Common high performance cooling solutions for power electronics consist of heat sinks with arrays of in-line or staggered pin fins under forced convection with a coolant fluid. An optimal heat sink design is thereby determined by various objectives, for example a high heat transfer capability while having small pressure losses, i.e. a high pumping efficiency.
Customized Optimization of Established Heat Sinks
With our optimization approach, established heat sink designs are further optimized considering unique boundary conditions within individual applications. The multi-objective optimization is performed by using different simulation tools and efficient genetic algorithm (GA) techniques to attain the optimal assembly of custom-designed heat sinks.