering of Silver Nanoparticles: Evaluation of Influence of Parameters Time, Temperature and Pressure on Density, Strength and Reliability. 6th International Conference on Integrated Power Electronics Systems (CIPS). Nuremberg, 16- 18-Mar-2010 | X | |
Knörr M., Schletz A., Oertel S., Jank M. | Semiconductor Joining through Sintering of Ag-Nanoparticles: Analysis of Suitability of Different Powders Using DSC and TGA Measurements. Proceedings of The World Congress on Particle Technology (WCPT6), Nuremberg, 26- 29-Apr-2010 | X | |
Egelkraut S., Rauch M., Schletz A., März M., Ryssel H., Frey L. | Polymer bonded soft magnetics for EMI filter applications. Automotive meets Electronics (AmE) Tagung, Dortmund, 15- 16-Apr-2010 | X | |
Egelkraut S., Rauch M., Schletz A., März M. | A Highly Integrated EMI Filter Using Polymer Bonded Soft Magnetics as Core Material. APEC Conference 2010, Palm Springs, USA, 21- 24-Feb-2010 | X | X |
Schletz A. | Double-Sided Cooling in Automotive Power Electronics. ECPE "Workshop – Mechatronic System Integration", Paris, 01. Oktober 2009 | X | |
Schletz A. | Thermal Management on PCBs I - Heat Spreading and Shielding. ECPE Workshop on Power PCBs & Busbars, Delft, 21-Nov-2008 | X | |
März M., Eckardt B., Schletz A. | Anforderungsgerechte Auslegung von Leistungselektronik im Antriebsstrang. Tagung "Elektrik/Elektronik in Hybrid- und Elektrofahrzeugen", Haus der Technik, Munich, 17- 18-Nov-2008, expert verlag, ISBN 978-3-8109-2817-1, S. 213-225 | X | |
Schletz A. | New Technologies for Liquid-Cooled Power Modules. ECPE-HOPE Symposium Automotive Power Electronics, Sindelfingen, 7- 8-Oct-2008 | X |