Legacy Equipment & New Developments in Deposition and Etching

Legacy Equipment

Status and Requests on Support of Legacy Equipment – A Perspective from the Users
Thomas Zwack, Texas Instruments Deutschland GmbH, Freising, Germany
Franz Nilius, TDK-Micronas GmbH, Freiburg i. Br., Germany
Peter Mennemeier, ELMOS Semiconductor AG, Dortmund, Germany

Lifetime Extension of Established Equipment - Challenges and Opportunities
David Haynes, Lam Research Corporation, Fremont, CA, USA

New Developments in Deposition and Etching

Wide Band Gap Material (SiC/GaN) Plasma Etch
Richard Barnett, SPTS Technologies Ltd., Newport, UK

SiC Device Manufacturing at Fraunhofer IISB
Anton Bauer, Fraunhofer IISB, Erlangen, Germany

PECVD and PVD Technology for 5G
Nick Knight, SPTS Technologies Ltd., Newport, UK

Enabling Specialty Technologies Through the Development of Application Specific Solutions
Michelle Bourke, Lam Research Corporation, Fremont, CA, USA

Nickel and Nickel-Platinum Silicide for BiCMOS Devices
Dirk Wolansky et al., IHP - Innovations for High Performance Microelectronics, Frankfurt (Oder), Germany

Patterning Platinum by Selective Wet Etching of Sacrificial Pt-Al Alloy
Sebastian Meier, Texas Instruments Deutschland GmbH, Freising, Germany

Cobalt ECD Development - Process Scale Up & Challenges
Robert Krause, Fraunhofer IPMS, Dresden, Germany

What Can We Learn from “Small Data“ to Improve Rapid Prototyping?
Sabrina Anger, Felix Klingert, Fraunhofer IISB, Erlangen, Germany