J. Ahopelto, G. Ardila, L. Baldi, D. Belot, G. Fagas, S. De Gent, D. Demarchi, M. Fernandez-Bolaños, D. Holden, A. M. Ionescu, G. Meneghesso, A. Mocuta, M. Pfeffer, R. M. Popp, E. Sangiorgi, C. M. Sotomayor Torres: Nano Electronics roadmap for Europe: From nanodevices and innovative materials to system integration Solid-State Electronics, 155 (Elsevier Ltd, 2019) pp. 7-19 ISSN: 0038-1101 DOI: 10.1016/j.sse.2019.03.014 |
M. Albrecht, T. Erlbacher, A. J. Bauer, L. Frey: Improving 5V digital 4H-SIC CMOS ics for operating at 400°C using PMOS channel implantation Materials Science Forum, Vol 963 (Trans Tech Publications, 2019) pp. 827-831 DOI: 10.4028/www.scientific.net/MSF.963.827 |
E. Amat, A. Del Moral, J. Bausells, F. Perez-Murano, F. Klüpfel: Quantum dot location relevance into SET-FET circuits based on FinFET devices Proceedings of 33rd Conference on Design of Circuits and Integrated Systems, DCIS 2018, Art. No. 8681478, Lyon, France, November 14, 2018 - November 16, 2018 (IEEE, 2019) ISBN: 978-1-7281-0171-2 / 978-1-7281-0172-9 ISSN: 2640-5563 / 2471-6170 DOI: 10.1109/DCIS.2018.8681478 |
E. Amat, F. J. Klüpfel, J. Bausells: Influence of Quantum Dot Characteristics on the Performance of Hybrid SET-FET Circuits IEEE Trans. Electron Devices, Vol 66 (10) (IEEE, 2019) pp. 4461-4467 DOI: 10.1109/TED.2019.2937141 |
M. Angerer, A. Amler, B. Ruccius, M. März: Multi-tap bus communication for modular power converters with distributed isolation Proceedings of International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management PCIM Europe, Nuremberg, Germany, Mai 07, 2019 - Mai 09, 2019 VDE - Verlag, ISBN: 978-3-8007-4938-6 |
H. L. Bach, D. Dirksen, C. Blechinger, T. M. Endres, C. F. Bayer, A. Schletz, M. März: Stackable SiC Embedded Ceramic Packages for High-Voltage and High-Temperature Power Electronics Applications IMAPS Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT), Vol 2019 (HiTen), Oxford, UK, Juli 08, 2019 - Juli 10, 2019 (IMAPS, 2019) pp. 28-33 ISSN: 2380-4491 DOI: 10.4071/2380-4491.2019.HiTen.000028 |
H. L. Bach, D. Dirksen, C. Blechinger, T. M. Endres, C. F. Bayer, A. Schletz: Stackable SiC Embedded Ceramic Packages for High-Voltage and High-Temperature Power Electronics Applications Journal of Microelectronics and Electronic Packaging: October 2019, Vol 16, No. 4 (IMAPS, 2019) pp. 176-181 |
C. F. Bayer: Fraunhofer IISB erforscht Korrosion Mikroelektronik Nachrichten, Vol 74: März 2019 (Fraunhofer-Verbund Mikroelektronik, Berlin, 2019) |
C. F. Bayer, U. Waltrich, A. Soueidan, R. Schneider, E. Bär, A. Schletz: Enhancement of the partial discharge inception voltage of DBCs by adjusting the permittivity of the encapsulation Proceedings of CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems, Nuremberg, Germany, März 08, 2016 - März 10, 2016 (VDE - Verlag, 2019) ISBN: 978-3-8007-4171-7 |
C. F. Bayer, U. Waltrich, R. Schneider, E. Bär, A. Schletz: Enhancing partial discharge inception voltage of DBCs by geometrical variations based on simulations of the electric field strength Proceedings of CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems, Nuremberg, Germany, März 08, 2016 - März 10, 2016 (VDE - Verlag, 2019) ISBN: 978-3-8007-4171-7 |
M. Beier, C. Reimann, J. Friedrich, U. A. Peuker, T. Leißner, M. Gröschel, V. Ischenko: Silicon waste from the photovoltaic industry – A material source for the next generation battery technology? Materials Science Forum, Vol 959 (Trans Tech Publications, 2019) pp. 107-112 DOI: 10.4028/www.scientific.net/MSF.959.107 |
S. Beljakova, P. Pichler, B. Kalkofen, R. Hübner: Diffusion of Phosphorus and Boron from Atomic Layer Deposition Oxides into Silicon Physica Status Solidi (A) Applications and Materials Science, 216 (17), Art. No. 1900306 (PSS, 2019) ISSN: 1862-6300 DOI: 10.1002/pssa.201900306 |
C. Bentheimer, A. Ilsami, S. Mainusch, F. Hilpert, B. Eckardt, M. März: Highly efficient SiC inverter for aircraft application with innovative thermal management Proceedings of International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management PCIM Europe, Nuremberg, Germany, Mai 07, 2019 - Mai 09, 2019 VDE - Verlag, ISBN: 978-3-8007-4938-6 |
S. Besendörfer, E. Meissner, A. Lesnik, J. Friedrich, A. Dadgar, T. Erlbacher: Methodology for the investigation of threading dislocations as a source of vertical leakage in AlGaN/GaN-HEMT heterostructures for power devices Journal of Applied Physics, Vol 125 (9), Art. No. 95704 (AIP Publishing, Melville, 2019) ISSN: 0021-8979 / 1089-7550 DOI: 10.1063/1.5065442 |
J. Beyer, N. Schüler, J. Erlekampf, B. Kallinger, P. Berwian, K. Dornich, J. Heitmann: Minority carrier lifetime measurements on 4H-SiC epiwafers by timeresolved photoluminescence and microwave detected photoconductivity Materials Science Forum, Vol 963 (Trans Tech Publications, 2019) pp. 313-317 ISSN: 1662-9752 DOI: 10.4028/www.scientific.net/MSF.963.313 |
