Integrated digital value chain for a European semiconductor industry 4.0

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© Fraunhofer IISB

How can the extreme economic requirements in the semiconductor industry be combined with the most possible flexibility in wafer sizes, semiconductor materials and manufacturing processes?

In the "Integrated Development 4.0" (iDev40) project, flexible components for an intelligent platform for rapid prototyping were developed at Fraunhofer IISB. This enables us to upgrade our industry-compatible prototype and small series production for customer-specific electron devices to an Industry 4.0 process environment. For the benefit of our partners and customers, we are bringing the latest scientific findings into practice.

Scientists from the Data Analytics group and the Semiconductor Technology department have developed and exemplarily implemented three modular approaches for rapid prototyping of customized electron devices: stable baseline modules, smart experiments with corresponding data analytics, and smart logistics based on a flexible MES. A central element is the evaluation of the continuous Si-CMOS and SiC process line (π-Fab®) operated by Fraunhofer IISB by learning from existing manufacturing data and implementing optimization measures. The knowledge gained can be transferred to industrial manufacturing environments.

From 2018 to 2021, iDev40 has successfully demonstrated how digitization measures in the areas of development, production and logistics are transforming the European semiconductor industry towards Industry 4.0. Holistic data validation and utilization will enable smart and flexible development and production processes. In addition to Fraunhofer IISB, the iDev40 project consortium includes more than thirty other domain market leaders, SMEs, research institutes and universities from German-speaking and European countries. The project is coordinated by Infineon Austria.

The EU project iDev40 has received funding from the ECSEL Joint Undertaking (JU) under grant agreement No 783163. The JU receives support from the European Union’s Horizon 2020 research and innovation program. It is co-funded by the consortium members, as well as grants from Austria, Germany, Belgium, Italy, Spain, and Romania.

Full project findings by Fraunhofer IISB (paper):

Smart Platform for Rapid Prototyping: Solutions in the Dilemma of Flexibility and Standardization

Link to the project homepage:


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