23. Treffen der Nutzergruppe Heißprozesse und RTP

8. Mai 2008

am Fraunhofer IISB in Erlangen


Anton Bauer, Fraunhofer IISB, Erlangen

Investigation of Ultra Thin Thermal Nitrided Gate Dielectrics in Comparison to Plasma Nitrided Gate Dielectrics for High-Performance Logic Application for 65nm
Martin Trentzsch, Saxony Manufacturing GmbH, Dresden

Flash-RTP Overview
Steffen Frigge, Mattson Thermal Products GmbH, Dornstadt

Optimum Activation and Diffusion with a Combination of Spike and Flash Annealing
Silke Paul, Mattson Thermal Products GmbH, Dornstadt

Modelling and Simulation of Advanced Annealing Schemes for Arsenic Activation
Alberto Martinez-Limia, Fraunhofer IISB, Erlangen

Micro-Uniformity During Laser Anneal: A Joint IMEC/CAPRES Paper Presented at MRS 2008
Bo Svarrer Hansen, CAPRES A/s, Kongens Lyngby, Denmark

Produktpräsentation - Kornic-Europe
Piotr Strzyzewski, Kornic-Europe GmbH, Herzogenrath

Short Time Thermal Processing: From Electronics via Photonics to Pipe Organs of the 17th Century
Wolfgang Skorupa, Forschungszentrum Dresden-Rossendorf

Cleaning of Silicon Surfaces for Nanotechnology
Oliver Senftleben, Universität der Bundeswehr München

Si Surface Preparation and Passivation by Heavy Water Vapor
Andrea E. Pap, Research Institute for Technical Physics and Materials Science, Budapest, Hungary