New Developments in Deposition and Etching

December 5, 2018

Fraunhofer IISB, Erlangen

New Developments in Deposition and Etching

Molecular Vapor Deposition (MVD): a Versatile, Multifunctional Technology with Applications in MEMS, Packaging and Beyond
Mike Grimes, SPTS Technologies Ltd, Newport, United Kingdom


Contact Free MIS Characterisation of CVD Dielectrics

Helmut Schönherr, Infineon Technologies Austria AG, Villach, Austria


Arcing Classification and Clean Optimization in Low Pressure PECVD

Michael Klick, Plasmetrex GmbH, Berlin, Germany


Aspects of high Aspect Ratio Silicon Trench Etching
Matthias Rudolph, Fraunhofer Institute for Photonic Microsystems IPMS – Business Unit Center Nanoelectronic Technologies (CNT), Dresden, Germany


Establishing Smart Plasma Process Control with Combined Sensor Technologies in Production Lines

Thomas Schütte, PLASUS GmbH, Mering, Germany


Advanced Metallization Solutions for Semiconductor Applications
Marco Arnold, BASF, Ludwigshafen am Rhein, Germany


Chemical Process Models with Gas Flow Simulation for DRIE

Michael Klick, Plasmetrex GmbH, Berlin, Germany


Simulation of Layer Profiles and Deposition Rates for Physical Vapor Deposition Processes

Eberhard Bär, Fraunhofer Institute for Integrated Systems and Device Technology IISB, Erlangen, Germany


Towards Cognitive Power Electronics 4.0 - A Demonstrator for Pump Monitoring

Georg Roeder, Fraunhofer Institute for Integrated Systems and Device Technology IISB, Erlangen, Germany