CIPS 2026

In the next decades, power electronic system development will be driven by energy saving systems, intelligent energy management, power quality, system miniaturization, and high reliability. Monolithic and hybrid system integration will comprise advanced device concepts including wide bandgap devices, new packaging technologies, and the overall integration of actuators/drives (mechatronic integration).

The CIPS conference consequently focuses on the following topics:

• Assembly and interconnect technology for power electronic devices and converters
• Integration of hybrid systems and mechatronic systems with high power density
• Systems' and components' operational behavior, reliability, and availability

Basic technologies for integrated power electronic systems as well as upcoming new important applications are presented in interdisciplinary invited papers.
 

Meet us at CIPS 2026

We are looking forward to meeting you at the exhibition (booth 16) and in the scientific conference sessions.

List of conference presentations from Fraunhofer IISB