IISB Publications 2022

Jahr
Year
Titel/Autor:in
Title/Author
Publikationstyp
Publication Type
2022 Fabrication and nanophotonic waveguide integration of silicon carbide colour centres with preserved spin-optical coherence
Babin, C.; Stöhr, R.; Morioka, N.; Linkewitz, T.; Steidl, T.; Wörnle, R.; Liu, D.; Hesselmeier, E.; Vorobyov, V.; Denisenko, A.; Hentschel, M.; Gobert, C.; Berwian, P.; Astakhov, G.V.; Knolle, W.; Majety, S.; Saha, P.; Radulaski, M.; Son, N.T.; Ul-Hassan, J.; Kaiser, F.; Wrachtrup, J.
Zeitschriftenaufsatz
Journal Article
2022 A holistic contribution to fast innovation in electric vehicles: An overview of the DEMOBASE research project
Bordes, A.; Danilov, D.L.; Desprez, P.; Lecocq, A.; Marlair, G.; Truchot, B.; Dahmani, M.; Siret, C.; Laurent, S.; Herreyre, S.; Dominget, A.; Hamelin, L.; Rigobert, G.; Benjamin, S.; Legrand, N.; Belerrajoul, M.; Maurer, W.; Chen, Z.; Raijmakers, L.H.J.; Li, D.; Zhou, J.; Notten, P.H.L.; Perlo, P.; Biasiotto, M.; Introzzi, R.; Petit, M.; Martin, J.; Bernard, J.; Koffel, S.; Lorentz, V.; Durling, E.; Kolari, S.; Wang, Z.; Massazza, M.; Lamontarana, S.
Zeitschriftenaufsatz
Journal Article
2022 Quantitative Assessment of the Porosity in Ag-sintered Joints by non-destructive acoustic Inspection supplemented with a Deep Leaning assisted Signal Analysis
Brand, Sebastian; Kögel, Michael; Altmann, Frank; Bach, Hoang Linh
Konferenzbeitrag
Conference Paper
2022 Modular Ultra-Low-Power IoT-Core - Bridging the Gap Between Power Electronics and Distributed Sensor Networks
Brockmann, Carsten; Al-Magazachi, Samer; Rezaei, Alireza; Hefer, Jan; Hager, Jan; Gerstner, Holger; Matlok, Stefan; Eckardt, Bernd; Eppel, Markus; Milosiu, Heinrich; Oehler, Frank
Konferenzbeitrag
Conference Paper
2022 Einsatz von Wasserstofftechnologien in Mobilität und Transport
Bürger, Stefan; Horch, Felix; Geiling, Johannes; Öchsner, Richard; Kolb, Gunther; Groos, Ulf; Semmel, Malte; Schaadt, Achim; Köhler, Jonathan
Aufsatz in Buch
Book Article
2022 Silver Sintering on PCBs - Methods and Reliability
Dresel, Fabian; Müller, Jonas; Leib, Jürgen; Schletz, Andreas
Konferenzbeitrag
Conference Paper
2022 Accelerated Lifetime Testing and Failure Analysis for Advanced Automotive Grade Ceramic Capacitors (MLCC)
Dresel, Fabian; Leib, Jürgen; Schletz, Andreas; Boettge, Bianca; Klengel, Sandy
Konferenzbeitrag
Conference Paper
2022 Sub-Kelvin thermometry for evaluating the local temperature stability within in situ TEM gas cells
Fritsch, Birk; Wu, Mingjian; Hutzler, Andreas; Zhou, Dan; Spruit, Ronald; Vogl, Lilian; Will, Johannes; Perez Garza, H. Hugo; März, Martin; Jank, Michael; Spiecker, Erdmann
Zeitschriftenaufsatz
Journal Article
2022 A Review of Platinum Diffusion in Silicon and its Application for Lifetime Engineering in Power Devices
Johnsson, Anna; Schmidt, Gerhard; Hauf, Moritz; Pichler, Peter
Review
2022 Homoepitaxial Growth of 4H-SiC on Vicinal Substrates
Kallinger, Birgit
Aufsatz in Buch
Book Article
2022 Homoepitaxial growth and defect characterization of 4H-SiC
Kallinger, Birgit; Kranert, Christian; Schade, Zara Mercedes; Rommel, Mathias; Berwian, Patrick
Meeting Abstract
2022 Mechanisms of ohmic contact formation of Ti/Al-based metal stacks on p-doped 4H-SiC
Kocher, Matthias; Rommel, Mathias; Michalowski, P.; Erlbacher, Tobias
Zeitschriftenaufsatz
Journal Article
2022 Aluminum Activation in 4H-SiC Measured on Laterally Contacted MOS Capacitors with a Buried Current-Spreading Layer
Mletschnig, Kristijan Luka; Rommel, Mathias; Pobegen, Gregor; Schustereder, Werner; Pichler, Peter
Konferenzbeitrag
Conference Paper
2022 Low-Temperature and UV Irradiation Effect on Transformation of Zirconia -MPS nBBs-Based Gels into Hybrid Transparent Dielectric Thin Films
Musat, V.; Herbei, E.E.; Anghel, E.M.; Jank, Michael; Oertel, Susanne; Timpu, D.; Frangu, L.
Zeitschriftenaufsatz
Journal Article
2022 Silver Sintering of Packaged GaN-Devices on Printed Circuit Board
Müller, Jonas; Letz, Sebastian A.; Flaviu-Bogdan, Simon; Bayer, Christoph F.; Schletz, Andreas; Görlich, Jens; Nishimura, Takatoshi
Zeitschriftenaufsatz
Journal Article
2022 Integrated Digital and Analog Circuit Blocks in a Scalable Silicon Carbide CMOS Technology
Romijn, J.; Vollebregt, S.; Middelburg, L.M.; El Mansouri, B.; Zeijl, H.W. van; May, Alexander; Erlbacher, Tobias; Zhang, G.; Sarro, P.M.
Zeitschriftenaufsatz
Journal Article
2022 Visible Blind Quadrant Sun Position Sensor in a Silicon Carbide Technology
Romijn, Joost; Vollebregt, Sten; May, Alexander; Erlbacher, Tobias; Zeijl, Henk W. van; Leijtens, Johan; Zhang, Guoqi; Sarro, Pasqualina M.
Konferenzbeitrag
Conference Paper
Diese Liste ist ein Auszug aus der Publikationsplattform Fraunhofer-Publica

This list has been generated from the publication platform Fraunhofer-Publica