Equipment Simulation

Research Topics

Simulated concentration of ions in a reactor for plasma-enhanced chemical vapor deposition (PECVD).

Semiconductor equipment simulation helps in developing and optimizing processes and equipment. The usage of equipment simulation tools allows us to study various processes, including physical vapor deposition (PVD), chemical vapor deposition (CVD), plasma-enhanced CVD (PECVD), sputter etching, and reactive ion etching (RIE). Furthermore, we couple our inhouse feature-scale simulation tools for etching and deposition to equipment simulation output. This provides the capability to study the impact of equipment settings on structure profiles for etching and deposition.


Example for simulating the influence of the reactor pressure on the uniformity of a sputter-deposited metal layer.

We offer to develop models tailored to the customers’ needs, to perform numerical simulations of heat, flow and species problems including chemical reactions, and plasma effects to provide solutions based on the simulation results for modifications of components and processes for furnaces and plasma reactors.


Equipment Simulation