S. Bockrath, A. Rosskopf, S. Koffel, S. Waldhör, K. Srivastava, V. R. H. Lorentz: State of Charge Estimation using Recurrent Neural Networks with Long Short-Term Memory for Lithium-Ion Batteries IECON 2019, IEEE 45th Annual Conference of the Industrial Electronics Society, Lisbon, Portugal, Oktober 14, 2019 - Oktober 17, 2019 (IEEE, 2019) DOI: 10.1109/IECON.2019.8926815 |
N. Boettcher, T. Heckel, T. Erlbacher, K. Peliac: Silicon RC-Snubber for 900 v Applications Utilising non-Stoichiometric Silicon Nitride Proceedings of the 31st International Symposium on Power Semiconductor Devices and ICs, ISPSD, Art. No. 8757589, Shanghai,China, Mai 19, 2019 - Mai 23, 2019 (IEEE, 2019) pp. 351-354 ISBN: 978-1-7281-0581-9 / 978-1-7281-0580-2 ISSN: 1946-0201 / 1063-6854 DOI: 10.1109/ISPSD.2019.8757589 |
A. R. Brown, L. Wang, P. Asenov, F. J. Klüpfel, B. Cheng, S. Martinie, O. Rozeau, S. Barraud, J. C. Barbe, C. Millar, J. K. Lorenz: From devices to circuits: Modelling the performance of 5nm nanosheets International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2019, Art. No. 8870357, Udine, Italy, September 04, 2019 - September 06, 2019 (IEEE, 2019) ISBN: 978-1-7281-0940-4 / 978-1-7281-0941-1 ISSN: 1946-1577 / 1946-1569 DOI: 10.1109/SISPAD.2019.8870357 |
J. Buettner, T. Erlbacher, A. J. Bauer: Technological advances towards 4H-SiC JBS diodes for wind power applications Applications in Electronics Pervading Industry, Environment and Society. ApplePies 2018. Lecture Notes in Electrical Engineering, Vol 573 edited by S Sapponara, A De Gloria (Springer International Publishing, Cham, 2019) pp. 83-89 ISBN: 978-3-030-11972-0 (Print) / 978-3-030-11973-7 (Online) DOI: 10.1007/978-3-030-11973-7_11 |
Y. C. Chen, P. S. Salter, M. Niethammer, M. Widmann, F. Kaiser, R. Nagy, N. Morioka, C. Babin, J. Erlekampf, P. Berwian, M. J. Booth, J. Wrachtrup: Laser Writing of Scalable Single Color Centers in Silicon Carbide Nano Letters, 19 (4) (cited 4 times) (ACS Publications, 2019) pp. 2377-2383 DOI: 10.1021/acs.nanolett.8b05070 |
L. Devaraj, G. Bottiglieri, A. Erdmann, F. Wählisch, M. Kupers, E. Van Setten, T. Fliervoet: Lithographic effects due to particles on high-NA EUV mask pellicle Proceedings of SPIE - The International Society for Optical Engineering, Vol 11177, 35th European Mask and Lithography Conference, EMLC, Art. No. 111770V, Dresden, Germany, Juni 17, 2019 - Juni 19, 2019 (Society of Photo-Optical Instrumentation Engineers (SPIE), Bellingham, 2019) DOI: 10.1117/12.2534177 |
L. Di Benedetto, G. D. Licciardo, A. Huerner, T. Erlbacher, A. J. Bauer, A. Rubino: First Experimental Test on Bipolar Mode Field Effect Transistor Prototype in 4H-SiC. A Proof of Concept Materials Science Forum, Vol 963 / Silicon Carbide and Related Materials 2018 : Selected papers from the 12th European Conference on Silicon Carbide and Related Materials ECSCRM 2018, Birmingham, UK, September 02, 2018 - September 06, 2018 (Scientific.Net, 2019) pp. 697-700 DOI: 10.4028/www.scientific.net/MSF.963.697 |
L. Di Benedetto, C. D. Matthus, T. Erlbacher, A. J. Bauer, G. D. Licciardo, A. D. Rubino, L. Frey: Performance of 4H-SIC bipolar diodes as temperature sensor at low temperatures Materials Science Forum, Vol 963 (Trans Tech Publications, 2019) pp. 572-575 DOI: 10.4028/www.scientific.net/MSF.963.572 |
A. Diepgen, V. Zimmermann, C. F. Bayer, Y. Zhou, C. Forster, P. Wilbers, J. Leib, A. Schletz, S. Virtanen, M. März: Parylene Coatings in Power Electronic Modules ISAPP 2019 International Symposium on Advanced Power Packaging, Osaka, Japan, Oktober 07, 2019 - Oktober 08, 2019 |
S. Ehrlich, C. Joffe, H. Tielke, M. Leinfelder, M. März: Comprehensive SPICE model for power inductor losses Proceedings of IEEE Applied Power Electronics Conference and Exposition - APEC, Art. No. 8722180 (cited 1 time) (IEEE, 2019) pp. 1237-1244 ISBN: 978-1-5386-8330-9 / 978-1-5386-8331-6 ISSN: 2470-6647 / 1048-2334 DOI: 10.1109/APEC.2019.8722180 |
A. Endruschat, C. Novak, H. Gerstner, T. Heckel, C. Joffe, M. März: A Universal SPICE Field-Effect Transistor Model Applied on SiC and GaN Transistors IEEE Transactions on Power Electronics, Vol 34 (9), Art. No. 8586977 (IEEE, 2019) pp. 9131-9145 ISSN: 0885-8993 / 1941-0107 DOI: 10.1109/TPEL.2018.2889513 |
A. Erdmann, P. Evanschitzky, H. Meshily, V. Philipsen, E. Hendrickx, M. Bauer: Attenuated phase shift mask for extreme ultraviolet: Can they mitigate three-dimensional mask effects? Journal of Micro/ Nanolithography, MEMS, and MOEMS, Vol 18 (1), Art. No. 11005 (cited 4 times) (Society of Photo-Optical Instrumentation Engineers (SPIE), Bellingham, 2019) DOI: 10.1117/1.JMM.18.1.011005 |
A. Erdmann, P. Evanschitzky, G. Bottiglieri, E. Van Setten, T. Fliervoet: 3D mask effects in high NA EUV imaging Proceedings of SPIE - The International Society for Optical Engineering, Vol 10957, Extreme Ultraviolet (EUV) Lithography X, Art. No. 109570Z (cited 1 time), San Jose, United States, Februar 25, 2019 - Februar 28, 2019 (Society of Photo-Optical Instrumentation Engineers (SPIE), Bellingham, 2019) DOI: 10.1117/12.2515678 |
