Conference  /  September 16, 2026  -  September 18, 2026

32nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

THERMINIC is the major European Workshop related to thermal and reliability issues in electronic components and systems. The program covers a broad range of topics, including thermal simulations, materials innovations, reliability, high-performance computing, electronics cooling, thermal management of data centers, and emerging thermal technologies.

The Fraunhofer IISB presentation

Comparison of Radial and Axial Thermal Transport in Silicon Nanowires

by A. Burenkov et al.
Session details: Session S 8.B - Thermal Simulations 2 | Fri, September 18, 11:25 am - 12:45 pm

shows calculations and interpretations of the axial and radial thermal transport in cylindrical silicon nanowires of different sizes by means of molecular dynamics simulations.

We are looking forward to seeing you in Berlin!