Fraunhofer Institute for Integrated Systems and Device Technology IISBNovember 26, 2008
Fraunhofer IISB, Erlangen
Workshop "Wafer level packaging and new developments in deposition and etching"
Wafer level packaging and new developments in deposition and etching
Wafer level packaging
Development in wafer level packaging
Dr. Thorsten Meyer, Dr. Manfred Schneegans, Infineon Technologies AG, Germany
Carrier technology: Handling and processing of thin wafers
Dr. Hans Hirscher, OC Oerlikon Balzers AG, Balzers, Liechtenstein
Deep features with high aspect ratio
Dr. Jürgen Weichart, OC Oerlikon Balzers AG, Balzers, Liechtenstein
Integrated through silicon via (TSV) processing
Wolfram Girke, Kevin Powell, Aviza Technology Ltd., Newport, United Kingdom
New developments in deposition and etching
Ruthenium Atomic Vapor Deposition, enabling solutions for emerging semiconductor applications
Bernhard Seitzinger, Dr. Peter K. Baumann, AIXTRON AG, Aachen, Germany
Mini-batch process for plasma-nitridation of SiO2
Matthias Wolf, Fraunhofer IISB, Erlangen, Germany
New industrial dry ashing platform using planar microwave plasma for SU-8, wafer bumping and high-rate resist removal
Gerhard Liebel, PVA TEPLA AG, Feldkirchen, Germany
In situ temperature measurement and APC
Dr. Martin Sporn 1), Dr. Hans Hirscher 2)
1) Infineon Technologies Villach AG, Villach, Austria
2) OC Oerlikon Balzers AG, Balzers, Liechtenstein
Enhancements for Centura and Endura systems
Georg Meier, Applied Materials GmbH, Dresden, Germany
Direct access to sensor signals - a communication alternative for legacy equipment
Dr. Gerhard Kleineidam, InReCon AG, Sinzing, Germany