T. Erlbacher, G. Rattmann: TSV-based passive networks for monolithic integration in smartpower ICS for automotive applications Proceedings of 10. GMM Fachtagung "Automotive meets Electronics" 2019, Dortmund, Germany, März 12, 2019 - März 13, 2019 (VDE - Verlag, 2019) ISBN: 978-3-8007-4877-8 |
J. Erlekampf, B. Kallinger, J. Weiße, M. Rommel, P. Berwian, J. Friedrich, T. Erlbacher: Deeper insight into lifetime-engineering in 4H-SiC by ion implantation Journal of Applied Physics, Vol 126 (4), Art. No. 45701 (AIP Publishing, Melville, 2019) DOI: 10.1063/1.5092429 |
J. Friedrich, G. Müller: Erlangen—An Important Center of Crystal Growth and Epitaxy: Major Scientific Results and Technological Solutions of the Last Four Decades Crystal Research and Technology, Art. No. 1900053 (WILEY‐VCH Verlag, Weinheim, 2019) DOI: 10.1002/crat.201900053 |
J. Friedrich, T. Jung, M. Trempa, C. Reimann, A. Denisov, A. Muehe: Considerations on the limitations of the growth rate during pulling of silicon crystals by the Czochralski technique for PV applications Journal of Crystal Growth, Vol 524, Art. No. 125168 edited by Thomas F. Kuech (Elsevier Ltd, Amsterdam, 2019) ISSN: 0022-0248 DOI: 10.1016/j.jcrysgro.2019.125168 |
M. Gepp, V. R. H. Lorentz, M. März, F. Geffray, E. Guyon, F. Chopard: Spatial and Temporal Temperature Homogenization in an Automotive Lithium-Ion Pouch Cell Battery Module ELECTRIMACS 2019, Salerno, Italy, Mai 21, 2019 - Mai 23, 2019 (Springer International Publishing, Cham, 2019) |
S. Grünler, G. Rattmann, T. Erlbacher, A. J. Bauer, F. Krach, L. Frey: Towards highly integrated, automotive power SoCs using capacitors operating at 100 V implemented in TSV Proceedings of CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems (cited 1 time), Nuremberg, Germany, März 08, 2016 - März 10, 2016 (VDE - Verlag, 2019) ISBN: 978-3-8007-4171-7 |
V. Häublein, A. J. Bauer, H. Ryssel, L. Frey: Mass Separation Issues for the Implantation of Doubly Charged Aluminum Ions Proceedings of 22nd International Conference on Ion Implantation Technology IIT 2018, Würzburg, Germany, September 19, 2018 - September 24, 2018 edited by Volker Häublein, Heiner Ryssel (IEEE, 2019) pp. 291-294 ISBN: 978-1-5386-6828-4 DOI: 10.1109/IIT.2018.8807903 |
R. He, W. Heyn, F. Thiel, N. Pérez, C. Damm, B. Rellinghaus, C. Reimann, M. Beier, J. Friedrich, H. Zhu, Z. Ren, K. Nielsch, G. Schierning: Thermoelectric properties of silicon and recycled silicon sawing waste Journal of Materiomics, Vol 5 (1) edited by The Chinese Ceramic Society (Elsevier Ltd, 2019) pp. 15-33 ISSN: 2352-8478 DOI: 10.1016/j.jmat.2018.11.004 |
Y. Huang, J. Buettner, B. Lechner, G. Wachutka: The impact of non-ideal ohmic contacts on the performance of high-voltage SIC MPS diodes Materials Science Forum, Vol 963 (Trans Tech Publications, 2019) pp. 553-557 DOI: 10.4028/www.scientific.net/MSF.963.553 |
A. Hutzler, B. Fritsch, M. P. M. Jank, R. Branscheid, R. C. Martens, E. Spieker, M. März: Nanoparticles: In Situ Liquid Cell TEM Studies on Etching and Growth Mechanisms of Gold Nanoparticles at a Solid–Liquid–Gas Interface Advanced Materials Interfaces, Vol 6 (20) (WILEY‐VCH Verlag, Weinheim, 2019) DOI: 10.1002/admi.201970126 |
A. Hutzler, B. Fritsch, M. P. M. Jank, R. Branscheid, R. C. Martens, E. Spiecker, M. März: In Situ Liquid Cell TEM Studies on Etching and Growth Mechanisms of Gold Nanoparticles at a Solid–Liquid–Gas Interface Advanced Materials Interfaces, Vol 6 (20), Art. No. 1901027 (WILEY‐VCH Verlag, Weinheim, 2019) ISSN: 2196-7350 DOI: 10.1002/admi.201901027 |
A. Hutzler, C. D. Matthus, C. Dolle, M. Rommel, M. P. M. Jank, E. Spieker, L. Frey: Large-Area Layer Counting of Two-Dimensional Materials Evaluating the Wavelength Shift in Visible-Reflectance Spectroscopy Journal of Physical Chemistry C, Vol 123 (14) (cited 2 times) (ACS Publications, 2019) pp. 9192-9201 DOI: 10.1021/acs.jpcc.9b00957 |
A. Hutzler, B. Fritsch, M. P. M. Jank, R. Branscheid, E. Spieker, M. März: Preparation of graphene-supported microwell liquid cells for in situ transmission electron microscopy Journal of Visualized Experiments, 2019 (149), Art. No. e59751 (JoVE, 2019) DOI: 10.3791/59751 |
F. Jach, P. Höhn, Y. Prots, M. Ruck: Sr4N[CN2][C2N]: The First Carbodiimide Acetonitriletriide. European Journal of Inorganic Chemistry: Humidity and Condensation in PE Systems - Degradation Mechanisms and Lifetime Modelling (WILEY‐VCH Verlag, Weinheim, 2019) pp. 1207-1211 ISSN: 1434-1948 / 1099-0682 DOI: 10.1002/ejic.201801242 |
S. Jung, S. Matlok, B. Eckardt, M. März: Analysis of a mixed transfer function and state space implementation of cascade control Proceedings of International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management PCIM Europe, Nuremberg, Germany, Mai 07, 2019 - Mai 09, 2019 VDE - Verlag, ISBN: 978-3-8007-4938-6 |
J. Kaiser, R. Weiß, J. Burk: DC Microgrids for Commercial or Industrial Buildings Bodo’s Power Systems April 2019 (Laboe, 2019) pp. 52-55 ISSN: 1863-5598 |
J. Kaiser, C. Strobl, H. Mann, H. Muhm, M. Klimpel, F. Schork, M. März: Verbundprojekt „DC-Schutzorgane“ – Entwicklung eines neuen, integrierten Schutzkonzepts und neuer Schutzorgane für zukünftige Niederspannungs-Gleichstromnetze VDE Albert-Keil-Kontaktseminar, Karlsruhe, Germany, Oktober 11, 2019 - Oktober 13, 2019 |
J. Kaiser, C. Strobl, H. Mann, H. Muhm, M. Klimpel, F. Schork, M. März: A Comprehensive Approach for Safety in DC-Microgrids The 3rd IEEE ICDCM (International Conference on DC Microgrids), Matsue, Japan, Mai 20, 2019 - Mai 23, 2019 |
J. Kaiser, F. Schork, K. Gosses, Y. Han, M. S. Schulz, L. Ott, B. Wunder, M. März: Converter overvoltage protection for DC-Grids Proceedings of INTELEC 2018, IEEE International Telecommunications Energy Conference, Art. No. 8612423, Torino, Italy, Oktober 07, 2018 - Oktober 11, 2018 (IEEE, 2019) ISBN: 978-1-5386-5370-8 / 978-1-5386-5371-5 ISSN: 0275-0473 / 2158-5210 DOI: 10.1109/INTLEC.2018.8612423 |
B. Kallinger, J. Erlekampf, K. Rosshirt, P. Berwian, M. Stockmeier, M. Vogel, P. Hens, F. Wischmeyer: Influence of substrate properties on the defectivity and minority carrier lifetime in 4H-SiC homoepitaxial layers Materials Science Forum, Vol 963 (Trans Tech Publications, 2019) pp. 109-113 DOI: 10.4028/www.scientific.net/MSF.963.109 |
S. Kim, H. K. Kim, M. Lim, S. Jeong, M. J. Kang, M. S. Kang, N. S. Lee, T. V. Cuong, H. S. Kim, T. Erlbacher, A. J. Bauer, H. K. Shin: Ohmic Contact Mechanism for Ni/C-faced 4H-n-SiC Substrate Journal of Nanomaterials, Vol 2019, Art. No. 5231983 (Hindawi, London, 2019) DOI: 10.1155/2019/5231983 |
H. K. Kim, S. Kim, J. Buettner, M. Lim, T. Erlbacher, A. J. Bauer, S. M. Koo, N. S. Lee, H. K. Shin: Surface characterization of ion implanted 4H-SiC epitaxial layers with ion energy and concentration variations Materials Science Forum, Vol 963 (Trans Tech Publications, 2019) pp. 429-432 ISBN: 978-3-0357-1332-9 / 978-3-0357-2332-8 / 978-3-0357-3332-7 DOI: 10.4028/www.scientific.net/MSF.963.429 |
F. J. Klüpfel: A Compact Model Based on Bardeen's Transfer Hamiltonian Formalism for Silicon Single Electron Transistors IEEE Access, Vol 7, Art. No. 8746224 (IEEE, 2019) pp. 84053-84065 ISSN: 2169-3536 DOI: 10.1109/ACCESS.2019.2924913 |
F. J. Klüpfel: Influence of Sacrificial Layer Germanium Content on Stacked-Nanowire FET Performance IEEE Access, Vol 7, Art. No. 8746119 (IEEE, 2019) pp. 85855-85859 ISSN: 2169-3536 DOI: 10.1109/ACCESS.2019.2925201 |
M. Knetzger, E. Meissner, C. Schröter, J. Friedrich: Theoretical aspects and microstructural investigations on V-pit defects in HVPE grown GaN Journal of Crystal Growth, Vol 518 edited by Thomas F. Kuech (Elsevier Ltd, Amsterdam, 2019) pp. 51-58 ISSN: 0022-0248 DOI: 10.1016/j.jcrysgro.2019.04.012 |
M. Kocher, M. Rommel, T. Śledziewski, V. Häublein, A. J. Bauer: Dose Dependent Profile Deviation of Implanted Aluminum in 4H-SiC During High Temperature Annealing Proceedings of 22nd International Conference on Ion Implantation Technology IIT 2018, Würzburg, Germany, September 17, 2018 - September 22, 2018 edited by Volker Häublein, Heiner Ryssel (IEEE, 2019) pp. 58-61 ISBN: 978-1-5386-6828-3 DOI: 10.1109/IIT.2018.8807904 |
M. Kocher, T. Erlbacher, M. Rommel, A. J. Bauer: Decoration of al implantation profiles in 4H-SIC by bevel grinding and dry oxidation Materials Science Forum, Vol 963 (Trans Tech Publications, 2019) pp. 441-444 DOI: 10.4028/www.scientific.net/MSF.963.441 |
M. Kocher, B. Yao, J. Weiße, M. Rommel, Z. W. Xu, T. Erlbacher, A. J. Bauer: Determination of compensation ratios of al-implanted 4H-SIC by tcad modelling of TLM measurements Materials Science Forum, Vol 963 (Trans Tech Publications, 2019) pp. 445-448 DOI: 10.4028/www.scientific.net/MSF.963.445 |
A. Köck, R. Wimmer-Teubenbacher, F. Rosada-Ludikovska, K. Rohracher, E. Wachmann, M. Herold, T. V. Welden, J. Min Kim, Z. Ali, A. Poenninger, M. Stahl-Offergeld, H. P. Hohe, J. Lorenz, T. Erlbacher, G. Dolmans, P. Offermans, M. Vandecasteele, O. Yurchenko, O. von Sicard, R. Pohle et al.: 3D-Integrated Multi-Sensor Demonstrator System for Environmental Monitoring 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII, Art. No. 8808418, Berlin, Germany, Juni 23, 2019 - Juni 27, 2019 (IEEE, 2019) pp. 1136-1139 ISBN: 978-1-5386-8104-6 / 978-1-5386-8105-3 ISSN: 2167-0021 / 2167-0013 DOI: 10.1109/TRANSDUCERS.2019.8808418 |
F. Krach, T. Heckel, L. Frey, A. J. Bauer, T. Erlbacher, M. März: Innovative monolithic RC-snubber for fast switching power modules Proceedings of CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems (cited 5 times), Nuremberg, Germany, März 08, 2016 - März 10, 2016 (VDE - Verlag, 2019) ISBN: 978-3-8007-4171-7 |
M. Kupers, G. Rispens, L. Devaraj, G. Bottiglieri, T. Van Den Hoogenhoff, P. Broman, A. Erdmann, F. Wahlisch: Particle on EUV pellicles, impact on LWR Proceedings of SPIE - The International Society for Optical Engineering, Vol 11147, International Conference on Extreme Ultraviolet Lithography 2019, EUVL, Art. No. 111470S, Monterey, United States, September 16, 2019 - September 19, 2019 (Society of Photo-Optical Instrumentation Engineers (SPIE), Bellingham, 2019) DOI: 10.1117/12.2537103 |
T. Liu, Z. Xu, M. Rommel, F. Fang, H. Wang, Y. Song, Y. Wang: Raman characterization of carrier concentrations of al-implanted 4H-SIC with low carrier concentration by photo-generated carrier effect Crystals, Vol 9 (8), Art. No. 428 (MDPI, 2019) DOI: 10.3390/cryst9080428 |
J. Lorenz, E. Bär, S. Barraud, A. R. Brown, P. Evanschitzky, F. Klüpfel, L. Wang: Process variability - technological challenge and design issue for nanoscale devices Micromachines 10, (1), Art. No. 6, Dezember 23, 2018 (MDPI, 2019) DOI: 10.3390/mi10010006 |
H. Lösch, A. Hirsch, J. Holthausen, L. Peters, B. Xiao, S. Neumeier, M. Schmidt, N. Huittinen: A spectroscopic investigation of Eu3+ incorporation in LnPO4 (Ln = Tb, Gd1-xLux, X = 0.3, 0.5, 0.7, 1) ceramics Frontiers in Chemistry, 7 (FEB), Art. No. 94 edited by Nicholas J. Dacheux (Frontiers in Chemnistry, 2019) DOI: 10.3389/fchem.2019.00094 |
G. Lukin, T. Schneider, M. Förste, M. Barchuk, M. Schimpf, C. Röder, F. Zimmermann, E. Niederschlag, O. Pätzold, F. C. Beyer, D. Rafaja, M. Stelter: Heteroepitaxial growth of GaN on sapphire substrates by high temperature vapor phase epitaxy Journal of Crystal Growth, Vol 524, Art. No. 125185 edited by Thomas F. Kuech (Elsevier Ltd, Amsterdam, 2019) DOI: 10.1016/j.jcrysgro.2019.125185 |
S. Matlok, N. Böttcher, M. Jahn, P. Hörauf, T. Erlbacher, B. Eckardt, M. März: Retrofitting Wide Band Gap Devices to classic Power Modules using Silicon RC Snubbers Proceedings of International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management PCIM Europe, Nuremberg, Germany, Mai 07, 2019 - Mai 09, 2019 VDE - Verlag, ISBN: 978-3-8007-4938-6 |
C. D. Matthus, L. Di Benedetto, M. Kocher, A. J. Bauer, G. D. Licciardo, A. Rubino, T. Erlbacher: Feasibility of 4H-SiC p-i-n Diode for Sensitive Temperature Measurements between 20.5 K and 802 K IEEE Sensors Journal, Vol 19 (8), Art. No. 8604048 (IEEE, 2019) pp. 2871-2878 ISSN: 1530-437X / 1558-1748 DOI: 10.1109/JSEN.2019.2891293 |
C. D. Matthus, A. J. Bauer, L. Frey, T. Erlbacher: Wavelength-selective 4H-SiC UV-sensor array Materials Science in Semiconductor Processing, Vol 90 (cited 2 times) (Elsevier Ltd, 2019) pp. 205-211 ISSN: 1369-8001 DOI: 10.1016/j.mssp.2018.10.019 |
C. D. Matthus, A. J. Bauer, H. Ryssel, L. Frey: Comparative Study of 4H-SiC UV-Sensors with Ion Implanted and Epitaxially Grown p-Emitter Proceedings of 22nd International Conference on Ion Implantation Technology IIT 2018, Würzburg, Germany, September 16, 2018 - September 21, 2018 edited by Volker Häublein, Heiner Ryssel (IEEE, 2019) pp. 110-113 ISBN: 978-1-5386-6828-3 DOI: 10.1109/IIT.2018.8807950 |
C. Medina-Bailon, T. Dutta, F. J. Klüpfel, S. Baurraud, V. Geoprgiev, J. Lorenz, A. Asenov: Scaling-aware TCAD Parameter Extraction Methodology for Mobility Prediction in Tri-gate Nanowire Transistors Proceedings of 2019 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2019), Art. No. 8870556, Udine, Italy, September 04, 2019 - September 06, 2019 (IEEE, 2019) p. 275 DOI: 10.1109/SISPAD.2019.8870556 |
R. Morello, R. Schwarz, E. R. G. Hoedemaekers, F. Habenschaden, R. DI Rienzo, R. Roncella, R. Saletti, B. Rosca, T. Steffenhagen, V. R. H. Lorentz, F. Baronti: Implementation and Test of a 48 v Smart Battery System with Integrated DC/DC Converter 28th IEEE International Symposium on Industrial Electronics ISIE, Art. No. 8781159, Vancouver, Canada, Juni 12, 2019 - Juni 14, 2019 (IEEE, 2019) pp. 2440-2445 ISBN: 978-1-7281-3666-0 / 978-1-7281-3667-7 ISSN: 2163-5145 / 2163-5137 DOI: 10.1109/ISIE.2019.8781159 |
B. Mouawad, J. Licciardo, A. Castellazzi, C. M. Johnson, T. Erlbacher, P. Friedrichs: Low inductance 2.5kV packaging technology for SiC switches Proceedings of CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems (cited 3 times), Nuremberg, Germany, März 08, 2016 - März 10, 2016 (VDE - Verlag, 2019) ISBN: 978-3-8007-4171-7 |
J. Müller, M. Novak, F. Dresel, C. F. Bayer, A. Schletz, M. März, T. Hofmann: Selective Silver Sintering on Organic-Based Circuit Boards Proceedings of International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management PCIM Europe, Nuremberg, Germany, Mai 07, 2019 - Mai 09, 2019 edited by Mesago Messe Frankfurt GmbH (VDE - Verlag, 2019) ISBN: 978-3-8007-4938-6 |
A. Muthumbi, A. Chaware, K. Kim, K. C. Zhou, P. C. Konda, R. Chen, B. Judkewitz, A. Erdmann, B. Kappes, R. Horstmeyer: Learned Sensing: Jointly Optimized Microscope Hardware for Accurate Image Classification Biomedical Optics Express, Vol 10 (12) (OSA Publishing, 2019) pp. 6351-6369 DOI: 10.1364/BOE.10.006351 |
