RELY Research Project: New Ways of Chip Design Methodology

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Joint news release by the partners of the “RELY” research project (EADS, Fraunhofer-Gesellschaft, Infineon Technologies, MunEDA, Technical University of Munich, University of Bremen and X-FAB Semiconductor Foundries)

Germany’s foreign trade success is determined to an ever-increasing degree by the quality and reliability of high-tech products. Seven partners from the German business and research communities are teaming up in the three-year “RELY” project to explore ways of enhancing the quality, reliability and resilience of modern microelectronic systems. The focus will be on applications in transportation, in particular electromobility, in medical technology and automation.

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