Fields of Research and Service
- Design and assembly of power modules for testing (silver sintering, soldering, wire bonding)
- Generation of lifetime data
- Statistical analysis and interpretation of measured lifetime data
- Lifetime modelling for die attach technologies and power modules
- Long time experience on power cycling tests and analyzing of failure mechanisms
- Consultancy on test planning, failure modes, and result interpretation
Description of test principle
- Active temperature cycling is an accelerated lifetime test for power electronic devices
- Reliability characterization of new packaging concepts, materials, devices and technologies
- The device is heated up via DC-current by semiconductor power losses
- After heating the samples are cooled down by the heat sink coolant