Active Power Cycling & Thermal Characterization

Fields of Research and Service

Design and assembly of power modules for testing (silver sintering, soldering, wire bonding)
Generation of lifetime data
Statistical analysis and interpretation of measured lifetime data
Lifetime modelling for die attach technologies and power modules
Long time experience on power cycling tests and analyzing of failure mechanisms
Consultancy on test planning, failure modes, and result interpretation

5 independent test benches available
Up to 20 devices in one test run
On-line measurement and control system for each device under test (indirect measurement principle)
Thermal impedance Z_th measurement during each cycle and all samples
Foster-Cauer network calculation
Individual setting of gate-voltage for every device under test
Automatic end-of-life-detection
Heating current from 0.1A up to 2000A
Heating voltage up to 35V
Heating and cooling power up to 20kW
Coolant temperatures from -60 ... +350°C possible

Active temperature cycling is an accelerated lifetime test for power electronic devices
Reliability characterization of new packaging concepts, materials, devices and technologies
The device is heated up via DC-current by semiconductor power losses
After heating the samples are cooled down by the heat sink coolant

Liquid and air cooling
Coolant temperatures from -60.. +350°C possible
Coolant pressure up to 8bar possible
Various coolants possible
Interaction of power cycling with temperature or pressure swings in coolant possible