Treffen der GMM-Fachgruppe 1.2.6 "Prozesskontrolle, Inspektion & Analytik"

Vorstellung der IHP GmbH
Wolfgang Kissinger, IHP GmbH, Frankfurt (Oder)

Optical spectroscopy for process control in microelectronics
Oksana Fursenko, IHP GmbH, Frankfurt (Oder)

Semilab’s advanced Spectral Ellipsometry for Semiconductor and PV Industry and R&D
Christophe Defranoux, Semilab, Budapest / Ungarn

Investigating Atomic Layer Depositions with a Combination of in-situ real-time Spectroscopic Ellipsometry and Direct Surface Analysis
Marcel Junige, TU Dresden, Institut für Halbleiter- und Mikrosystemtechnik, Dresden

In-situ monitoring of dielectric multilayer stacks
Christian Camus, LayTec AG, Berlin

In-operando Hard X-ray Photoelectron Spectroscopy for RRAM physics
Malgorzata Sowinska, IHP GmbH, Frankfurt (Oder)

Synchrotron-based Micro-focused XRD Imaging Study on Structural Inhomogeneities in SiGe Buffer Layers
Marvin Zoellner, IHP GmbH, Frankfurt (Oder)

Photoelastic Characterisation of Wafer Dicing Processes
Michael Fügl, Infineon Technologies, Regensburg

Defect und Contamination Control Strategy in the 150/200mm Wafer FAB
Markus Rösch, Robert Bosch GmbH, Reutlingen

Automated Optical Inspection after Chip Separation Processes
Michael Fügl, Infineon Technologies, Regensburg

Material and Surface Characterization by Optical Spectroscopy
Roland Seitz, HORIBA Jobin Yvon GmbH, Unterhaching

Untersuchungen zu Sauerstoff-korrelierten Defekten in Czochralski-Si mit IR-Spektroskopie und IR-Polariskopie
Martin Herms, JenaWave, Jena-Maua

Advances in scatterometry for the semiconductor industry
David Mezerette, Nova Measuring Instruments, Dresden