W. Ni, X. Wang, H. Xiao, M. Xu, M. Li, H. Schlichting, T. Erlbacher: 1700V 34mΩ 4H-SiC MOSFET with retrograde doping in junction field-effect transistor region Proceeding of IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC 2019, Art. No. 8754174, Xi'an, China, Juni 12, 2019 - Juni 14, 2019 (IEEE, 2019) ISBN: 978-1-7281-0286-3 / 978-1-7281-0287-0 DOI: 10.1109/EDSSC.2019.8754174 |
R. Öchsner, A. Nuß, C. Lange, A. Rueß: Research Platform: Decentralized Energy System for Sector Coupling Chemical Engineering and Technology, Vol 42, No. 9 (WILEY‐VCH Verlag, Weinheim, 2019) pp. 1886-1894 ISSN: 0930-7516 / 1521-4125 DOI: 10.1002/ceat.201800714 |
L. Ott, B. Schulz, B. Wunder, M. März: Investigation of Stability Issues in Droop-Controlled DC Micro-grids with Intermediate Bus Architecture Proceedings of International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management PCIM Europe, Nuremberg, Germany, Mai 07, 2019 - Mai 09, 2019 edited by Mesago Messe Frankfurt GmbH (VDE - Verlag, 2019) ISBN: 978-3-8007-4938-6 |
N. Pavlicek, S. Vater, C. Liu, J. Y. Loisy, G. Salvatore, F. Mohn, J. Schuderer, A. Apelsmeier, F. Dresel, A. Schletz: Power module platform for automotive reliability requirements 21st Conference (and Exhibition) on Power Electronics and Applications, EPE 2019 ECCE (Energy Conversion Congress and Expo) Europe, Art. No. 8915223, Genova, Italy, September 02, 2019 - September 05, 2019 (IEEE, 2019) DOI: 10.23919/EPE.2019.8915223 |
M. Pfeffer, C. Zängle, A. J. Bauer, G. Schneider, P. Franze: Advanced wafer container contamination control methods and strategies in power device manufacturing Proceedings of IEEE International Symposium on Semiconductor Manufacturing ISSM 2018, Art. No. 8651151, Tokyo, Japan, Dezember 10, 2018 - Dezember 11, 2018 (IEEE, 2019) ISBN: 978-1-5386-6268-7 / 978-1-5386-6269-4 ISSN: 1523-553X DOI: 10.1109/ISSM.2018.8651151 |
V. Philipsen, K. V. Luong, K. Opsomer, L. Souriau, J. Rip, C. Detavernier, A. Erdmann, P. Evanschitzky, C. Laubis, P. Hönicke, V. Solwitsch, E. Hendrickx: Mask absorber development to enable next-generation EUVL Proceedings of SPIE - The International Society for Optical Engineering, Vol 11178, 26th Symposium on Photomask and Next-Generation Lithography Mask Technology, Photomask, Art. No. 111780F (cited 2 times), Yokohama, Japan, April 16, 2019 - April 18, 2019 (Society of Photo-Optical Instrumentation Engineers (SPIE), Bellingham, 2019) DOI: 10.1117/12.2537967 |
P. Pichler, T. Śledziewski, V. Häublein, A. J. Bauer, T. Erlbacher: Channeling in 4H-SiC from an application point of view Materials Science Forum, Vol 963 edited by Peter M. Gammon, et al. (Trans Tech Publications, 2019) pp. 386-389 ISBN: 978-3-0357-1332-9 / 978-3-0357-2332-8 / 978-3-0357-3332-7 DOI: 10.4028/www.scientific.net/MSF.963.386 |
P. Puls, C. Lange, R. Öchsner: Hybrid Cooling Towers in a Free-Cooling Application: Modeling and Field Measurement Verification Chemical Engineering and Technology, Vol 42, No. 9 (WILEY‐VCH Verlag, Weinheim, 2019) pp. 1871-1878 DOI: 10.1002/ceat.201800712 |
G. Rattmann, P. Pichler, T. Erlbacher: On a Novel Source Technology for Deep Aluminum Diffusion for Silicon Power Electronics Physica Status Solidi (A) Applications and Materials Science, 216 (17), Art. No. 1900167 (WILEY‐VCH Verlag, Weinheim, 2019) DOI: 10.1002/pssa.201900167 |
C. Rettner, A. Apelsmeier, G. Jacob, M. März, M. Schiedermeier: Voltage ripple analysis based on DC-link current harmonics for Voltage Source Inverters Proceedings of 20th Workshop on Control and Modeling for Power Electronics (IEEE COMPEL 2019), Toronto, Canada, Juni 17, 2019 - Juni 20, 2019 (IEEE, 2019) ISBN: 978-1-7281-1843-7 DOI: 10.1109/COMPEL.2019.8769623 |
L. Rochlitz, M. Steinberger, R. Oechsner, A. Weber, S. Schmitz, K. Schillinger, M. Wolff, A. Bayler: Second use or recycling of hydrogen waste gas from the semiconductor industry - Economic analysis and technical demonstration of possible pathways International Journal of Hydrogen Energy, Vol 44 (31) (Elsevier Ltd, 2019) pp. 17168-17184 ISSN: 0360-3199 DOI: 10.1016/j.ijhydene.2019.05.009 |
B. Ruccius, T. Kraus, R. Westermann, T. Heckel, M. März, B. Wagner: A Cascaded Control Concept for Modular Multilevel Converters with Capacitor Voltage Estimation using a Kalman Filter Proceedings of ICPE 2019 - ECCE Asia - 10th International Conference on Power Electronics - ECCE Asia, Art. No. 8796897, Busan, South Korea, Mai 27, 2019 - Mai 30, 2019 (IEEE, 2019) pp. 1198-1204 ISBN: 978-89-5708-313-0 / 978-1-7281-1612-9 ISSN: 2150-6086 / 2150-6078 |
O. Rusch, J. Moult, T. Erlbacher: Influence of trench design on the electrical properties of 650v 4H-SIC JBS diodes Materials Science Forum, Vol 963 (Trans Tech Publications, 2019) pp. 549-552 DOI: 10.4028/www.scientific.net/MSF.963.549 |
