Fraunhofer Institute for Integrated Systems and Device Technology IISB
© Fraunhofer IISB
Workshop der GMM-Nutzergruppe "Abscheide- und Ätzverfahren"
Event details
Costs
120,- Euro pro Teilnehmer
Location
Fraunhofer IISB
Schottkystr. 10, 91058 Erlangen, Germany
Date
December 04, 2024
Organization
-
Fraunhofer IISB
Neue Einzelprozesse für Abscheide- und Ätzverfahren
SPTS PECVD Overview
Franz Bosl, KLA, Dresden
Self-Assembled-Monolayers: Surface functionalisation for More-than-Moore applications
Toni Sandbrink-Koblenz, memsstar ltd., Livingston, Vereinigtes Königreich
PECVD Solutions for Advanced Packaging and Hybrid Bonding
Dirk Fischer, Lam Research, Dresden
Schnittstellen zwischen Front-End- und Back-End-of-Line zu AVT
Challenges in backside processing of SiC power devices
Carsten Hellinger, Fraunhofer IISB, Erlangen
Cross-sectional Nanoindentation: A Quantitative Approach for Assessing Adhesion Strength of Ductile Thin Films on Semiconductors
Dawei Zhao, Fraunhofer IISB, Erlangen
From Wafer to Module Level – Challenges in Packaging for Power Devices
Silvia Braun, Fraunhofer ENAS, Chemnitz
Dicing without Headache – Laser Dicing in Liquids as a New Approach for High Quality Dicing and Structuring of Every Material in One Process Step
Alexander Kanitz, Lidrotec GmbH, Bochum
Adoption of Plasma Dicing for Advanced Packaging and Specialty Applications
Stephen Bamforth, KLA, Newport, Vereinigtes Königreich
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