Conference / 16. September 2026 - 18. September 2026
32nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
THERMINIC is the major European Workshop related to thermal and reliability issues in electronic components and systems. The program covers a broad range of topics, including thermal simulations, materials innovations, reliability, high-performance computing, electronics cooling, thermal management of data centers, and emerging thermal technologies.
The Fraunhofer IISB presentation
Comparison of Radial and Axial Thermal Transport in Silicon Nanowires
by A. Burenkov et al.
Session details: Session S 8.B - Thermal Simulations 2 | Fri, September 18, 11:25 am - 12:45 pm
shows calculations and interpretations of the axial and radial thermal transport in cylindrical silicon nanowires of different sizes by means of molecular dynamics simulations.
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB