44. Treffen der Nutzergruppe Heißprozesse und RTP

3. April 2019

Fraunhofer IISB, Erlangen

Tagesordnung

Begrüßung
Anton Bauer, Fraunhofer IISB, Erlangen
Wilfried Lerch

Local Temperature Compensation during an RTP Process by Means of an Additional Heating Source
Thorsten Hülsmann, Mattson Thermal Products GmbH, Dornstadt

Millisecond Flash Lamp Annealing and Application for SiGe-HBT
Alexander Scheit, IHP, Frankfurt (Oder)

Combined Magnetron Sputtering- and Flash Lamp Annealing-Tool for Thin Film Processing under Vacuum Conditions
Viktor Begeza, Helmholtz-Zentrum Dresden-Rossendorf, Dresden

Doping of Silicon Nanowires by Ion Implantation and Flash Lamp Annealing
Lars Rebohle, Helmholtz-Zentrum Dresden-Rossendorf, Dresden

Wafer Back-Thinning and Ohmic Contact Formation by Laser Annealing to Reduce ON-Resistance of SiC Power Devices
Carsten Hellinger, Fraunhofer IISB, Erlangen

Morphology Adjustment for Selective Silicon Chemical Vapor Deposition
Alexander Scheit, IHP, Frankfurt (Oder)

Nächstes Treffen:

am 23. Oktober 2019

bei IMS Chips in Stuttgart