S. Saponara, G. Ciarpi, T. Erlbacher, G. Rattman: Integrated Passive Devices and Switching Circuit Design for a 3D DC/DC Converter up to 60 V Journal of Circuits, Systems and Computers (World Scientific Publishing, 2019) ISSN: 0218-1266 / 1793-6454 DOI: 10.1142/S0218126620500395 |
M. Schellenberger, V. R. H. Lorentz, B. Eckardt: Cognitive Power Electronics 4.0 – So treffen leistungselektronische Schaltungen intelligente Entscheidungen elektronik journal, April 2019 (Hüthig , Heidelberg, 2019) pp. 48-51 |
M. Schiedermeier, C. Rettner, M. Heilmann, F. Schneider, M. März: Interference of Automotive HV-DC Systems by Traction Voltage-Source-Inverters (VSI) iTEC India 2019 International Transportation Electrification Conference, Bangalore, India, Dezember 17, 2019 - Dezember 19, 2019 |
H. Schlichting, T. Śledziewski, A. J. Bauer, T. Erlbacher: Design considerations for robust manufacturing and high yield of 1.2 kv 4H-SIC VDMOS transistors Materials Science Forum, Vol 963 / Silicon Carbide and Related Materials 2018 : Selected papers from the 12th European Conference on Silicon Carbide and Related Materials ECSCRM 2018, Birmingham, UK, September 02, 2018 - September 06, 2018 (Trans Tech Publications, Birmingham, 2019) pp. 763-767 DOI: 10.4028/www.scientific.net/MSF.963.763 |
T. Schriefer, M. Hofmann: A hybrid frequency-time-domain approach to determine the vibration fatigue life of electronic devices Microelectronics Reliability, Vol 98 (Elsevier Ltd, 2019) pp. 86-94 ISSN: 0026-2714 DOI: 10.1016/j.microrel.2019.04.001 |
T. Schriefer, N. Schreibmüller, C. Horwath, W. Moritz, N. Moosmann, A. Dreibert, T. Gerberich, K. Schaumberger, H. Rauh, M. Hofmann, T. Nusser, F. Kaufmann, M. Schmidt: Serienfähige Hochstromkontakte für integrierte elektrische Fahrzeugantriebe wt-online, Vol 5-2019 (VDI Fachmedien, 2019) pp. 335-441 |
T. Schriefer, M. Hofmann, H. Rauh, B. Eckardt, M. März: Parameter Study on the Electrical Contact Resistance of Axially Canted Coil Springs for High-current Systems Electrical Contacts, Proceedings of the 65th Holm Conference on Electrical Contacts, Milwaukee, USA, September 14, 2019 - September 18, 2019 (IEEE, 2019) pp. 235-241 ISBN: 978-1-5386-6315-8 / 978-1-5386-6316-5 ISSN: 2158-9992 / 1062-6808 DOI: 10.1109/HOLM.2018.8611640 |
T. Schriefer, M. Hofmann: Mechanical reliability of power electronic systems Proceedings of CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems, Nuremberg, Germany, März 08, 2016 - März 10, 2016 (VDE - Verlag, 2019) ISBN: 978-3-8007-4171-7 |
M. S. Schulz, S. Ditze, M. Diller, Y. Han, M. März: An isolated bidirectional half-bridge active-clamp current-fed push-pull DC/DC converter for DC microgrid applications 21st Conference (and Exhibition) on Power Electronics and Applications, EPE 2019 ECCE (Energy Conversion Congress and Expo) Europe, Art. No. 8914806, Genova, Italy, September 02, 2019 - September 05, 2019 (IEEE, 2019) DOI: 10.23919/EPE.2019.8914806 |
M. S. Schulz, J. Kaiser, K. Gosses, R. Conz, M. März: Bidirectional Bipolar Electronic Overcurrent Safety Element for Bipolar DC Grids Proceedings of International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management PCIM Europe, Nuremberg, Germany, Mai 07, 2019 - Mai 09, 2019 edited by Mesago Messe Frankfurt GmbH (VDE - Verlag, 2019) pp. 1290-1299 ISBN: 978-3-8007-4938-6 |
M. S. Schulz, M. Wild, R. Chacon, B. Wunder, M. März: A bidirectional and isolated DC/DC converter connecting mobile battery systems to a DC grid in commercial buildings Proceedings of 4th IEEE International Future Energy Electronics Conference 2019, Singapore, China, November 25, 2019 - November 28, 2019 (IEEE, 2019) ISBN: 978-1-7281-3153-5 |
S. Schwanke, M. Trempa, C. Reimann, M. Kuczynski, G. Schroll, J. Sans, J. Friedrich: Production of high performance multi-crystalline silicon ingots for PV application by using contamination-free SixNy seed particles Journal of Crystal Growth, Vol 522 edited by Thomas F. Kuech (Elsevier Ltd, Amsterdam, 2019) pp. 151-159 ISSN: 0022-0248 DOI: 10.1016/j.jcrysgro.2019.05.030 |
T. Śledziewski, T. Erlbacher, A. J. Bauer, L. Frey, X. Chen, Y. Zhao, C. Li, X. Dai: Comparison between NI-SALICIDE and self-aligned lift-off used in fabrication of ohmic contacts for sic power MOSFET Materials Science Forum, Vol 963 (Trans Tech Publications, 2019) pp. 490-493 DOI: 10.4028/www.scientific.net/MSF.963.490 |
Y. Song, Z. Xu, A. Rosenkranz, M. Rommel, C. Shi, F. Fang: Surface-enhanced Raman scattering on nanodiamond-derived carbon onions Nami Jishu yu Jingmi Gongcheng / Nanotechnology and Precision Engineering 2 (1) (KeAi Publishing, 2019) pp. 35-39 DOI: 10.1016/j.npe.2019.03.005 |
L. Stockmeier, C. Kranert, P. Fischer, B. Epelbaum, C. Reimann, J. Friedrich, G. Raming, A. Miller: Analysis of the geometry of the growth ridges and correlation to the thermal gradient during growth of silicon crystals by the Czochralski-method Journal of Crystal Growth, Vol 515 (cited 1 time) edited by Thomas F. Kuech (Elsevier Ltd, Amsterdam, 2019) pp. 26-31 ISSN: 0022-0248 DOI: 10.1016/j.jcrysgro.2019.03.009 |
