Integration Aspects of Electroplated Metal Films, New Developments in Deposition and Etching

A Novel Electroplating System for High-Volume Manufacturing of Pillar Bumps and RDL
Keith Buchanan, SPTS Technologies Ltd, Newport, United Kingdom

Seed-Layer Resistance and its Impact on the Electrochemical Copper Deposition
Marcus Wislicenus, Fraunhofer Institute for Photonic Microsystems IPMS - Center Nanoelectronic Technologies (CNT), Dresden, Germany

Control of Electroplating Processes in Semiconductor Industry
Nik Maser, ancosys GmbH, Pliezhausen, Germany

Lam Sabre 3D Azimuthal WiW Uniformity Tuning for RDL Plating
Michael Woitge, Lam Research GmbH, Dresden, Germany

Electroplated Metal Films: EPD during Wet Etch and Non-Destructive Thickness Measurement
Marcello Binetti, LayTec AG, Berlin, Germany

Optimization of F₂-based Chamber Cleaning in PECVD, RPS and MERIE Chambers
Robert Wieland, Fraunhofer Research Institution for Microsystems and Solid State Technologies EMFT, Munich, Germany

Si & SiGe In-Situ Doping Thin Films: Transfer to Industry
Jesús Calvo, Fraunhofer Institute for Photonic Microsystems IPMS - Center Nanoelectronic Technologies (CNT), Dresden, Germany

AFM Surface Roughness and Depth Measurement of Trenches with High Aspect Ratios
Franz Heider, Infineon Technologies Austria AG, Villach, Austria

Artificial Neural Networks for Process Control
Maike Stern, Fraunhofer Institute for Integrated Systems and Device Technology IISB, Erlangen, Germany

Optimization of Thin Film Deposition Processes and Equipment Based on Simulation
Jörg Schuster, Fraunhofer Institute for Electronic Nano Systems (ENAS), Chemnitz, Germany