The use of power electronics in challenging fields of application – such as electric vehicles or aerospace – implies high requirements concerning switching speed and reliability. In this context, conventional packaging technologies are often pushed to their limits. Scientists at Fraunhofer IISB have developed a novel packaging concept and technologies by embedding power semiconductor devices into ceramic circuit carriers. Their design offers high temperature stability, operation at high voltages, and hermetic sealing to provide maximum lifetime in harsh environments. This helps to fully exploit the great advantages of wide-bandgap semiconductors (WBG). Power modules based on this new approach are presented by Fraunhofer IISB at this year’s PCIM Europe exhibition in May 2019 in Nuremberg.