T. Stolzke, S. Ehrlich, C. Joffe, M. März: Comprehensive accuracy examination of electrical power loss measurements of inductive components for frequencies up to 1 MHz Journal of Magnetism and Magnetic Materials, Vol 497, Art. No. 166022 (Elsevier Ltd, 2019) DOI: 10.1016/j.jmmm.2019.166022 |
C. Strobl, H. Kopf, R. Mehl, L. Ott, J. Kaiser, M. Schafer, R. Rabenstein: Safety concepts and circuit protection for LVDC-Grids in datacenters and in telecommunications Proceedings of INTELEC 2018, IEEE International Telecommunications Energy Conference, Art. No. 8612360, Torino, Italy, Oktober 07, 2018 - Oktober 11, 2018 (IEEE, 2019) ISBN: 978-1-5386-5370-8 / 978-1-5386-5371-5 ISSN: 0275-0473 / 2158-5210 DOI: 10.1109/INTLEC.2018.8612360 |
Y. Tao, T. Sorgenfrei, T. Jauß, A. Cröll, C. Reimann, J. Friedrich, J. J. Derby: Erratum: Particle engulfment dynamics under oscillating crystal growth conditions Crystal Growth 468, Vol 24-27, 2017 Journal of Crystal Growth, Vol 522 edited by Thomas F. Kuech (Elsevier Ltd, Amsterdam, 2019) p. 235 ISSN: 0022-0248 DOI: 10.1016/j.jcrysgro.2019.05.033 |
M. Trempa, C. Kranert, I. Kupka, C. Reimann, J. Friedrich: Evaluation of improvement strategies of grain structure properties in high performance multi-crystalline silicon ingots Journal of Crystal Growth, Vol 514 edited by Thomas F. Kuech (Elsevier Ltd, Amsterdam, 2019) pp. 144-123 ISSN: 0022-0248 DOI: 10.1016/j.jcrysgro.2019.03.005 |
U. Waltrich, B. Ruccius, D. Malipaard, A. Schletz, M. März: Dimensioning of a novel design concept for MMC submodules Proceedings of CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems, Nuremberg, Germany, März 08, 2016 - März 10, 2016 (VDE - Verlag, 2019) ISBN: 978-3-8007-4171-7 |
X. Wang, Z. Xu, M. Rommel, B. Dong, L. Song, C. A. TH Tee, F. Fang: Electron paramagnetic resonance characterization of aluminum ion implantation induced defects in 4H-SiC Nanotechnology and Precision Engineering 2 (KeAi Publishing, 2019) pp. 157-162 |
J. Weiße, M. Hauk, M. Krieger, A. J. Bauer, T. Erlbacher: Aluminum acceptor activation and charge compensation in implanted p-type 4H-SiC AIP Advances, Vol 9 (5), Art. No. 55308 (AIP Publishing, Melville, 2019) ISSN: 2158-3226 DOI: 10.1063/1.5096440 |
J. Weiße, M. Hauk, M. Krieger, A. J. Bauer, T. Erlbacher: Erratum: Aluminum acceptor activation and charge compensation in implanted p-type 4H-SiC AIP Advances, Vol 9 (7), Art. No. 79901 (AIP Publishing, 2019) DOI: 10.1063/1.5118666 |
J. Weiße, H. Mitlehner, L. Frey, T. Erlbacher: Design of a 4H-SiC RESURF n-LDMOS Transistor for High Voltage Integrated Circuits Materials Science Forum, Vol 963 / Silicon Carbide and Related Materials 2018 : Selected papers from the 12th European Conference on Silicon Carbide and Related Materials ECSCRM 2018, Birmingham, UK, September 02, 2018 - September 06, 2018 (Trans Tech Publications, Birmingham, 2019) pp. 629-632 DOI: 10.4028/www.scientific.net/MSF.963.629 |
J. Weiße, M. Hauk, M. Krieger, J. Erlekampf, H. Mitlehner, A. J. Bauer, M. Rommel, V. Häublein, T. Erlbacher, C. Csato, M. Rüb, S. Akhmadaliev, L. Frey: Impact of Al-ion implantation on the formation of deep defects in n-type 4H-SiC Proceedings of 22nd International Conference on Ion Implantation Technology IIT 2018, Würzburg, Germany, September 18, 2018 - September 23, 2018 edited by Volker Häublein, Heiner Ryssel (IEEE, 2019) pp. 66-69 ISBN: 978-1-5386-6828-3 DOI: 10.1109/IIT.2018.8807980 |
J. Weiße, M. Hauk, T. Śledziewski, M. Krieger, A. J. Bauer, H. Mitlehner, L. Frey, T. Erlbacher: On the origin of charge compensation in aluminum-implanted n-type 4H-SiC by analysis of hall effect measurements Materials Science Forum, Vol 963 (Trans Tech Publications, 2019) pp. 433-436 DOI: 10.4028/www.scientific.net/MSF.963.433 |
Z. W. Xu, Y. Song, M. Rommel, T. Liu, M. Kocher, Z. D. He, H. Wang, B. T. Yao, L. Liu, F. Z. Fang: Raman spectroscopy characterization of ion implanted 4H-SiC and its annealing effects Materials Science Forum, Vol 963 (cited 1 time) (Trans Tech Publications, 2019) pp. 424-428 ISBN: 978-3-0357-1332-9 / 978-3-0357-2332-8 / 978-3-0357-3332-7 DOI: 10.4028/www.scientific.net/MSF.963.424 |
Z. Yu, S. Wang, S. A. Letz, C. F. Bayer, F. Häusler, A. Schletz, K. Suganuma: Optimization of Ag-Ag Direct Bonding for Wafer-Level Power Electronics Packaging via Design of Experiments Proceedings of International Conference on Electronics Packaging, ICEP, Art. No. 8733496, Niigata, Japan, April 17, 2019 - April 20, 2019 (IEEE, 2019) pp. 229-234 ISBN: 978-4-9902-1887-4 / 978-1-7281-1710-2 DOI: 10.23919/ICEP.2019.8733496 |
T. Zorenko, K. Paprocki, I. Levchuk, M. Batentschuk, B. Epelbaum, A. Fedorov, Y. Zorenko: Luminescent properties of Ce3+ doped LiLuP4O12 tetraphosphate under synchrotron radiation excitation Journal of Luminescence, Vol 210 (Elsevier Ltd, 2019) pp. 47-51 ISSN: 0022-2313 DOI: 10.1016/j.jlumin.2019.02.016 |