Nutzertreffen "PVD, PECVD, Ätzen"

Aspects of High Aspect Ratio Si Etch
Matthias Rudolph, Fraunhofer CNT, Dresden, Germany

Empty W-Plugs in Contact, V1, V2 und Residuals after Ash Rework + MIM patterning
Dirk Wolansky, IHP Innovations for High Performance, Frankfurt (Oder), Germany

AlCu Sputter Process Development for low density Products
Jewgenij Winokurow, Vishay, Itzehoe, Germany

Edge fails caused by closed contacts
Michael M. Woittennek, X-FAB Semiconductor Foundries AG, Erfurt, Germany

Untersuchung von Plasmaprozessen mittels in situ Analytik und statistischer Verfahren
Sven Zimmermann et al., Fraunhofer ENAS, Chemnitz, Germany

Daily challenges of a Foundry as successions  of the ITRS and it´s More than Moore
Tobias Sprogies, X-FAB Dresden GmbH & Co. KG, Germany

Isotropic metal etch (aluminum)
Andreas Höhn, X-FAB Semiconductor Foundries AG, Erfurt, Germany

TiN-Hardmaskopen DPS+
Lothar Brencher, Infineon Technologies Dresden GmbH, Germany

User-group topics for Micronas
Franz Nilius, Micronas, Germany

Electrical failure signature Sidewall Spacer
Uwe Schilling, Mirko Vogt, Infineon Technologies Dresden GmbH, Germany